公开(公告)号：US08946567B2

公开(公告)日：2015-02-03

申请号：US12920296

申请日：2009-10-30

申请人： Kinya Nakatsu ,  Hiroshi Hozoji ,  Takeshi Tokuyama ,  Yusuke Takagi ,  Toshiya Satoh ,  Taku Oyama ,  Takanori Ninomiya

发明人： Kinya Nakatsu ,  Hiroshi Hozoji ,  Takeshi Tokuyama ,  Yusuke Takagi ,  Toshiya Satoh ,  Taku Oyama ,  Takanori Ninomiya

IPC分类号： H05K7/00 ,  H02M7/00 ,  B60L11/14 ,  B60L11/18 ,  H05K7/20 ,  H01L23/00

CPC分类号： H02M7/003 ,  B60L11/14 ,  B60L11/18 ,  B60L11/1803 ,  B60L2200/26 ,  B60L2210/40 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/473 ,  H01L24/33 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H02M7/44 ,  H02M7/5395 ,  H02M2001/327 ,  H02P27/08 ,  H05K7/20409 ,  H05K7/205 ,  H05K7/209 ,  H05K7/20927 ,  Y02T10/70 ,  Y02T10/7005 ,  Y02T10/7077 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.

摘要翻译： 包括功率模块的功率模块和功率转换器装置包括：两个基板，它们的主表面相互面对; 设置在所述两个基板之间的半导体电路单元; 连接构件，其连接到所述两个基板并形成容纳所述半导体电路单元的壳体区域; 以及绝缘构件，其设置在所述基板和所述半导体电路单元之间，并且确保所述基板和所述半导体电路单元的电绝缘。 连接构件的刚性或厚度小于基板的刚度或厚度。

公开(公告)号：US20140369014A1

公开(公告)日：2014-12-18

申请号：US14363208

申请日：2012-08-22

申请人： Yusuke Takagi

发明人： Yusuke Takagi

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K1/05

CPC分类号： H05K1/183 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/182 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/09972 ,  H05K2201/10439 ,  H05K2203/0169 ,  H05K2203/0323

摘要： A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.

摘要翻译： 布线板包括作为金属芯基板的基底基板，并且包括其中将要安装作为电气部件或电子部件的内部部件的开口，以及端子放置部，其内部部件的端子 将要安装的端子放置部分围绕基底基板的开口形成，并且从基底基板的表面向内凹入，使得内部部件的一部分被放置在开口内。

公开(公告)号：US08847374B2

公开(公告)日：2014-09-30

申请号：US13818490

申请日：2011-09-05

申请人： Eiichi Ide ,  Shinji Hiramitsu ,  Hiroshi Hozoji ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Akira Matsushita ,  Yusuke Takagi

发明人： Eiichi Ide ,  Shinji Hiramitsu ,  Hiroshi Hozoji ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Akira Matsushita ,  Yusuke Takagi

IPC分类号： H01L23/06 ,  H01L21/48 ,  H01L23/495 ,  H01L23/36 ,  H01L23/34 ,  H01L23/00 ,  H01L23/433 ,  H01L23/492 ,  H01L25/18 ,  H01L25/07

CPC分类号： H01L23/34 ,  H01L21/4825 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/3521 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1306 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/01047 ,  H01L2924/01029

摘要： A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface.

摘要翻译： 功率半导体模块包括在一个主表面上形成有多个控制电极的功率半导体元件，通过第一焊料材料连接到功率半导体元件的主表面之一的第一导体板和第二导体板 通过第二焊料材料在功率半导体元件的另一个主表面上接合。 在第一导体板上形成有从可应用的第一导体板的基部突出并且包括形成在上侧的第一突起表面的第一突出部。 第二突起部分，包括形成在与功率半导体元件的主表面相对的一个表面上的第二突起表面。 第一焊料材料插入在功率半导体元件和第一导体板之间，同时避免多个控制电极。 如果通过功率半导体元件的一个主面从垂直方向突出，则第二突起部形成为使得第二突起表面的特定侧的突出部与形成的台阶部的突出部重叠 在第一导体板的基部与第一突起部之间。 功率半导体元件上的多个控制电极沿第二突出面的规定侧形成。

