Abstract:
A magnetic memory according to the present invention comprises: a single magnetic memory cell having at least first to third magnetic layers, a first tunnel insulating layer between the first and second magnetic layers and a second tunnel insulating layer between the second and third magnetic layers. The resistance between the first and third magnetic layers when magnetization of the first and second magnetic layers are in opposite directions is different from the resistance between the second and third magnetic layers when magnetization of the second and third magnetic layers are in opposite directions. Multiple data are therefore stored into the memory cell.
Abstract:
A semiconductor memory device as claimed in the present invention has a reference cell, a first memory cell, a second memory cell located nearer the first memory cell than the reference cell and a data read circuit provided therein. The data read circuit identifies first data stored in the first memory cell based on a reference cell electrical state of the reference cell and a first electrical state of the first memory cell. Furthermore, the data read circuit identifies second data stored in the second memory cell based on the first electrical state of the first memory cell and a second electrical state of the second memory cell. The semiconductor memory device having such configuration is able to suppress influence of variation in electrical performance of memory cell and stably identify data stored in a memory cell.
Abstract:
A magnetic memory according to the present invention comprises: a single magnetic memory cell having at least first to third magnetic layers, a first tunnel insulating layer between the first and second magnetic layers and a second tunnel insulating layer between the second and third magnetic layers. The resistance between the first and third magnetic layers when magnetization of the first and second magnetic layers are in opposite directions is different from the resistance between the second and third magnetic layers when magnetization of the second and third magnetic layers are in opposite directions. Multiple data are therefore stored into the memory cell.
Abstract:
A flash EEPROM with sector erasure, carries out the erasure by applying a negative voltage to a selected word line through an N-channel MOS transistor. P-channel MOS transistors are respectively inserted between row decoder level shifters and each of their respective word lines to which they are respectively connected. The turning-on and -off of the respective word lines and first level shifters is controlled by the turning-on and -off of the associated P-channel MOS transistor. An erase voltage is applied to one end of the source/drain path of the respective N-channel MOS transistor of the selected cord line, the other end to the respective word lines. The turning-on and -off of the N-channel MOS transistor is synchronized with the turning-on and -off of the P-channel MOS transistor connected to the same word line. The P-channel MOS transistor is formed on an N well biased to, for example, 5 V and the N-channel MOS transistor is formed on a P well biased to, for example, the erase voltage. The P well is formed on the surface of the N well.
Abstract:
A method of controlling the nonvolatile memory device comprising making over-erasing simultaneously a set of EEPROM elements and then setting simultaneously the threshold voltages of said set of EEPROM elements back to the specified threshold-voltage values. The over-erasing is accomplished by applying a first pulse between the source and the control gate to induce the first FN current across the gate insulating film. The setting-back is accomplished by applying a second pulse between the well and the control gate to induce the second FN current flowing reversely to the first FN current.
Abstract:
According to the semiconductor memory device of this invention, an XP type MRAM cell array and an STr type MRAM cell array are formed on a single chip. The XP type MRAM cell array is laid over the STr type MRAM cell array to form a layered structure. The STr type MRAM cell array serves as a work memory area, while the XP type MRAM cell array serves as a data storage area. A cell of the XP type MRAM cell array and a cell of the STr type MRAM cell array may be connected to a same bit-line. By passing predetermined current through the bit-line, and passing current through a first word-line connected to the cell of the XP type MRAM cell array, and through a second word-line connected to the cell of the STr type MRAM cell array, it is possible to simultaneously write data into the cells of the XP and STr type MRAM cell arrays.
Abstract:
A magnetic memory device of the present invention includes a first wiring conductor having a first ability to flow a current therethrough, a second wiring conductor having a second ability larger than the first ability to flow a current therethrough, a magnetic memory cell having a pinned magnetic layer coupled to the second wiring conductor, a free magnetic layer coupled to the first wiring conductor and anon-magnetic layer sandwiched between the first and second magnetic layers. The first wiring conductor is made by aluminum and the second wiring conductor is made by copper.
Abstract:
The present invention provides a memory cell array structure comprising: a plurality of cell array blocks aligned in matrix in both the row and column directions, and each of the cell array blocks including a plurality of magnetic memory cells; a plurality of main word lines being connected through sub-word switching devices to the same number of sub-word lines as a first number of the cell array blocks aligned in the row direction, and each of the sub-word lines being connected to at least one of the magnetic memory cells; and a plurality of main bit lines being connected through sub-bit switching devices to the same number of sub-bit lines as a second number of the cell array blocks aligned in the column direction, and each of the sub-bit lines being connected to at least one of the magnetic memory cells.
Abstract:
A flash memory includes a plurality of MOSFETs. Each of the MOSFETs comprises a first conductive type substrate, a source, and a drain. The source and the drain are formed on one major surface of the substrate. A floating gate is situated over the major surface via a first insulation layer in a manner to control a current flowing through a channel between the source and the drain. The floating gate is highly resistive so as to essentially hold electrons in the region into which they were are injected from a depletion layer formed in the channel. A control gate is further provided over the floating gate via a second insulation layer.
Abstract:
A plurality of semiconductor memory cells are arranged in the form of a matrix and capable of electrically erasing and re-programming. Each of word lines is provided commonly to the memory cells in each row of the matrix and commonly connected to the gates of these memory cells, and each of bit lines is provided commonly to the memory cells in each column of the matrix and commonly connected to the drains of these memory cells. Each of common source lines is commonly connected to the sources of the memory cells in each pair of adjacent rows of the matrix. A memory cell group in a predetermined row or row pair of the matrix is operative as a redundant memory cell group for replacement of the other group.