公开(公告)号：US06700198B2

公开(公告)日：2004-03-02

申请号：US09970983

申请日：2001-10-05

申请人： Hideki Toya ,  Mitsuyoshi Imai ,  Masaki Sakaguchi ,  Naoki Yamabe ,  Mamoru Suwa ,  Toshiyuki Motooka ,  Hideharu Sakoda ,  Muneharu Morioka

发明人： Hideki Toya ,  Mitsuyoshi Imai ,  Masaki Sakaguchi ,  Naoki Yamabe ,  Mamoru Suwa ,  Toshiyuki Motooka ,  Hideharu Sakoda ,  Muneharu Morioka

IPC分类号： H01L2348

CPC分类号： H01L24/85 ,  H01L21/4832 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/85001 ,  H01L2224/85005 ,  H01L2224/85051 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.

摘要翻译： 为了提高用作半导体装置的外部连接端子的镀膜与树脂突起的表面之间的粘附性，并且为了提高可靠性，载体基板包括成形为片状的金属基板， 半导体芯片是固定的，并且在半导体器件完成之前被去除，形成在与树脂突起相对应的金属基板的位置处并且具有粗糙的底表面和/或粗糙的侧表面的凹部和形成的镀膜 在凹槽的内表面上。

公开(公告)号：US06339261B1

公开(公告)日：2002-01-15

申请号：US09531273

申请日：2000-03-20

申请人： Masahiro Yonemochi ,  Toshiyuki Motooka ,  Hideharu Sakoda ,  Muneharu Morioka ,  Mamoru Suwa

发明人： Masahiro Yonemochi ,  Toshiyuki Motooka ,  Hideharu Sakoda ,  Muneharu Morioka ,  Mamoru Suwa

IPC分类号： H01L2348

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor device which comprises a semiconductor chip packaged in a resin package and having an electrode terminal wire-bonded to a conductor cap having one end defining an exposed top of an external connection terminal protruding from the resin package and the other end defining an orifice embedded in the resin package, wherein the orifice of the conductor cap has a radially outward extending flange which anchors the conductor cap to the resin package. The process of producing the semiconductor device is also disclosed.

摘要翻译： 一种半导体器件，其包括封装在树脂封装中的半导体芯片，并且具有引线接合到导体帽的电极端子，导体帽的一端限定从树脂封装件突出的外部连接端子的暴露顶部，另一端限定嵌入的孔 在树脂封装中，其中导体盖的孔具有径向向外延伸的凸缘，其将导体盖锚固到树脂封装。 还公开了制造半导体器件的工艺。

公开(公告)号：US5937277A

公开(公告)日：1999-08-10

申请号：US814106

申请日：1997-03-10

申请人： Tatsuharu Matsuda ,  Masataka Mizukoshi ,  Masaharu Minamizawa ,  Toshiyuki Motooka

发明人： Tatsuharu Matsuda ,  Masataka Mizukoshi ,  Masaharu Minamizawa ,  Toshiyuki Motooka

IPC分类号： H01L21/60 ,  H01L23/49 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15312 ,  Y10T29/49169

摘要： A method of forming a semiconductor device having a semiconductor chip having electrodes on which electrode pins are formed includes the steps of forming a complex having the electrode pins fixed in a fixing member, an arrangement of the electrode pins corresponding to that of the electrodes, connecting the electrode pins with the electrodes by mounting the complex on the semiconductor chip, and removing the fixing member from the complex mounted on the semiconductor chip.

摘要翻译： 一种形成半导体器件的方法，该半导体器件具有形成电极的电极的半导体芯片，包括以下步骤：形成具有固定在固定部件中的电极引脚的复合体，与电极引脚对应的电极引脚的布置 电极引脚与电极通过将复合体安装在半导体芯片上，以及从安装在半导体芯片上的复合体移除固定部件。

公开(公告)号：US5854558A

公开(公告)日：1998-12-29

申请号：US531449

申请日：1995-09-21

申请人： Toshiyuki Motooka ,  Syuichirou Takahashi ,  Tatsuharu Matsuda ,  Kunio Kodama ,  Jouji Fujimori

发明人： Toshiyuki Motooka ,  Syuichirou Takahashi ,  Tatsuharu Matsuda ,  Kunio Kodama ,  Jouji Fujimori

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  G01R31/02

CPC分类号： G01R1/06711 ,  G01R1/07314 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/06755 ,  G01R31/2863 ,  H01L2224/16225 ,  H01L2224/45144

摘要： A test board used for testing a semiconductor device provided with projection electrodes includes a main board and testing electrodes. The testing electrodes are provided on the main board, each projecting upwardly from the main board. When the semiconductor device is tested, the testing electrodes are electrically connected to the projection electrodes by insertion of the testing electrodes into the projection electrodes. The semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes.

摘要翻译： 用于测试具有投影电极的半导体器件的测试板包括主板和测试电极。 测试电极设置在主板上，每个从主板向上突出。 当测试半导体器件时，通过将测试电极插入投影电极中，测试电极与投影电极电连接。 半导体器件安装在主板上，以通过测试电极测试半导体器件。

公开(公告)号：US06573121B2

公开(公告)日：2003-06-03

申请号：US09809105

申请日：2001-03-16

申请人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

发明人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC分类号： H01L2144

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts. Outer circumference surfaces of the resin package are upright surfaces defined by cutting.

公开(公告)号：US06376921B1

公开(公告)日：2002-04-23

申请号：US09192201

申请日：1998-11-16

申请人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

发明人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC分类号： H01L2328

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.