公开(公告)号：US20120320645A1

公开(公告)日：2012-12-20

申请号：US13580272

申请日：2010-08-19

申请人： Shinichi Fujino ,  Yusuke Takagi ,  Takuma Hakuto

发明人： Shinichi Fujino ,  Yusuke Takagi ,  Takuma Hakuto

IPC分类号： H02M7/00

CPC分类号： H02M7/003 ,  H01L2224/0603 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H02M3/00 ,  H03K17/691 ,  H01L2924/00

摘要： A power converter which has a power module allowing supply and cutoff of main current, and a driver module controlling supply and cutoff of the main current allowed by the power module includes: a high potential side semiconductor device which allows supply and cutoff of the main current on the high potential side of the power module; a low potential side semiconductor device which allows supply and cutoff of the main current on the low potential side of the power module, and is connected with the high potential side semiconductor device in series; plural power module side wirings connected with respective electrodes contained in the high potential side semiconductor device and the low potential side semiconductor device, and disposed adjacent to each other substantially on the same plane as the power module in the order of applied potentials with a connection end between the plural power module side wirings and the driver module located along the end of the power module; plural driver module side wirings provided on the driver module as wirings connected with the plural corresponding power module side wirings, and disposed adjacent to each other substantially on the same plane as the driver module in the order corresponding to the positions of the plural power module side wirings in positions along the end of the driver module; a power source transformer as a circuit which converts a signal voltage for controlling the supply and cutoff of the main current by the driver module into voltage applied to a control electrode of the high potential side semiconductor device and a control electrode of the low potential side semiconductor device, plural terminals of the power source transformer in correspondence with the plural driver module side wirings being provided in the order of the positions of the plural corresponding driver module side wirings; and conductors disposed in the vicinity of the plane on which the plural power module side wirings are provided and in the vicinity of the plane on which the plural driver module side wirings are provided, and electrically connected in such positions as to surround magnetic flux generated by current looping at least through the power source transformer, the driver module side wirings, and the power module side wirings.

公开(公告)号：USD651565S1

公开(公告)日：2012-01-03

申请号：US29354620

申请日：2010-01-27

申请人： Masashi Yura ,  Shinichi Fujino ,  Yusuke Takagi ,  Toshiya Satoh ,  Kinya Nakatsu ,  Takeshi Tokuyama

设计人： Masashi Yura ,  Shinichi Fujino ,  Yusuke Takagi ,  Toshiya Satoh ,  Kinya Nakatsu ,  Takeshi Tokuyama

公开(公告)号：US4989626A

公开(公告)日：1991-02-05

申请号：US433330

申请日：1989-11-08

申请人： Yusuke Takagi ,  Yoshio Kojima ,  Kenji Mitani

发明人： Yusuke Takagi ,  Yoshio Kojima ,  Kenji Mitani

IPC分类号： G01N1/00 ,  F16K31/02 ,  F16K31/12 ,  F16L55/10 ,  F16L55/103 ,  G01N1/10 ,  G01N1/28 ,  G01N35/10

CPC分类号： F16L55/103 ,  Y10T137/0391 ,  Y10T137/2196 ,  Y10T137/6606

摘要： An apparatus for controlling the opening and closing of a channel for a liquid is arranged such that a liquid channel is closed by causing a controller to control one heat absorbing and generating part of a cooling/heating element to execute heat absorption and cooling a heat transmitting element to solidify the liquid in the channel. The apparatus is also arrangement such that the channel is opened first by causing the controller to control the same heat absorbing and generating part to execute heat generation and heating the heat transmitting element to melt the liquid solidified in the channel. A method of controlling the opening and closing of a channel according to the invention includes the steps of: solidifying a liquid in a channel by cooling it from the outside to close the channel; and opening the channel thus closed by melting the liquid solidified in the channel by the application of heat.

公开(公告)号：US09179581B2

公开(公告)日：2015-11-03

申请号：US13163950

申请日：2011-06-20

申请人： Tokihito Suwa ,  Yujiro Kaneko ,  Yusuke Takagi ,  Shinichi Fujino ,  Takahiro Shimura

发明人： Tokihito Suwa ,  Yujiro Kaneko ,  Yusuke Takagi ,  Shinichi Fujino ,  Takahiro Shimura

IPC分类号： H05K7/00 ,  H05K7/20 ,  H01L23/473 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC分类号： H05K5/0247 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/537 ,  H05K7/1432 ,  H05K7/20845 ,  H05K7/2089 ,  H05K7/20927 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099 ,  H01L2224/37599 ,  H01L2224/84

摘要： A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.

