公开(公告)号：US11183436B2

公开(公告)日：2021-11-23

申请号：US16746275

申请日：2020-01-17

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Natasha Healey ,  Rishikesh Nikam

IPC: H01L23/495 ,  H01L23/31 ,  H01L27/07

Abstract: A power integrated circuit (IC) includes a lead frame comprising a signal lead, a power lead, and a paddle attached to one or more of the signal lead and the power lead, an electrical component supported by the paddle, and a mold material configured to enclose a portion of the lead frame and expose a surface of the paddle, wherein the power lead has a first portion extending from an edge of the mold material outside of the mold material in a first direction and a second portion enclosed by the mold material and extending from the edge of the mold material inside the mold material in a second direction to the paddle, wherein the second direction is substantially opposite to the first direction. In embodiments, the paddle is only attached to the second portion of the power lead. The first and second portions of the power lead meet at a junction between a first portion of the mold material and a second portion of the mold material, the junction positioned on a side surface of the mold material that extends from a first surface to a substantially parallel second surface of the mold material.

公开(公告)号：US11768229B2

公开(公告)日：2023-09-26

申请号：US17654254

申请日：2022-03-10

Applicant: Allegro MicroSystems, LLC

Inventor： Bradley Boden ,  Rishikesh Nikam ,  Robert A. Briano

IPC: G01R15/20 ,  G01R19/252

CPC classification number: G01R15/202 ,  G01R15/207 ,  G01R19/252

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

公开(公告)号：US20230058695A1

公开(公告)日：2023-02-23

申请号：US17654254

申请日：2022-03-10

Applicant: Allegro MicroSystems, LLC

Inventor： Bradley Boden ,  Rishikesh Nikam ,  Robert A. Briano

IPC: G01R15/20 ,  G01R19/252

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

公开(公告)号：US20210223292A1

公开(公告)日：2021-07-22

申请号：US16884311

申请日：2020-05-27

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: G01R15/08 ,  H01L43/06 ,  H01L43/04

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

公开(公告)号：US11519939B2

公开(公告)日：2022-12-06

申请号：US17472769

申请日：2021-09-13

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: H01L21/44 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

公开(公告)号：US20210405092A1

公开(公告)日：2021-12-30

申请号：US17472769

申请日：2021-09-13

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: G01R15/08 ,  H01L43/04 ,  H01L43/06

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

公开(公告)号：US11150273B2

公开(公告)日：2021-10-19

申请号：US16884311

申请日：2020-05-27

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: H01L23/495 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

公开(公告)号：US20210225721A1

公开(公告)日：2021-07-22

申请号：US16746275

申请日：2020-01-17

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Natasha Healey ,  Rishikesh Nikam

IPC: H01L23/31 ,  H01L23/495 ,  H01L27/07

Abstract: A power integrated circuit (IC) includes a lead frame comprising a signal lead, a power lead, and a paddle attached to one or more of the signal lead and the power lead, an electrical component supported by the paddle, and a mold material configured to enclose a portion of the lead frame and expose a surface of the paddle, wherein the power lead has a first portion extending from an edge of the mold material outside of the mold material in a first direction and a second portion enclosed by the mold material and extending from the edge of the mold material inside the mold material in a second direction to the paddle, wherein the second direction is substantially opposite to the first direction. In embodiments, the paddle is only attached to the second portion of the power lead. The first and second portions of the power lead meet at a junction between a first portion of the mold material and a second portion of the mold material, the junction positioned on a side surface of the mold material that extends from a first surface to a substantially parallel second surface of the mold material.