High temperature atomic layer deposition of silicon oxide thin films

    公开(公告)号:US10242864B2

    公开(公告)日:2019-03-26

    申请号:US15248214

    申请日:2016-08-26

    Abstract: Atomic layer deposition (ALD) process formation of silicon oxide with temperature >500° C. is disclosed. Silicon precursors used have a formula of: R1R2mSi(NR3R4)nXp  I. wherein R1, R2, and R3 are each independently selected from hydrogen, a linear or branched C1 to C10 alkyl group, and a C6 to C10 aryl group; R4 is selected from, a linear or branched C1 to C10 alkyl group, and a C6 to C10 aryl group, a C3 to C10 alkylsilyl group; wherein R3 and R4 are linked to form a cyclic ring structure or R3 and R4 are not linked to form a cyclic ring structure; X is a halide selected from the group consisting of Cl, Br and I; m is 0 to 3; n is 0, 1 or 2; and p is 0, 1 or 2 and m+n+p=3; and R1R2mSi(OR3)n(OR4)qXp  II. wherein R1 and R2 are each independently selected from hydrogen, a linear or branched C1 to C10 alkyl group, and a C6 to C10 aryl group; R3 and R4 are each independently selected from a linear or branched C1 to C10 alkyl group, and a C6 to C10 aryl group; wherein R3 and R4 are linked to form a cyclic ring structure or R3 and R4 are not linked to form a cyclic ring structure; X is a halide atom selected from the group consisting of Cl, Br and I; m is 0 to 3; n is 0 to 2; q is 0 to 2; p is 0 to 2; and m+n+q+p=3.

    Alkoxysilylamine compounds and applications thereof

    公开(公告)号:US10279959B2

    公开(公告)日:2019-05-07

    申请号:US14096388

    申请日:2013-12-04

    Abstract: Described herein are alkoxysilylamine precursors having the following Formulae A and B: wherein R1 and R4 are independently selected from a linear or branched C1 to C10 alkyl group, a C3 to C12 alkenyl group, a C3 to C12 alkynyl group, a C4 to C10 cyclic alkyl group, and a C6 to C10 aryl group and wherein R2, R3, R4, R5, and R6 are independently selected from the group consisting of hydrogen, a linear or branched C1 to C10 alkyl group, a C2 to C12 alkenyl group, a C2 to C12 alkynyl group, a C4 to C10 cyclic alkyl, a C6 to C10 aryl group, and a linear or branched C1 to C10 alkoxy group. Also described herein are deposition processes using at least one precursor have Formulae A and/or B described herein.

    Compositions and Processes for Depositing Carbon-Doped Silicon-Containing Films
    5.
    发明申请
    Compositions and Processes for Depositing Carbon-Doped Silicon-Containing Films 审中-公开
    用于沉积碳掺杂的含硅膜的组合物和方法

    公开(公告)号:US20160351389A1

    公开(公告)日:2016-12-01

    申请号:US15233018

    申请日:2016-08-10

    Abstract: Described herein are compositions for depositing a carbon-doped silicon containing film wherein the composition comprises a first precursor comprising at least one compound selected from the group consisting of: an organoaminoalkylsilane having a formula of R5Si(NR3R4)xH3-x wherein x=1, 2, 3; an organoalkoxyalkylsilane having a formula of R6Si(OR7)xH3-x wherein x=1, 2, 3; an organoaminosilane having a formula of R8N(SiR9(NR10R11)H)2; an organoaminosilane having a formula of R8N(SiR9LH)2 and combinations thereof; and optionally a second precursor comprising a compound having the formula: Si(NR1R2)H3. Also described herein are methods for depositing a carbon-doped silicon-containing film using the composition wherein the method is one selected from the following: cyclic chemical vapor deposition (CCVD), atomic layer deposition (ALD), plasma enhanced ALD (PEALD) and plasma enhanced CCVD (PECCVD).

    Abstract translation: 本文描述了用于沉积含碳掺杂硅的膜的组合物,其中组合物包含第一前体,其包含至少一种选自下组的化合物:具有式R 5 Si(NR 3 R 4)x H 3-x的有机氨基烷基硅烷,其中x = 1, 2,3; 具有式R6Si(OR7)xH3-x的有机烷氧基烷基硅烷,其中x = 1,2,3; 具有式R 8 N(SiR 9(NR 10 R 11)H)2的有机氨基硅烷; 具有式R8N(SiR9LH)2的有机氨基硅烷及其组合; 和任选地包含具有下式的化合物的第二前体:Si(NR1R2)H3。 本文还描述了使用该组合物沉积碳掺杂含硅膜的方法,其中所述方法选自以下:循环化学气相沉积(CCVD),原子层沉积(ALD),等离子体增强ALD(PEALD)和 等离子增强CCVD(PECCVD)。

    COMPOSITIONS AND METHODS USING SAME FOR FLOWABLE OXIDE DEPOSITION
    10.
    发明申请
    COMPOSITIONS AND METHODS USING SAME FOR FLOWABLE OXIDE DEPOSITION 审中-公开
    使用相同的可氧化氧化物沉积的组合物和方法

    公开(公告)号:US20150056822A1

    公开(公告)日:2015-02-26

    申请号:US14457397

    申请日:2014-08-12

    Abstract: Described herein are compositions or formulations for forming a film in a semiconductor deposition process, such as without limitation, a flowable chemical vapor deposition of silicon oxide. Also described herein is a method to improve the surface wetting by incorporating an acetylenic alcohol or diol surfactant such as without limitation 3,5-dimethyl-1-hexyn-3-ol, 2,4,7,9-tetramethyl-5-decyn-4,7-diol, 4-ethyl-1-octyn-3-ol, and 2,5-dimethylhexan-2,5-diol, and other related compounds.

    Abstract translation: 本文描述的是用于在半导体沉积工艺中形成膜的组合物或制剂,例如但不限于氧化硅的可流动化学气相沉积。 本文还描述了通过引入炔醇或二醇表面活性剂来改善表面润湿性的方法,例如但不限于3,5-二甲基-1-己炔-3-醇,2,4,7,9-四甲基-5-癸炔 -4,7-二醇,4-乙基-1-辛炔-3-醇和2,5-二甲基己烷-2,5-二醇等相关化合物。

Patent Agency Ranking