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    Semiconductor device
    3.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US09363914B2

    公开(公告)日：2016-06-07

    申请号：US14396155

    申请日：2012-07-13

    申请人： Goro Yasutomi ,  Yukimasa Hayashida

    发明人： Goro Yasutomi ,  Yukimasa Hayashida

    IPC分类号： H05K7/00 ,  H05K7/02 ,  H01L23/10 ,  H05K7/14

    CPC分类号： H05K7/02 ,  H01L23/10 ,  H01L2924/0002 ,  H05K7/14 ,  H01L2924/00

    摘要： It is an object of the present invention to provide an easily assemblable semiconductor device including a cover that covers a top of a case and is reliably fixed to the case defining an outline of the semiconductor device. A semiconductor device according to the present invention includes: a case defining an outline of the semiconductor device; a cover covering a top of the case; and a fastener mechanically fixing the cover to the case, a through-hole is formed in the cover, the case includes a projection inserted into the through-hole, and the fastener is attachable to the projection inserted into the through-hole of the cover from the outside of the cover and locks the projection upon the attachment to prevent the projection from falling off the through-hole.

    摘要翻译： 本发明的目的是提供一种易于组装的半导体器件，其包括覆盖壳体的顶部并可靠地固定到限定半导体器件的轮廓的壳体的盖。 根据本发明的半导体器件包括：限定半导体器件的轮廓的壳体; 覆盖壳体顶部的盖子; 以及将盖机械地固定到壳体上的紧固件，在盖中形成有通孔，壳体包括插入到通孔中的突起，并且紧固件可附接到插入盖的通孔中的突起 从盖的外部并且将突起锁定在附接上以防止突起从通孔脱落。

    SEMICONDUCTOR DEVICE
    4.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20150116956A1

    公开(公告)日：2015-04-30

    申请号：US14396155

    申请日：2012-07-13

    申请人： Goro Yasutomi ,  Yukimasa Hayashida

    发明人： Goro Yasutomi ,  Yukimasa Hayashida

    IPC分类号： H05K7/02 ,  H05K7/14

    CPC分类号： H05K7/02 ,  H01L23/10 ,  H01L2924/0002 ,  H05K7/14 ,  H01L2924/00

    摘要： It is an object of the present invention to provide an easily assemblable semiconductor device including a cover that covers a top of a case and is reliably fixed to the case defining an outline of the semiconductor device. A semiconductor device according to the present invention includes: a case defining an outline of the semiconductor device; a cover covering a top of the case; and a fastener mechanically fixing the cover to the case, a through-hole is formed in the cover, the case includes a projection inserted into the through-hole, and the fastener is attachable to the projection inserted into the through-hole of the cover from the outside of the cover and locks the projection upon the attachment to prevent the projection from falling off the through-hole.

    摘要翻译： 本发明的目的是提供一种易于组装的半导体器件，其包括覆盖壳体的顶部并可靠地固定到限定半导体器件的轮廓的壳体的盖。 根据本发明的半导体器件包括：限定半导体器件的轮廓的壳体; 覆盖壳体顶部的盖子; 以及将盖机械地固定到壳体上的紧固件，在盖中形成有通孔，壳体包括插入到通孔中的突起，并且紧固件可附接到插入盖的通孔中的突起 从盖的外部并且将突起锁定在附接上以防止突起从通孔脱落。

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号：US20120153451A1

    公开(公告)日：2012-06-21

    申请号：US13178952

    申请日：2011-07-08

    申请人： Yukimasa HAYASHIDA

    发明人： Yukimasa HAYASHIDA

    IPC分类号： H01L23/02

    CPC分类号： H01L23/053 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor device of the present invention comprises a semiconductor element, a main electrode connected to the semiconductor element, and a case for sealing the semiconductor element. The main electrode is provided, extending outside of the case from the inside thereof, and an external thread or an internal thread to be fastened to an external terminal is provided integrally on an extended portion of the main electrode, which extends outside of the case.

