Plasma processing including asymmetrically grounding a susceptor
    5.
    发明授权
    Plasma processing including asymmetrically grounding a susceptor 有权
    等离子体处理包括不对称接地的感受器

    公开(公告)号:US08877301B2

    公开(公告)日:2014-11-04

    申请号:US13153641

    申请日:2011-06-06

    摘要: An asymmetrically grounded susceptor used in a plasma processing chamber for chemical vapor deposition onto large rectangular panels supported on and grounded by the susceptor. A plurality of grounding straps are connected between the periphery of the susceptor to the grounded vacuum chamber to shorten the grounding paths for RF electrons. Flexible straps allow the susceptor to vertically move. The straps provide a conductance to ground which is asymmetric around the periphery. The straps may be evenly spaced but have different thicknesses or different shapes or be removed from available grounding point and hence provide different RF conductances. The asymmetry is selected to improve the deposition uniformity and other qualities of the PECVD deposited film.

    摘要翻译: 用于等离子体处理室中的不对称接地的基座,用于化学气相沉积到由基座支撑并接地的大矩形面板上。 多个接地带连接在基座的外围与接地的真空室之间,以缩短RF电子的接地路径。 柔性带允许基座垂直移动。 带子提供对周边不对称的地面电导。 带可以是均匀间隔的,但是具有不同的厚度或不同的形状,或者从可用的接地点去除并因此提供不同的RF电导。 选择不对称性以改善PECVD沉积膜的沉积均匀性和其他质量。

    FLIP EDGE SHADOW FRAME
    6.
    发明申请
    FLIP EDGE SHADOW FRAME 审中-公开
    卷边边框

    公开(公告)号:US20140251216A1

    公开(公告)日:2014-09-11

    申请号:US13789188

    申请日:2013-03-07

    IPC分类号: C23C16/04

    摘要: Device for processing a substrate are described herein. An apparatus for controlling deposition on a substrate can include a chamber comprising a shadow frame support, a substrate support comprising a substrate supporting surface, a shadow frame with a shadow frame body including a first support surface, a second support surface opposite the first surface, and a detachable lip connected with the shadow frame body. The detachable lip can include a support connection, a first lip surface facing the substrate, a second lip surface opposite the first lip surface, a first edge positioned over the first support surface, and a second edge opposite the first edge to contact the substrate.

    摘要翻译: 本文描述了用于处理衬底的装置。 用于控制基板上的沉积的装置可以包括:腔室,其包括阴影框架支撑件,包括基板支撑表面的基板支撑件,具有包括第一支撑表面的阴影框架主体的阴影框架,与第一表面相对的第二支撑表面, 以及与阴影框体连接的可拆卸唇缘。 可拆卸唇缘可以包括支撑连接,面向基底的第一唇缘表面,与第一唇缘表面相对的第二唇缘表面,位于第一支撑表面上方的第一边缘以及与第一边缘相对的第二边缘以接触基底。

    Detecting plasma chamber malfunction
    7.
    发明授权
    Detecting plasma chamber malfunction 有权
    检测等离子体室故障

    公开(公告)号:US08674844B2

    公开(公告)日:2014-03-18

    申请号:US12661699

    申请日:2010-03-19

    IPC分类号: G08B21/00

    摘要: Malfunction of a component within an RF-powered plasma chamber is detected by observing an operating condition of the plasma chamber and detecting when the operating condition deviates from a previously observed range bounded by lower and upper limits. The lower and upper limits are determined by observing the minimum and maximum values of that operating condition during the processing of workpieces throughout one or more plasma chamber cleaning cycles immediately preceding the most recent cleaning of the plasma chamber.

    摘要翻译: 通过观察等离子体室的操作状态并检测何时操作条件偏离由下限和上限限定的先前观察范围,来检测RF供电的等离子体室内部件的故障。 通过在紧邻等离子体室的最近清洁之前的一个或多个等离子体室清洁循环期间观察工件处理期间该操作条件的最小值和最大值来确定下限和上限。