摘要:
Disclosed are an oil state monitoring method and an oil state monitoring device which monitor the state of degradation of oil used in machinery or equipment. In monitoring the oil state by the oil state monitoring method and by the oil state monitoring device, oil used in machinery or equipment is filtered when the degradation state of the aforementioned oil is to be monitored. By means of filtration, the oil content is removed from the filter which captured contaminants that were present in oil prior to filtration. Light is projected onto the filter from which oil was removed. The projected light detects the color components of the transmitted light which penetrated the aforementioned filter.
摘要:
Disclosed are an oil state monitoring method and an oil state monitoring device which monitor the state of degradation of oil used in machinery or equipment. In monitoring the oil state by the oil state monitoring method and by the oil state monitoring device, oil used in machinery or equipment is filtered when the degradation state of the aforementioned oil is to be monitored. By means of filtration, the oil content is removed from the filter which captured contaminants that were present in oil prior to filtration. Light is projected onto the filter from which oil was removed. The projected light detects the color components of the transmitted light which penetrated the aforementioned filter.
摘要:
According to one embodiment, a semiconductor device includes a first semiconductor element, a first electrode, a ball part, a second electrode, and a wire. The first electrode is electrically connected to the first semiconductor element. The ball part is provided on the first electrode. The wire connects the ball part and the second electrode. A thickness of a turned-back portion at an end of the wire on a side opposite to the second electrode is smaller than a diameter of the wire.
摘要:
According to one embodiment, a semiconductor device includes a first semiconductor element, a first electrode, a ball part, a second electrode, and a wire. The first electrode is electrically connected to the first semiconductor element. The ball part is provided on the first electrode. The wire connects the ball part and the second electrode. A thickness of a turned-back portion at an end of the wire on a side opposite to the second electrode is smaller than a diameter of the wire.