Abstract:
An active device array substrate includes: a substrate, a switch device, an inter-layer dielectric layer, an insulation bump, a conductive layer, and a pixel electrode. The switch device is located on the substrate. The inter-layer dielectric layer is located on the switch device, and the inter-layer dielectric layer has at least one opening, where the opening does not cover at least one part of a drain electrode of the switch device. The insulation bump covers at least partially the opening. The conductive layer is located on a top surface and a side wall of the insulation bump, and is electrically connected to the drain electrode of the switch device through the opening. The pixel electrode is electrically connected to the conductive layer.
Abstract:
A display panel includes a plurality of sub-pixels, scanning lines and data lines. The sub-pixels are disposed on a first substrate and include a plurality of rows and columns, and each sub-pixel of a first row of two adjoining rows is shifted by a predetermined distance along a first direction with respect to each sub-pixel of a second row of two adjoining rows. The scanning lines extend in the first direction and corresponding to the sub-pixels of the rows respectively. Each data line includes a plurality of first data segments and second data segments connected alternately. The first data segment extends along a second direction and partially overlaps the scanning line in a vertical direction. Each second data segment is disposed on one side of the scanning line, and at least a portion of the second data segments extends along a third direction different from the first and second directions.
Abstract:
A method for fabricating a pixel structure includes the following steps. A patterned semiconductor layer, an insulation layer, and a patterned metal layer are formed on a substrate sequentially. A first inter-layer dielectric (ILD) layer is formed to cover the patterned metal layer. A low temperature annealing process is performed after forming the first ILD layer. A hydrogen plasma treatment process is performed after the low temperature annealing process. A second ILD layer is formed to cover the first ILD layer after the hydrogen plasma treatment process. A third ILD layer is formed to cover the second ILD layer. A source electrode and a drain electrode are formed on the third ILD layer. A passivation layer is formed on the source electrode and the drain electrode. A pixel electrode is formed on the passivation layer. A pixel structure manufactured by the above-mentioned method is also provided.
Abstract:
A display panel includes a plurality of sub-pixels, scanning lines and data lines. The sub-pixels are disposed on a first substrate and include a plurality of rows and columns, and each sub-pixel of a first row of two adjoining rows is shifted by a predetermined distance along a first direction with respect to each sub-pixel of a second row of two adjoining rows. The scanning lines extend in the first direction and corresponding to the sub-pixels of the rows respectively. Each data line includes a plurality of first data segments and second data segments connected alternately. The first data segment extends along a second direction and partially overlaps the scanning line in a vertical direction. Each second data segment is disposed on one side of the scanning line, and at least a portion of the second data segments extends along a third direction different from the first and second directions.
Abstract:
A liquid crystal display panel includes a first substrate, a second substrate, at least one liquid crystal layer, a first pixel array and a second pixel array. The liquid crystal layer is interposed between the first substrate and the second substrate. The first pixel array is disposed in a first display region of the first substrate, where the first pixel array includes a plurality of first transmissive sub-pixels arranged in columns and rows and disposed adjacent to each other. The second pixel array is disposed in a second display region of the first substrate, and the second pixel array includes a plurality of reflective sub-pixels arranged in columns and rows.
Abstract:
A method for fabricating a pixel structure includes the following steps. A patterned semiconductor layer, an insulation layer, and a patterned metal layer are formed on a substrate sequentially. A first inter-layer dielectric (ILD) layer is formed to cover the patterned metal layer. A low temperature annealing process is performed after forming the first ILD layer. A hydrogen plasma treatment process is performed after the low temperature annealing process. A second ILD layer is formed to cover the first ILD layer after the hydrogen plasma treatment process. A third ILD layer is formed to cover the second ILD layer. A source electrode and a drain electrode are formed on the third ILD layer. A passivation layer is formed on the source electrode and the drain electrode. A pixel electrode is formed on the passivation layer. A pixel structure manufactured by the above-mentioned method is also provided.
Abstract:
A method for manufacturing an active device array substrate includes providing a flexible substrate having a transistor region and a transparent region; forming a gate electrode on the transistor region; sequentially forming a dielectric layer and a semiconductor layer to cover the gate electrode and the flexible substrate; removing a part of the semiconductor layer to form a channel layer above the gate electrode and removing a thickness of the dielectric layer disposed on the transparent region, such that a portion of the dielectric layer on the gate electrode has a first thickness, and another portion of the dielectric layer on the transparent region has a second thickness less than the first thickness; respectively forming a source electrode and a drain electrode on opposite sides of the channel layer; and forming a pixel electrode electrically connected to the drain electrode.
Abstract:
An active device array substrate includes: a substrate, a switch device, an inter-layer dielectric layer, an insulation bump, a conductive layer, and a pixel electrode. The switch device is located on the substrate. The inter-layer dielectric layer is located on the switch device, and the inter-layer dielectric layer has at least one opening, where the opening does not cover at least one part of a drain electrode of the switch device. The insulation bump covers at least partially the opening. The conductive layer is located on a top surface and a side wall of the insulation bump, and is electrically connected to the drain electrode of the switch device through the opening. The pixel electrode is electrically connected to the conductive layer.
Abstract:
A pixel structure includes a substrate, a patterned semiconductor layer, an insulation layer, a gate electrode, a first inter-layer dielectric (ILD) layer, a second ILD layer, a third ILD layer, a source electrode and a drain electrode. The patterned semiconductor layer is disposed on the substrate. The insulation layer is disposed on the patterned semiconductor layer. The gate electrode is disposed on the insulation layer. The first ILD layer is disposed on the gate electrode, the second ILD layer is disposed on the first ILD layer, and the third ILD layer is disposed on the second ILD layer. The source electrode and the drain electrode are disposed on the third ILD layer, wherein the source electrode and the drain electrode are electrically connected to the patterned semiconductor layer via a first contact window and a second contact window respectively.
Abstract:
A pixel structure includes a substrate, a patterned semiconductor layer, an insulation layer, a gate electrode, a first inter-layer dielectric (ILD) layer, a second ILD layer, a third ILD layer, a source electrode and a drain electrode. The patterned semiconductor layer is disposed on the substrate. The insulation layer is disposed on the patterned semiconductor layer. The gate electrode is disposed on the insulation layer. The first ILD layer is disposed on the gate electrode, the second ILD layer is disposed on the first ILD layer, and the third ILD layer is disposed on the second ILD layer. The source electrode and the drain electrode are disposed on the third ILD layer, wherein the source electrode and the drain electrode are electrically connected to the patterned semiconductor layer via a first contact window and a second contact window respectively.