    摘要翻译： 本发明的半导体器件包括半导体元件，连接到半导体元件的主电极和用于密封半导体元件的壳体。 主电极从壳体的内部延伸到壳体的外部，并且外部螺纹或内螺纹被固定到外部端子一体地设置在主电极延伸部分的外侧延伸。

    Semiconductor device having filler with thermal conductive particles
    7.
    发明授权
    Semiconductor device having filler with thermal conductive particles 有权
    具有带有导热颗粒的填料的半导体器件

    公开(公告)号：US07554192B2

    公开(公告)日：2009-06-30

    申请号：US11553235

    申请日：2006-10-26

    申请人： Masuo Koga ,  Tetsuo Mizoshiri ,  Yukimasa Hayashida

    发明人： Masuo Koga ,  Tetsuo Mizoshiri ,  Yukimasa Hayashida

    IPC分类号： H01L23/34

    CPC分类号： H01L23/22 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L2224/32225

    摘要： A semiconductor device that includes an insulating substrate having an upper conductor formed on an upper surface thereof and a lower conductor formed on a lower surface of the insulating substrate. The device also includes a semiconductor element mounted on the upper surface of the insulating substrate with an under-element solder therebetween. The device further includes a heat sink whereon the insulating substrate is mounted with an under-substrate solder therebetween. The device additionally includes a silicone gel covering the semiconductor element, the under-element solder, and the upper conductor. In addition, the device includes a filler covering the lower conductor and the under-substrate solder, without covering the semiconductor element, the under-element solder, and the upper conductor, and having a thermal conductivity larger than a thermal conductivity of air and a fluidity higher than a fluidity of the silicone gel.

    摘要翻译： 一种半导体器件，包括在其上表面上形成有上导体的绝缘基板和形成在所述绝缘基板的下表面上的下导体。 该装置还包括半导体元件，其安装在绝缘基板的上表面上，其间具有下部元件焊料。 该装置还包括散热器，绝缘基板上安装有底板下焊料。 该装置还包括覆盖半导体元件，下部元件焊料和上导体的硅凝胶。 此外，该器件包括覆盖下导体和底基底焊料的填充物，而不覆盖半导体元件，下元件焊料和上导体，并且具有大于空气的热导率的热导率和 流动性高于硅胶的流动性。

    Semiconductor device having a resistance for equalizing the current distribution
    9.
    发明授权
    Semiconductor device having a resistance for equalizing the current distribution 失效
    具有用于均衡电流分布的电阻的半导体器件

    公开(公告)号：US07405448B2

    公开(公告)日：2008-07-29

    申请号：US11538232

    申请日：2006-10-03

    申请人： Masuo Koga ,  Tetsuo Mizoshiri ,  Yukimasa Hayashida

    发明人： Masuo Koga ,  Tetsuo Mizoshiri ,  Yukimasa Hayashida

    IPC分类号： H01L23/62 ,  H01L21/00 ,  H05K7/20

    CPC分类号： H01L25/162 ,  H01L23/647 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the semiconductor element. A second insulating substrate is mounted inside the insulating resin casing apart from the first insulating substrate. On the second insulating substrate, a resistance element that functions as a gate balance resistance is fixed by soldering. The second insulating substrate on which the resistance element was thus mounted was made apart from the first insulating substrate on which the semiconductor element was mounted, and was mounted on the side of the insulating resin casing.

    摘要翻译： 在散热器上形成第一绝缘基板，在其上形成半导体元件。 形成绝缘树脂外壳以覆盖第一绝缘基板和半导体元件。 第二绝缘基板安装在绝缘树脂外壳的内部，与第一绝缘基板隔开。 在第二绝缘基板上，通过焊接固定用作栅极平衡电阻的电阻元件。 将安装有电阻元件的第二绝缘基板与安装有半导体元件的第一绝缘基板分开，并且安装在绝缘树脂外壳的一侧。