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    Printed circuit board package structure and manufacturing method thereof
    2.
    发明授权
    Printed circuit board package structure and manufacturing method thereof 有权
    印刷电路板封装结构及其制造方法

    公开(公告)号：US09258888B2

    公开(公告)日：2016-02-09

    申请号：US14205344

    申请日：2014-03-11

    Applicant: TRIPOD TECHNOLOGY CORPORATION

    Inventor： Bo-Shiung Huang ,  Wei-Hsiung Yang ,  Han-Ching Shih ,  Cheng-Feng Lin

    IPC: H01F5/00 ,  H01F27/28 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46 ,  H05K3/42 ,  H01F17/00 ,  H01F17/06

    CPC classification number: H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

    Abstract: A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

    Abstract translation: 印刷电路板封装结构包括具有第一表面和第二表面的基板，环形磁性元件，粘合剂层，导电部分和导电通道。 第一表面和第二表面分别具有第一和第二金属部分。 在未被第一表面的第一金属部分覆盖的位置处形成环形凹部。 环形磁性元件放置在环形凹部中。 粘合剂层覆盖第一金属部分和环形磁性元件。 导电部分形成在粘合剂层上。 导电通道穿透导电部分，粘合剂层和基底，并且分别位于环形凹部的内壁和外壁外侧。 每个导电通道包括导电膜电连接到对准的导电部分和第二金属部分。

    PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    印刷电路板封装结构及其制造方法

    公开(公告)号：US20140266549A1

    公开(公告)日：2014-09-18

    申请号：US14205344

    申请日：2014-03-11

    Applicant: TRIPOD TECHNOLOGY CORPORATION

    Inventor： Bo-Shiung HUANG ,  Wei-Hsiung YANG ,  Han-Ching SHIH ,  Cheng-Feng LIN

    IPC: H05K1/02 ,  H05K3/42 ,  H01F27/28

    CPC classification number: H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

    Abstract: A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

    Abstract translation: 印刷电路板封装结构包括具有第一表面和第二表面的基板，环形磁性元件，粘合剂层，导电部分和导电通道。 第一表面和第二表面分别具有第一和第二金属部分。 在未被第一表面的第一金属部分覆盖的位置处形成环形凹部。 环形磁性元件放置在环形凹部中。 粘合剂层覆盖第一金属部分和环形磁性元件。 导电部分形成在粘合剂层上。 导电通道穿透导电部分，粘合剂层和基底，并且分别位于环形凹部的内壁和外壁外侧。 每个导电通道包括导电膜电连接到对准的导电部分和第二金属部分。

    Method of making colloidal metal nanoparticles
    6.
    发明授权
    Method of making colloidal metal nanoparticles 有权

    公开(公告)号：US10099191B1

    公开(公告)日：2018-10-16

    申请号：US15630838

    申请日：2017-06-22

    Applicant: TRIPOD TECHNOLOGY CORPORATION

    Inventor： Lin Lu ,  Kuei-Sheng Fan ,  Chen-Hsiang Wang ,  Chun-Lun Chiu ,  Ta-Wei Chang ,  Cheng-Ding Wang ,  Jim-Min Fang

    IPC: B82Y30/00 ,  B01J13/00

    Abstract: Provided is a method of making colloidal metal nanoparticles. The method includes the steps of: mixing a metal aqueous solution and a reducing agent to form a mixture solution in a reaction tank; heating the mixture solution and undergoing a reduction reaction to produce a composition containing metal nanoparticles, residues and gas, wherein the amount of the residues is less than 20% by volume of the mixture solution, and guiding the gas out of the reaction tank; dispersing the metal nanoparticles with a medium to obtain colloidal metal nanoparticles. By separating the reduction reaction step and the dispersion step, the method of making colloidal metal nanoparticles is simple, safe, time-effective, cost-effective, and has the advantage of high yield.

    Method of making inorganic gold compound
    7.
    发明授权
    Method of making inorganic gold compound 有权

    公开(公告)号：US10046976B1

    公开(公告)日：2018-08-14

    申请号：US15415391

    申请日：2017-01-25

    Applicant: TRIPOD TECHNOLOGY CORPORATION

    Inventor： Lin Lu ,  Chen-Hsiang Wang ,  Kuei-Sheng Fan ,  Cheng-Ding Wang ,  Jim-Min Fang

    IPC: C01G7/00 ,  C01C3/10

    Abstract: A method of making the inorganic gold compound, such as tetrachloroauric acid, sodium tetrachloroaurate, potassium tetrachloroaurate, sodium tetracyanoaurate, and potassium tetracyanoaurate, includes the step of: treating gold with a halogen-containing oxidizing agent in a hydrochloric acid to obtain the inorganic gold compound, wherein the halogen-containing oxidizing agent excludes chlorine gas. The method of making the inorganic gold compound is simple, safe, time-effective, cost-effective, and environment-friendly, and has the advantage of high yield.

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