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公开(公告)号：US10317191B2
公开(公告)日：2019-06-11
申请号：US15432684
申请日：2017-02-14
Applicant: ASML Netherlands B.V.
Inventor： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC: G03F7/20 , G01B11/00 , G01B11/02 , G01B11/14 , G01B11/26 , G01N21/95 , H01L21/66 , G01N21/956 , G05B19/418
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US11977034B2
公开(公告)日：2024-05-07
申请号：US17194558
申请日：2021-03-08
Applicant: ASML Netherlands B.V.
Inventor： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC: G01B11/14 , G01B11/00 , G01B11/02 , G01B11/26 , G01N21/95 , G01N21/956 , G03F7/00 , G05B19/418 , H01L21/66
CPC classification number: G01N21/9501 , G01B11/002 , G01B11/02 , G01B11/14 , G01B11/26 , G01N21/956 , G01N21/95607 , G03F7/70508 , G03F7/70625 , G03F7/70633 , G05B19/41875 , H01L22/20 , G05B2219/37224 , Y02P90/02
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US20210215622A1
公开(公告)日：2021-07-15
申请号：US17194558
申请日：2021-03-08
Applicant: ASML Netherlands B.V.
Inventor： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC: G01N21/95 , G01B11/14 , G01B11/02 , G01N21/956 , G03F7/20 , H01L21/66 , G05B19/418 , G01B11/00 , G01B11/26
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US09594029B2
公开(公告)日：2017-03-14
申请号：US14355962
申请日：2012-11-22
Applicant: ASML Netherlands B.V.
Inventor： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Li Chung-Hsun
IPC: G01N21/95 , G01B11/02 , G01B11/14 , G05B19/418 , G03F7/20 , G01N21/956 , H01L21/66
CPC classification number: G01B11/002 , G01B11/02 , G01B11/14 , G01B11/26 , G01N21/9501 , G01N21/956 , G01N21/95607 , G03F7/70508 , G03F7/70625 , G03F7/70633 , G05B19/41875 , G05B2219/37224 , H01L22/20 , Y02P90/20 , Y02P90/22
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.
Abstract translation: 在测量晶片衬底的特性（例如临界尺寸或覆盖层）时，产生用于测量衬底性质的采样计划（2506），其中采样计划包括多个次采样图。 采样计划可以被约束到预定的固定数量的测量点，并且被使用（2508）来控制检查装置，以使用对于各个基板的不同的子采样计划来执行多个基板的属性的多个测量 ，结果（2510）根据样本计划至少部分地重新组合测量结果。
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公开(公告)号：US20140354969A1
公开(公告)日：2014-12-04
申请号：US14355962
申请日：2012-11-22
Applicant: ASML Netherlands B.V.
Inventor： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Li Chung-Hsun
IPC: G01N21/95 , H01J37/317 , G01N23/20
CPC classification number: G01B11/002 , G01B11/02 , G01B11/14 , G01B11/26 , G01N21/9501 , G01N21/956 , G01N21/95607 , G03F7/70508 , G03F7/70625 , G03F7/70633 , G05B19/41875 , G05B2219/37224 , H01L22/20 , Y02P90/20 , Y02P90/22
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.
Abstract translation: 在测量晶片衬底的特性（例如临界尺寸或覆盖层）时，产生用于测量衬底性质的采样计划（2506），其中采样计划包括多个次采样图。 采样计划可以被约束到预定的固定数量的测量点，并且被使用（2508）来控制检查装置，以使用对于各个基板的不同的子采样计划来执行多个基板的属性的多个测量 ，结果（2510）根据样本计划至少部分地重新组合测量结果。
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Patent Agency Ranking
公开(公告)号：US11378893B2
公开(公告)日：2022-07-05
申请号：US17098073
申请日：2020-11-13
Applicant: ASML NETHERLANDS B.V.
