Thin film transistor and manufacturing method thereof
    3.
    发明申请
    Thin film transistor and manufacturing method thereof 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20080105921A1

    公开(公告)日:2008-05-08

    申请号:US12000593

    申请日:2007-12-14

    IPC分类号: H01L29/78 H01L21/3205

    摘要: The present invention provides a step in which a channel-length of a TFT can be controlled with higher reproducibility. In addition, the present invention provides a step in which a short channel-length of the TFT can be manufactured. Further, the present invention provides a structure of the TFT in which a current-voltage characteristic can be improved. The present invention refers to a thin film transistor comprising a lamination layer wherein a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covering the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, and a region which is in contact with the first insulating film and the third conductive film is a channel forming region in semiconductor film, and the third conductive film is a gate electrode.

    摘要翻译: 本发明提供了可以以更高的再现性来控制TFT的沟道长度的步骤。 此外,本发明提供了可以制造TFT的短沟道长度的步骤。 此外,本发明提供了可以提高电流 - 电压特性的TFT的结构。 本发明涉及一种薄膜晶体管,其包括层叠层,其中依次层叠第一导电膜,第一绝缘膜和第二导电膜,形成为与层叠层的侧表面接触的半导体膜 以及通过第二绝缘膜覆盖半导体膜的第三导电膜。 第一导电膜和第二导电膜是源电极和漏电极,与第一绝缘膜和第三导电膜接触的区域是半导体膜中的沟道形成区域,第三导电膜是 栅电极。

    THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20120112196A1

    公开(公告)日:2012-05-10

    申请号:US13336292

    申请日:2011-12-23

    IPC分类号: H01L29/786

    摘要: The present invention provides a structure of the TFT in which a current-voltage characteristic can be improved. The present invention refers to a thin film transistor comprising a lamination layer wherein a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covering the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, and a region which is in contact with the first insulating film and the third conductive film is a channel forming region in semiconductor film, and the third conductive film is a gate electrode.

    摘要翻译: 本发明提供了可以提高电流 - 电压特性的TFT的结构。 本发明涉及一种薄膜晶体管,其包括层叠层,其中依次层叠第一导电膜,第一绝缘膜和第二导电膜,形成为与层叠层的侧表面接触的半导体膜 以及通过第二绝缘膜覆盖半导体膜的第三导电膜。 第一导电膜和第二导电膜是源电极和漏电极,与第一绝缘膜和第三导电膜接触的区域是半导体膜中的沟道形成区域,第三导电膜是 栅电极。

    Field emission device and manufacturing method thereof
    5.
    发明授权
    Field emission device and manufacturing method thereof 有权
    场发射装置及其制造方法

    公开(公告)号:US07368306B2

    公开(公告)日:2008-05-06

    申请号:US11347283

    申请日:2006-02-06

    IPC分类号: H01L21/00

    CPC分类号: H01J9/025 H01J1/3044

    摘要: It is an object to provide techniques for forming a field emission device of a field emission display device with the use of an inexpensive large-sized substrate according to the process that enables improving productivity.A field emission device according to the present invention includes a cathode electrode formed on an insulating surface of a substrate and a convex electron emission portion formed at a surface of the cathode electrode, and the cathode electrode and the electron emission portion include the same semiconductor film. The electron emission portion has a conical shape or a whiskers shape.

    摘要翻译: 本发明的目的是提供根据能够提高生产率的方法,通过使用便宜的大尺寸基板来形成场发射显示装置的场致发射装置的技术。 根据本发明的场发射器件包括形成在衬底的绝缘表面上的阴极电极和形成在阴极电极的表面处的凸电子发射部分,并且阴极电极和电子发射部分包括相同的半导体膜 。 电子发射部分具有圆锥形状或晶须形状。

    Thin film transistor and manufacturing method thereof

    公开(公告)号:US08399887B2

    公开(公告)日:2013-03-19

    申请号:US13336292

    申请日:2011-12-23

    IPC分类号: H01L27/108

    摘要: The present invention provides a structure of the TFT in which a current-voltage characteristic can be improved. The present invention refers to a thin film transistor comprising a lamination layer wherein a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covering the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, and a region which is in contact with the first insulating film and the third conductive film is a channel forming region in semiconductor film, and the third conductive film is a gate electrode.