摘要翻译： 半导体器件包括半导体元件，密封半导体元件的树脂封装，从树脂封装的安装表面向下突出的树脂突起，设置在树脂突起上的金属膜部分和将半导体元件电连接到金属膜的连接构件 部分。

公开(公告)号：US06348416B1

公开(公告)日：2002-02-19

申请号：US09455374

申请日：1999-12-06

申请人： Hideki Toya ,  Mitsuyoshi Imai ,  Masaki Sakaguchi ,  Naoki Yamabe ,  Mamoru Suwa ,  Toshiyuki Motooka ,  Hideharu Sakoda ,  Muneharu Morioka

发明人： Hideki Toya ,  Mitsuyoshi Imai ,  Masaki Sakaguchi ,  Naoki Yamabe ,  Mamoru Suwa ,  Toshiyuki Motooka ,  Hideharu Sakoda ,  Muneharu Morioka

IPC分类号： H01L21311

CPC分类号： H01L24/85 ,  H01L21/4832 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/85001 ,  H01L2224/85005 ,  H01L2224/85051 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate 12 which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess 16 formed at a position of the metal substrate 12 corresponding to the resin protuberance and having a rugged bottom surface 16a and/or a rugged side surface, and a plated film 14 formed on the inner surface of the recess 16.

摘要翻译： 为了提高作为半导体装置的外部连接端子的电镀膜与树脂突起的表面之间的粘附性并提高可靠性，载体基板包括成形为片状的金属基板12， 半导体芯片被固定，并且在半导体器件完成之前被去除，形成在与树脂突起相对应的金属基板12的位置处并具有粗糙的底表面16a和/或粗糙的侧表面的凹部16，以及 形成在凹部16的内表面上的镀膜14。

公开(公告)号：US06207477B1

公开(公告)日：2001-03-27

申请号：US09021954

申请日：1998-02-11

申请人： Toshiyuki Motooka ,  Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshimi Kawahara ,  Junichi Kasai

发明人： Toshiyuki Motooka ,  Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshimi Kawahara ,  Junichi Kasai

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method of fabricating a semiconductor device includes a step of attaching a circuit substrate on a semiconductor wafer in alignment with each other, providing an electrical interconnection between the circuit substrate and semiconductor devices formed in the wafer, providing solder bumps on the circuit substrate, and dicing the semiconductor wafer together with the circuit substrate thereon along a scribe line.

摘要翻译： 制造半导体器件的方法包括将电路基板彼此对准地连接在半导体晶片上的步骤，在电路基板和形成在晶片中的半导体器件之间提供电互连，在电路基板上提供焊料凸块，以及 将半导体晶片与其上的电路基板一起沿着划线切割。

公开(公告)号：US5831441A

公开(公告)日：1998-11-03

申请号：US612750

申请日：1996-03-08

申请人： Toshiyuki Motooka ,  Syuichirou Takahasi ,  Tatsuharu Matsuda ,  Kunio Kodama ,  Joji Fujimori ,  Shigeki Harada ,  Masataka Mizukoshi ,  Masashi Takenaka ,  Tatsuro Yamashita

发明人： Toshiyuki Motooka ,  Syuichirou Takahasi ,  Tatsuharu Matsuda ,  Kunio Kodama ,  Joji Fujimori ,  Shigeki Harada ,  Masataka Mizukoshi ,  Masashi Takenaka ,  Tatsuro Yamashita

IPC分类号： G01R1/04 ,  G01R1/073 ,  G01R31/02

CPC分类号： G01R1/0433 ,  G01R1/07364

摘要： A test board used for testing a semiconductor device provided with projection electrodes includes a main board and testing electrodes. The testing electrodes are provided on the main board, each projecting upwardly from the main board. When the semiconductor device is tested, the testing electrodes are electrically connected to the projection electrodes by insertion of the testing electrodes into the projection electrodes. The semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes.

摘要翻译： 用于测试具有投影电极的半导体器件的测试板包括主板和测试电极。 测试电极设置在主板上，每个从主板向上突出。 当测试半导体器件时，通过将测试电极插入投影电极中，测试电极与投影电极电连接。 半导体器件安装在主板上，以通过测试电极测试半导体器件。

公开(公告)号：US5637535A

公开(公告)日：1997-06-10

申请号：US371370

申请日：1995-01-11

申请人： Tatsuharu Matsuda ,  Masataka Mizukoshi ,  Masaharu Minamizawa ,  Toshiyuki Motooka

发明人： Tatsuharu Matsuda ,  Masataka Mizukoshi ,  Masaharu Minamizawa ,  Toshiyuki Motooka

IPC分类号： H01L21/60 ,  H01L23/49

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15312 ,  Y10T29/49169

摘要： A method of forming a semiconductor device having a semiconductor chip having electrodes on which electrode pins are formed includes the steps of forming a complex having the electrode pins fixed in a fixing member, an arrangement of the electrode pins corresponding to that of the electrodes, connecting the electrode pins with the electrodes by mounting the complex on the semiconductor chip, and removing the fixing member from the complex mounted on the semiconductor chip.

摘要翻译： 一种形成半导体器件的方法，该半导体器件具有形成电极的电极的半导体芯片，包括以下步骤：形成具有固定在固定部件中的电极引脚的复合体，与电极引脚对应的电极引脚的布置 电极引脚与电极通过将复合体安装在半导体芯片上，以及从安装在半导体芯片上的复合体移除固定部件。