公开(公告)号：US20170160073A1

公开(公告)日：2017-06-08

申请号：US15432684

申请日：2017-02-14

Applicant: ASML Netherlands B.V.

Inventor： Wouter Lodewijk ELINGS ,  Franciscus Bernardus Maria VAN BILSEN ,  Christianus Gerardus Maria DE MOL ,  Everhardus Cornelis MOS ,  Hoite Pieter Theodoor TOLSMA ,  Peter TEN BERGE ,  Paul Jacques VAN WIJNEN ,  Leonardus Henricus Marie VERSTAPPEN ,  Gerald DICKER ,  Reiner Maria JUNGBLUT ,  Li CHUNG-HSUN

IPC: G01B11/00 ,  G03F7/20 ,  G01B11/26

CPC classification number: G01B11/002 ,  G01B11/02 ,  G01B11/14 ,  G01B11/26 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G03F7/70508 ,  G03F7/70625 ,  G03F7/70633 ,  G05B19/41875 ,  G05B2219/37224 ,  H01L22/20 ,  Y02P90/20 ,  Y02P90/22

Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.

公开(公告)号：US20200319118A1

公开(公告)日：2020-10-08

申请号：US16905629

申请日：2020-06-18

Applicant: ASML Netherlands B.V.

Inventor： Wouter Lodewijk ELINGS ,  Franciscus Bernardus Maria VAN BILSEN ,  Christianus Gerardus Maria DE MOL ,  Everhardus Cornelis MOS ,  Hoite Pieter Theodoor TOLSMA ,  Peter TEN BERGE ,  Paul Jacques VAN WIJNEN ,  Leonard us Henricus Marie VERSTAPPEN ,  Gerald DICKER ,  Reiner Maria JUNGBLUT ,  Chung-Hsun LI

IPC: G01N21/95 ,  G01B11/14 ,  G01B11/02 ,  G01N21/956 ,  G03F7/20 ,  H01L21/66 ,  G05B19/418 ,  G01B11/00 ,  G01B11/26

Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.

公开(公告)号：US20190301850A1

公开(公告)日：2019-10-03

申请号：US16380223

申请日：2019-04-10

Applicant: ASML Netherlands B.V.

Inventor： Wouter Lodewijk ELINGS ,  Franciscus Bernardus Maria Van Bilsen ,  Christianus Gerardus Maria De Mol ,  Everhardus Cornelis Mos ,  Hoite Pieter Theodoor Tolsma ,  Peter Ten Berge ,  Paul Jacques Van Wijnen ,  Leonardus Henricus Marie Verstappen ,  Gerald Dicker ,  Reiner Maria Jungblut ,  Chung-Hsun Li

IPC: G01B11/00 ,  G01B11/02 ,  G01B11/14 ,  G01B11/26 ,  H01L21/66 ,  G03F7/20 ,  G05B19/418 ,  G01N21/956 ,  G01N21/95

Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.