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公开(公告)号:US20200241084A1
公开(公告)日:2020-07-30
申请号:US16851473
申请日:2020-04-17
Applicant: Allegro MicroSystems, LLC
Inventor: Alexander Latham , Michael C. Doogue , Jason Boudreau
IPC: G01R33/00 , G01R33/025 , G01R33/032 , G01R33/12 , G01N27/90 , H01F5/00
Abstract: An apparatus comprises a first substrate and two coils supported by the first substrate and arranged next to each other, the coils configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils. One or more magnetic field sensing elements are positioned in the area between the coils and configured to detect the reflected magnetic field.
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公开(公告)号:US10571301B2
公开(公告)日:2020-02-25
申请号:US15655400
申请日:2017-07-20
Applicant: Allegro MicroSystems, LLC
Inventor: Michael C. Doogue , P. Karl Scheller
Abstract: In one aspect, an integrated circuit (IC) includes a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure. The magnetic field sensor includes at least two magnetic field sensing elements configured to sense changes in a magnetic field caused by rotation of the magnetic structure. The IC also includes an output port configured to provide an output signal of the magnetic field sensor. The frequency of the output signal indicates the speed and the direction or indicates a fault.
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公开(公告)号:US20190285667A1
公开(公告)日:2019-09-19
申请号:US16421982
申请日:2019-05-24
Applicant: Allegro MicroSystems, LLC
Inventor: Shaun D. Milano , Bryan Cadugan , Michael C. Doogue , Alexander Latham , William P. Taylor , Harianto Wong , Sundar Chetlur
Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.
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公开(公告)号:US10310028B2
公开(公告)日:2019-06-04
申请号:US15606362
申请日:2017-05-26
Applicant: Allegro MicroSystems, LLC , COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES
Inventor: Alexander Latham , Michael C. Doogue , Claude Fermon , Xavier Du Hamel De Milly , Myriam Pannetier-Lecoeur
Abstract: A pressure sensor includes a chamber comprising a conductive portion and a deformable portion coupled to the conductive portion and susceptible to deformation in response to a pressure differential between an interior of the chamber and an exterior of the chamber; at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element disposed proximate to the at least one coil and to the conductive portion of the chamber and configured to generate a magnetic field signal in response to a reflected magnetic field generated by the at least one coil and reflected by the conductive portion; and a circuit coupled to the at least one magnetic field sensing element to generate an output signal of the pressure sensor indicative of the pressure differential between the interior of the chamber and the exterior of the chamber in response to the magnetic field signal.
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公开(公告)号:US20190067562A1
公开(公告)日:2019-02-28
申请号:US15689185
申请日:2017-08-29
Applicant: Allegro MicroSystems, LLC
Inventor: Sundar Chetlur , Harianto Wong , Maxim Klebanov , William P. Taylor , Michael C. Doogue
IPC: H01L43/06 , H01L43/04 , H01L43/08 , H01L43/14 , H01L25/065
Abstract: Methods and apparatus for a signal isolator having a dielectric interposer supporting first and second die each having a magnetic field sensing element. A first signal path extends from the first die to the second die and a second signal path extends from the second die to the first die. In embodiments, the first signal path is located in the interposer and includes a first coil to generate a magnetic field and the second signal path is located in the interposer and includes a second coil to generate a magnetic filed. The first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.
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公开(公告)号:US20190049527A1
公开(公告)日:2019-02-14
申请号:US16165464
申请日:2018-10-19
Applicant: Allegro MicroSystems, LLC
Inventor: Ravi Vig , William P. Taylor , Andreas P. Friedrich , Paul A. David , Marie-Adelaide Lo , Eric Burdette , Eric G. Shoemaker , Michael C. Doogue
Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.
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公开(公告)号:US20180340987A1
公开(公告)日:2018-11-29
申请号:US15606262
申请日:2017-05-26
Applicant: Allegro MicroSystems, LLC
Inventor: Alexander Latham , Michael C. Doogue , Jason Boudreau
IPC: G01R33/00 , G01R33/025 , H01F5/04
CPC classification number: G01R33/0094 , G01R33/0005 , G01R33/0011 , G01R33/0017 , G01R33/0029 , G01R33/025 , G01R33/032 , G01R33/1284 , H01F5/04
Abstract: An apparatus comprises one or more substrates and one or more coils. At least one of the coils is configured to produce a first magnetic field that induces eddy currents in a conductive target, which generates a reflected magnetic field. One or more magnetic field sensing elements supported by the one or more substrates detect the reflected magnetic field. A conductive support structure supports the one or more substrates. The support structure includes a gap in an area adjacent to the one or more coils so that the support structure does not generate a reflected magnetic field in response to the first magnetic field.
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公开(公告)号:US10073136B2
公开(公告)日:2018-09-11
申请号:US14578789
申请日:2014-12-22
Applicant: ALLEGRO MICROSYSTEMS, LLC
Inventor: Shaun D. Milano , Georges El Bacha , Michael C. Doogue , William P. Taylor
IPC: G01R33/06 , G01R31/28 , G01R33/00 , G01R31/3187 , G01R33/02 , G01R33/07 , G01R33/09 , G01R35/00
Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element having differential first and second outputs and an input, the input to receive current and first and second switches coupled to a respective one of the differential first and second outputs. A first voltage source is coupled between the first and second switches, the first and second switches having a first state in which the first voltage source is coupled across the differential first and second outputs, and an IC output can output a voltage corresponding to the first voltage source when the first and second switches are in the first state for monitoring operation of a signal path from the magnetic sensing element to the IC output.
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公开(公告)号:US09859489B2
公开(公告)日:2018-01-02
申请号:US14707319
申请日:2015-05-08
Applicant: Allegro MicroSystems, LLC
Inventor: Michael C. Doogue , William P. Taylor , Vijay Mangtani
IPC: H01L29/82 , H01L43/08 , H01L43/04 , B82Y25/00 , G01R15/20 , G01R33/02 , G01R33/07 , G01R33/09 , H01L25/16 , G01R33/06 , H01L43/06 , G01R15/08
CPC classification number: H01L43/02 , B82Y25/00 , G01R15/08 , G01R15/207 , G01R33/02 , G01R33/06 , G01R33/07 , G01R33/09 , G01R33/093 , H01L23/49541 , H01L25/162 , H01L43/04 , H01L43/065 , H01L43/08 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
Abstract: An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
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公开(公告)号:US20170161218A1
公开(公告)日:2017-06-08
申请号:US14960654
申请日:2015-12-07
Applicant: Allegro Microsystems, LLC
Inventor: Jesse Lapomardo , Craig S. Petrie , Matthew Regan , Michael C. Doogue
CPC classification number: G06F13/36 , G06F13/4068 , G06F13/4282
Abstract: Described embodiments provide a device configured to be coupled to a shared bus. The device includes a magnetic field sensing element to sense a magnetic field. Upon receiving a configuration command over the shared bus, the device determines whether a parameter of the sensed magnetic field meets a predetermined criteria. If the parameter of the sensed magnetic field meets the predetermined criteria, the device responds to the configuration command by applying one or more configuration settings. Otherwise, if the parameter of the sensed magnetic field does not meet the predetermined criteria, the device ignores the configuration command.
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