公开(公告)号：US20140266549A1

公开(公告)日：2014-09-18

申请号：US14205344

申请日：2014-03-11

Applicant: TRIPOD TECHNOLOGY CORPORATION

Inventor： Bo-Shiung HUANG ,  Wei-Hsiung YANG ,  Han-Ching SHIH ,  Cheng-Feng LIN

IPC: H05K1/02 ,  H05K3/42 ,  H01F27/28

CPC classification number: H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

Abstract: A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

Abstract translation: 印刷电路板封装结构包括具有第一表面和第二表面的基板，环形磁性元件，粘合剂层，导电部分和导电通道。 第一表面和第二表面分别具有第一和第二金属部分。 在未被第一表面的第一金属部分覆盖的位置处形成环形凹部。 环形磁性元件放置在环形凹部中。 粘合剂层覆盖第一金属部分和环形磁性元件。 导电部分形成在粘合剂层上。 导电通道穿透导电部分，粘合剂层和基底，并且分别位于环形凹部的内壁和外壁外侧。 每个导电通道包括导电膜电连接到对准的导电部分和第二金属部分。