Active device array substrate and manufacturing method thereof
    3.
    发明授权
    Active device array substrate and manufacturing method thereof 有权
    有源器件阵列衬底及其制造方法

    公开(公告)号:US08865532B2

    公开(公告)日:2014-10-21

    申请号:US13625949

    申请日:2012-09-25

    CPC classification number: H01L27/1255 H01L27/1218 H01L27/1248 H01L29/78603

    Abstract: A method for manufacturing an active device array substrate includes providing a flexible substrate having a transistor region and a transparent region; forming a gate electrode on the transistor region; sequentially forming a dielectric layer and a semiconductor layer to cover the gate electrode and the flexible substrate; removing a part of the semiconductor layer to form a channel layer above the gate electrode and removing a thickness of the dielectric layer disposed on the transparent region, such that a portion of the dielectric layer on the gate electrode has a first thickness, and another portion of the dielectric layer on the transparent region has a second thickness less than the first thickness; respectively forming a source electrode and a drain electrode on opposite sides of the channel layer; and forming a pixel electrode electrically connected to the drain electrode.

    Abstract translation: 一种有源器件阵列衬底的制造方法,包括提供具有晶体管区域和透明区域的柔性衬底; 在晶体管区上形成栅电极; 顺序地形成介电层和半导体层以覆盖栅电极和柔性基板; 去除所述半导体层的一部分以在所述栅极电极上方形成沟道层,并且去除设置在所述透明区域上的所述电介质层的厚度,使得所述栅电极上的所述电介质层的一部分具有第一厚度, 在所述透明区域上的所述电介质层的厚度小于所述第一厚度的第二厚度; 分别在沟道层的相对侧上形成源电极和漏电极; 以及形成与漏电极电连接的像素电极。

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