    Thin film transistor and manufacturing method thereof
    7.
    发明授权
    Thin film transistor and manufacturing method thereof 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US07923780B2

    公开(公告)日:2011-04-12

    申请号:US12000593

    申请日:2007-12-14

    IPC分类号: H01L27/12

    摘要: The present invention provides a step in which a channel-length of a TFT can be controlled with higher reproducibility. In addition, the present invention provides a step in which a short channel-length of the TFT can be manufactured. Further, the present invention provides a structure of the TFT in which a current-voltage characteristic can be improved. The present invention refers to a thin film transistor comprising a lamination layer wherein a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covering the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, and a region which is in contact with the first insulating film and the third conductive film is a channel forming region in semiconductor film, and the third conductive film is a gate electrode.

    摘要翻译: 本发明提供了可以以更高的再现性来控制TFT的沟道长度的步骤。 此外,本发明提供了可以制造TFT的短沟道长度的步骤。 此外,本发明提供了可以提高电流 - 电压特性的TFT的结构。 本发明涉及一种薄膜晶体管,其包括层叠层,其中依次层叠第一导电膜,第一绝缘膜和第二导电膜,形成为与层叠层的侧表面接触的半导体膜 以及通过第二绝缘膜覆盖半导体膜的第三导电膜。 第一导电膜和第二导电膜是源电极和漏电极,与第一绝缘膜和第三导电膜接触的区域是半导体膜中的沟道形成区域,第三导电膜是 栅电极。

    Thin film transistor and manufacturing method thereof
    8.
    发明授权
    Thin film transistor and manufacturing method thereof 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US07314784B2

    公开(公告)日:2008-01-01

    申请号:US10803092

    申请日:2004-03-18

    IPC分类号: H01L21/00

    摘要: A channel-length of a TFT can be controlled with higher reproducibility, and a short channel-length of the TFT can be manufactured. Further, a structure of the TFT having an improved current-voltage characteristic is provided. A thin film transistor has a lamination layer where a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film is formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covers the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, a region which is in contact with the first insulating film and the third conductive film is a channel forming region in the semiconductor film, and the third conductive film is a gate electrode.

    摘要翻译: 可以以更高的再现性来控制TFT的沟道长度,并且可以制造TFT的短沟道长度。 此外,提供了具有改善的电流 - 电压特性的TFT的结构。 薄膜晶体管具有层叠层,其中第一导电膜,第一绝缘膜和第二导电膜顺序地层叠,形成半导体膜以与层压层的侧表面接触,并且第三 导电膜通过第二绝缘膜覆盖半导体膜。 第一导电膜和第二导电膜是源电极和漏电极,与第一绝缘膜和第三导电膜接触的区域是半导体膜中的沟道形成区域,第三导电膜是 栅电极。

    Field emission device and manufacturing method thereof

    公开(公告)号:US20060141657A1

    公开(公告)日:2006-06-29

    申请号:US11347283

    申请日:2006-02-06

    IPC分类号: H01L21/00

    CPC分类号: H01J9/025 H01J1/3044

    摘要: It is an object to provide techniques for forming a field emission device of a field emission display device with the use of an inexpensive large-sized substrate according to the process that enables improving productivity. A field emission device according to the present invention includes a cathode electrode formed on an insulating surface of a substrate and a convex electron emission portion formed at a surface of the cathode electrode, and the cathode electrode and the electron emission portion include the same semiconductor film. The electron emission portion has a conical shape or a whiskers shape.

    THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20110183501A1

    公开(公告)日:2011-07-28

    申请号:US13081525

    申请日:2011-04-07

    IPC分类号: H01L21/20

    摘要: The present invention provides a step in which a channel-length of a TFT can be controlled with higher reproducibility. In addition, the present invention provides a step in which a short channel-length of the TFT can be manufactured. Further, the present invention provides a structure of the TFT in which a current-voltage characteristic can be improved. The present invention refers to a thin film transistor comprising a lamination layer wherein a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covering the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, and a region which is in contact with the first insulating film and the third conductive film is a channel forming region in semiconductor film, and the third conductive film is a gate electrode.

    摘要翻译: 本发明提供了可以以更高的再现性来控制TFT的沟道长度的步骤。 此外,本发明提供了可以制造TFT的短沟道长度的步骤。 此外,本发明提供了可以提高电流 - 电压特性的TFT的结构。 本发明涉及一种薄膜晶体管,其包括层叠层,其中依次层叠第一导电膜,第一绝缘膜和第二导电膜,形成为与层叠层的侧表面接触的半导体膜 以及通过第二绝缘膜覆盖半导体膜的第三导电膜。 第一导电膜和第二导电膜是源电极和漏电极,与第一绝缘膜和第三导电膜接触的区域是半导体膜中的沟道形成区域,第三导电膜是 栅电极。