Abstract:
An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.
Abstract:
An optical module includes a transparent substrate and a refractive optical element mounted on the substrate. A conductive heating trace is deposited on the substrate around the refractive optical element. A temperature sensor senses a temperature of the substrate. Control circuitry is coupled to the temperature sensor so as to measure a difference between the temperature of the substrate and a target operating temperature of the module, and to drive a current through the conductive heating trace, responsively to the difference, so as to heat the substrate to the target operating temperature.
Abstract:
A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.
Abstract:
An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.
Abstract:
An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.
Abstract:
An optical module includes a transparent substrate and a refractive optical element mounted on the substrate. A conductive heating trace is deposited on the substrate around the refractive optical element. A temperature sensor senses a temperature of the substrate. Control circuitry is coupled to the temperature sensor so as to measure a difference between the temperature of the substrate and a target operating temperature of the module, and to drive a current through the conductive heating trace, responsively to the difference, so as to heat the substrate to the target operating temperature.
Abstract:
A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.