摘要:
A circuit pattern having a size finer than a half of a wavelength of an exposure beam is transferred on a semiconductor wafer plane with an excellent accuracy by means of a mask whereupon an integrated circuit pattern is formed and a reduction projection aligner. The accuracy of transferring the circuit pattern on the semiconductor wafer is improved by synergic effects of super-resolution exposure, wherein a mask cover made of a transparent medium is provided on a pattern side of the integrated circuit mask so as to suppress the aberration of reduction projection alignment, and a method of increasing the number of actual apertures of the optical reduction projection lens system provided with the wafer cover made of the transparent medium on a photoresist side of the semiconductor wafer to which planarizing process is performed.
摘要:
A circuit pattern having a size finer than a half of a wavelength of an exposure beam is transferred on a semiconductor wafer plane with an excellent accuracy by means of a mask whereupon an integrated circuit pattern is formed and a reduction projection aligner. The accuracy of transferring the circuit pattern on the semiconductor wafer is improved by synergic effects of super-resolution exposure, wherein a mask cover made of a transparent medium is provided on a pattern side of the integrated circuit mask so as to suppress the aberration of reduction projection alignment, and a method of increasing the number of actual apertures of the optical reduction projection lens system provided with the wafer cover made of the transparent medium on a photoresist side of the semiconductor wafer to which planarizing process is performed.
摘要:
Technology for forming a fine light beam having a size smaller than the theoretical limit determined by the wavelength of light and characteristics of an objective lens. A beam distribution shifter having two light transmission regions is disposed between a source of light and an objective lens, a phase shifter is provided on one of the two light transmission regions to divide the light passing through the beam distribution shifter into two light fluxes having phases opposite to each other, and the two light fluxes are focused through the objective lens to form a fine light beam having a size smaller than the theoretical limit determined by the wavelength of the light and characteristics of the objective lens due to destructive interference between the two light fluxes.
摘要:
Either a chemical amplification positive electron beam resist film or a chemical amplification negative electron beam resist film is used selectively according to an IC fabricating process when forming a minute IC pattern by using, as a mask, a resist pattern formed by irradiating the chemical amplification electron beam resist film formed on a semiconductor wafer with an electron beam, to form the minute IC pattern quickly in a high accuracy and to carry out an electron beam direct writing at a high throughput. The chemical amplification electron beam resist film is coated with a conductive polymer film before irradiating the same with the electron beam to prevent the charging-up of the chemical amplification electron beam resist film and to stabilize the chemical amplification electron beam resist film during a electron beam writing process.
摘要:
In order to improve the inspection efficiency of a photomask having a phase shifter pattern, the inspection of the photomask having the phase shifter pattern is divided into three steps, an anomaly extraction step, a first anomaly discrimination step and a second anomaly discrimination step. These inspection steps are performed at different inspection regions. An anomaly extraction station 7 for the anomaly extraction inspects the presence or absence of an anomaly for all the regions of the photomask 1. An anomaly discrimination station 8 for the anomaly discrimination classifies the content of the anomaly. A phase difference measurement station 9 for the anomaly discrimination measures the phase difference error.
摘要:
The present invention relates to a microminiaturization technique to achieve the miniaturization and higher integration of IC chip and to the improvement of a mask used in its manufacturing process. In other words, the phases of lights transmitted through the mask is controlled within one mask pattern. Specifically, a transparent film is formed in such a manner that it covers a mask pattern along a pattern formed by magnifying or demagnifying the mask pattern or otherwise a groove is formed in a mask substrate. A phase difference of 180.degree. is generated between the lights transmitted through the mask substrate and the transparent film or the groove, causing interference with each light to offset each other. Therefore, the pattern transferred onto a wafer has an improved resolution, being used in the invention.
摘要:
Selective pattern exposure with high reliability is made possible by a desired pattern of repeated pattern and a non-repeated pattern. Exposure technology is obtained to enable improvement of preparation efficiency of pattern data and to secure inspection of an aperture pattern. With the invention, an electron beam is used as focused beam, and a pattern exposure apparatus of a batch transfer system for transferring repeated pattern and non-repeated pattern of plural graphics of a semiconductor integrated circuit or the like comprises an EB drawing section for controlling the beam and irradiating beam onto a sample, a control I/O section, a drawing control section and a data storage section. In the EB drawing section, a semiconductor wafer is mounted on a platform, and in the path of the electron beam from the electron beam source to the stage, a first mask, a blanking electrode, an electron lens, a first deflector, a second deflector, a second mask and a third deflector are installed.
摘要:
Technology for forming a fine light beam having a size smaller than the theoretical limit determined by the wavelength of light and characteristics of an objective lens. A beam distribution shifter having two light transmission regions is disposed between a source of light and an objective lens, a phase shifter is provided on one of the two light transmission regions to divide the light passing through the beam distribution shifter into two light fluxes having phases opposite to each other, and the two light fluxes are focused through the objective lens to form a fine light beam having a size smaller than the theoretical limit determined by the wavelength of the light and characteristics of the objective lens due to destructive interference between the two light fluxes.
摘要:
A mask and an exposure method are provided in which a wafer is irradiated with light transmitted through the mask formed with a predetermined pattern having a shielding region and a transmissive region, to transfer the pattern of said mask. In particular, the mask includes a first mask and a second mask. The first mask is formed with a pattern having a shielding region and a transparent region, while the second mask is formed with a pattern having a phase shifter for introducing a phase difference in a portion of the transmission light. The first and second masks are superposed relative to one another over the wafer so that a clear image may be focused on said wafer by making use of interference of said transmission light caused by said first and second mask. It is to be noted that this arrangement also has the advantage of not transferring images of foreign substances stuck on the back of the mask, to the wafer.
摘要:
The present invention relates to a system for drawing patterns on a wafer by using a charged particle beam such as an electron beam, in which a complicated prealigning mechanism used for mounting the wafer on a stage is omitted. Instead, according to the present system, rotation of the wafer is detected and a shaped beam is rotated by an amount corresponding to the value detected. Subsequently, a predetermined pattern is drawn on the substrate. The system includes a detecting device for detecting the rotation of the wafer by using an orientation flat or adjusting marks; a computer for storing a value corresponding to the rotation thus detected; a rotating lens control circuit for receiving data from the computer; and a rotating lens.