Semiconductor integrated circuit device and process for producing the same
    1.
    发明申请
    Semiconductor integrated circuit device and process for producing the same 失效
    半导体集成电路器件及其制造方法

    公开(公告)号:US20050014326A1

    公开(公告)日:2005-01-20

    申请号:US10899119

    申请日:2004-07-27

    摘要: A semiconductor integrated circuit device with third gates comprising second conduction type source/drain diffusion layer regions 205 formed first conduction type well 201, floating gates 203b formed on semiconductor substrate 200 through an insulator film 202, control gates 211a formed on floating gates 203b through nitrogen-introduced silicon oxide film 210a and third gates 207a different from the floating gates and the control gates, formed through the semiconductor substrates, the floating gates, the control gates and the insulator film, where the third gates are formed as filled in gaps between the floating gates existing in a vertical direction to word lines and channels and the height of third gates 207a thus formed is made lower than that of floating gates 203b, has improved reduction of memory cell size and operating speed and improved reliability after programming/erasing cycles.

    摘要翻译: 具有第三栅极的半导体集成电路器件包括形成在第一导电型阱201的第二导电型源极/漏极扩散层区域205,通过绝缘膜202形成在半导体衬底200上的浮动栅极203b,通过氮气形成在浮动栅极203b上的控制栅极211a 引入与通过半导体衬底,浮动栅极,控制栅极和绝缘膜形成的浮动栅极和控制栅极不同的氧化硅膜210a和第三栅极207a,其中第三栅极形成为填充在第 存在于字线和沟道的垂直方向的浮动栅极和由此形成的第三栅极207a的高度低于浮置栅极203b的高度,改善了编程/擦除周期后存储单元尺寸和操作速度的降低以及改进的可靠性。

    Dynamic random access memory having trench capacitors and vertical
transistors
    6.
    发明授权
    Dynamic random access memory having trench capacitors and vertical transistors 失效
    具有沟槽电容器和垂直晶体管的动态随机存取存储器

    公开(公告)号:US5177576A

    公开(公告)日:1993-01-05

    申请号:US695984

    申请日:1991-05-06

    CPC分类号: H01L27/10841

    摘要: A vertical semiconductor memory device is provided which capable of miniaturization. More particularly, a memory cell is provided having a trench capacitor and a vertical transistor in a dynamic random access memory suitable for high density integration. An object of this arrangement is to provide a vertical memory cell capable of miniaturization for use in a ultra-high density integration DRAM of a Gbit class. This memory cell is characterized in that each memory cell is covered with an oxide film, an impurity area does not exist on the substrate side, an area in which a channel area is formed is a hollow cylindrical single crystal area, connection of impurity areas as source-drain areas and bit lines and the electrode of a capacitor is made by self-alignment and connection between a word line electrode and a gate electrode is also made by self-alignment.

    摘要翻译: 提供能够小型化的垂直半导体存储器件。 更具体地说,在动态随机存取存储器中提供具有沟槽电容器和垂直晶体管的存储单元,其适用于高密度集成。 这种布置的目的是提供一种能够小型化的垂直存储单元,用于Gbit级的超高密度集成DRAM。 该存储单元的特征在于,每个存储单元被氧化物膜覆盖,基板侧不存在杂质区域,形成沟道区域的区域是中空圆柱形单晶区域,杂质区域的连接为 源极 - 漏极区域和位线,并且电容器的电极通过自对准而形成,并且字线电极和栅电极之间的连接也通过自对准来进行。