Inventor： Theodorus Petrus Maria Cadee , Johannes Henricus Wilhelmus Jacobs , Nicolaas Ten Kate , Erik Roelof Loopstra , Aschwin Lodewijk Hendricus Johannes Van Meer , Jeroen Johannes Sophia Maria Mertens , Christianus Gerardus Maria De Mol , Marcel Johannus Elisabeth Hubertus Muitjens , Antonius Johannus Van Der Net , Joost Jeroen Ottens , Johannes Anna Quaedackers , Maria Elisabeth Reuhman-Huisken , Marco Koert Stavenga , Patricius Aloysius Jacobus Tinnemans , Martinus Cornelis Maria Verhagen , Jacobus Johannus Leonardus Hendricus Verspay , Frederik Eduard De Jong , Koen Goorman , Boris Menchtchikov , Herman Boom , Stoyan Nihtianov , Richard Moerman , Martin Frans Pierre Smeets , Bart Leonard Peter Schoondermark , Franciscus Johannes Joseph Janssen , Michel Riepen
IPC: G03F7/20
Abstract: A lithographic apparatus is described having a liquid supply system configured to at least partly fill a space between a projection system of the lithographic apparatus and a substrate with liquid, a barrier member arranged to substantially contain the liquid within the space, and a heater.
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公开(公告)号：US10996176B2
公开(公告)日：2021-05-04
申请号：US16905629
申请日：2020-06-18
Applicant: ASML Netherlands B.V.
Inventor： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC: G01N21/95 , G01B11/14 , G01B11/02 , G01N21/956 , G03F7/20 , H01L21/66 , G05B19/418 , G01B11/00 , G01B11/26
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US10254663B2
公开(公告)日：2019-04-09
申请号：US14882241
申请日：2015-10-13
Applicant: ASML NETHERLANDS B.V.
Inventor： Theodorus Petrus Maria Cadee , Johannes Henricus Wilhelmus Jacobs , Nicolaas Ten Kate , Erik Roelof Loopstra , Aschwin Lodewijk Hendricus Johannes Van Meer , Jeroen Johannes Sophia Maria Mertens , Christianus Gerardus Maria De Mol , Marcel Johannus Elisabeth Hubertus Muitjens , Antonius Johannus Van Der Net , Joost Jeroen Ottens , Johannes Anna Quaedackers , Maria Elisabeth Reuhman-Huisken , Marco Koert Stavenga , Patricius Aloysius Jacobus Tinnemans , Martinus Cornelis Maria Verhagen , Jacobus Johannus Leonardus Hendricus Verspay , Frederik Eduard De Jong , Koen Goorman , Boris Menchtchikov , Herman Boom , Stoyan Nihtianov , Richard Moerman , Martin Frans Pierre Smeets , Bart Leonard Peter Schoondermark , Franciscus Johannes Joseph Janssen , Michel Riepen
Abstract: A lithographic apparatus is described having a liquid supply system configured to at least partly fill a space between a projection system of the lithographic apparatus and a substrate with liquid, a substrate temperature control system configured to provide a control signal to control a substrate temperature conditioning system based on a determined temperature; and a parameter control system configured to adjust a lithographic apparatus parameter, that is other than, or in addition to, the control signal, based on temperature information of the substrate and/or substrate table or on a measure derived from the temperature information.
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公开(公告)号：US10746668B2
公开(公告)日：2020-08-18
申请号：US16380223
申请日：2019-04-10
Applicant: ASML Netherlands B.V.
Inventor： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC: G01N21/95 , G01B11/14 , G01B11/02 , G01N21/956 , G03F7/20 , H01L21/66 , G05B19/418 , G01B11/00 , G01B11/26
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US20190301850A1
公开(公告)日：2019-10-03
申请号：US16380223
申请日：2019-04-10
Applicant: ASML Netherlands B.V.
Inventor： Wouter Lodewijk ELINGS , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC: G01B11/00 , G01B11/02 , G01B11/14 , G01B11/26 , H01L21/66 , G03F7/20 , G05B19/418 , G01N21/956 , G01N21/95
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
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