摘要翻译： 功率半导体装置包括构成逆变器电路的上臂和下臂的多个功率半导体元件，密封多个功率半导体元件的第一密封构件，正极侧端子和负极侧端子 并且从所述第一密封部件突出的第二密封部件，密封所述正极侧端子和所述负极侧端子的至少一部分的至少一部分的第二密封部件，其中， 容纳用第一密封构件密封的功率半导体元件。

公开(公告)号：US20130175678A1

公开(公告)日：2013-07-11

申请号：US13818490

申请日：2011-09-05

申请人： Eiichi Ide ,  Shinji Hiramitsu ,  Hiroshi Hozoji ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Akira Matsushita ,  Yusuke Takagi

发明人： Eiichi Ide ,  Shinji Hiramitsu ,  Hiroshi Hozoji ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Akira Matsushita ,  Yusuke Takagi

IPC分类号： H01L23/34 ,  H01L21/48

CPC分类号： H01L23/34 ,  H01L21/4825 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/3521 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1306 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/01047 ,  H01L2924/01029

摘要： A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface.

摘要翻译： 功率半导体模块包括在一个主表面上形成有多个控制电极的功率半导体元件，通过第一焊料材料连接到功率半导体元件的主表面之一的第一导体板和第二导体板 通过第二焊料材料在功率半导体元件的另一个主表面上接合。 在第一导体板上形成有从可应用的第一导体板的基部突出并且包括形成在上侧的第一突起表面的第一突出部。 第二突起部分，包括形成在与功率半导体元件的主表面相对的一个表面上的第二突起表面。 第一焊料材料插入在功率半导体元件和第一导体板之间，同时避免多个控制电极。 如果通过功率半导体元件的一个主面从垂直方向突出，则第二突起部形成为使得第二突起表面的特定侧的突出部与形成的台阶部的突出部重叠 在第一导体板的基部与第一突起部之间。 功率半导体元件上的多个控制电极沿第二突出面的规定侧形成。

公开(公告)号：US20100261496A1

公开(公告)日：2010-10-14

申请号：US12744442

申请日：2008-11-26

申请人： Shusaku Fukumoto ,  Keiji Hikoso ,  Yusuke Takagi

发明人： Shusaku Fukumoto ,  Keiji Hikoso ,  Yusuke Takagi

IPC分类号： H04B7/00

CPC分类号： H04W48/16 ,  H04W36/0083 ,  H04W36/32

摘要： A mobile station device, which communicates with a base station device, includes a control signal generator that initiates or terminates a cell search based on a reception quality value of a radio wave transmitted from the base station device, and a moving speed of the mobile station device.

摘要翻译： 与基站装置进行通信的移动站装置包括基于从基站装置发送的无线电波的接收质量值，启动或终止小区搜索的控制信号发生器，以及移动站的移动速度 设备。

公开(公告)号：US07055477B2

公开(公告)日：2006-06-06

申请号：US10899074

申请日：2004-07-27

申请人： Tamotsu Todo ,  Yoshihiko Yamada ,  Yusuke Takagi

发明人： Tamotsu Todo ,  Yoshihiko Yamada ,  Yusuke Takagi

IPC分类号： F01L1/34

CPC分类号： F01L13/0026 ,  F01L1/022 ,  F01L2013/0073 ,  F01L2103/00 ,  Y10T74/2102 ,  Y10T74/2107

摘要： A VA apparatus includes a rocker arm coaxially swingably supported on a support shaft. The rocker arm is swung by torque transmitted from an engine to operate an engine valve and includes a first arm to which torque is transmitted and a second arm for operating the engine valve. The first and second arms, which are separate and distinct from each other, are swingable relative to each other. Bolts are provided to fix the first and second arms in a predetermined relative angle position.

摘要翻译： VA装置包括同轴可摆动地支撑在支撑轴上的摇臂。 摇臂通过从发动机传递的扭矩摆动，以操作发动机气门，并且包括传递扭矩的第一臂和用于操作发动机气门的第二臂。 彼此分开且不同的第一和第二臂可相对于彼此摆动。 提供螺栓以将第一和第二臂固定在预定的相对角度位置。