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    Current sensor integrated circuits
    1.
    发明授权
    Current sensor integrated circuits 有权

    公开(公告)号：US11519939B2

    公开(公告)日：2022-12-06

    申请号：US17472769

    申请日：2021-09-13

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: H01L21/44 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    CURRENT SENSOR INTEGRATED CIRCUITS
    2.
    发明申请
    CURRENT SENSOR INTEGRATED CIRCUITS 有权

    公开(公告)号：US20210405092A1

    公开(公告)日：2021-12-30

    申请号：US17472769

    申请日：2021-09-13

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    Current sensor integrated circuits
    3.
    发明授权
    Current sensor integrated circuits 有权

    公开(公告)号：US11150273B2

    公开(公告)日：2021-10-19

    申请号：US16884311

    申请日：2020-05-27

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: H01L23/495 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    Methods and Apparatus for Sensor Diagnostics
    6.
    发明申请
    Methods and Apparatus for Sensor Diagnostics 审中-公开
    传感器诊断方法和设备

    公开(公告)号：US20150185293A1

    公开(公告)日：2015-07-02

    申请号：US14578800

    申请日：2014-12-22

    Applicant: ALLEGRO MICROSYSTEMS, LLC

    Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  David J. Haas ,  Gregory Delmain ,  Michael Gaboury ,  William P. Taylor

    IPC: G01R33/00 ,  G01R33/07 ,  G01R33/09 ,  G01R35/00

    Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

    Abstract translation: 用于提供具有驱动电流源，耦合到驱动电流源的磁感测元件，具有第一和第二差分输出的磁感测元件以及第一和第二电流元件的集成电路的方法和装置，以提供相对于 驱动电流源，其中所述第一电流元件耦合到所述第一差分输出，并且所述第二电流元件耦合到所述第二差分输出。 在说明性实施例中，IC输出可以输出对应于第一和第二电流元件的电流的电压。

    CURRENT SENSOR INTEGRATED CIRCUITS
    8.
    发明申请
    CURRENT SENSOR INTEGRATED CIRCUITS 有权

    公开(公告)号：US20210223292A1

    公开(公告)日：2021-07-22

    申请号：US16884311

    申请日：2020-05-27

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: G01R15/08 ,  H01L43/06 ,  H01L43/04

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

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