公开(公告)号：US20130149215A1

公开(公告)日：2013-06-13

申请号：US13755293

申请日：2013-01-31

Applicant: Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

Inventor： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

IPC: H01L37/00 ,  B01L3/00

CPC classification number: H01L37/00 ,  B01J2219/00783 ,  B01J2219/0095 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2200/14 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2300/1883 ,  B01L2400/0415 ,  B81B2201/058 ,  B81C1/0023 ,  H01L2224/11 ,  Y10T436/11

Abstract: The present invention relates to an integrated electronic-microfluidic device an integrated electronic-microfluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A microfluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-microfluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.

Abstract translation: 本发明涉及一种集成电子微流体装置，集成的电子微流体装置，其包括在第一（122）支撑件上的半导体衬底（106），电子电路（102,104）的第一半导体衬底 半导体衬底和与外部设备的信号接口结构。 信号接口结构布置在第一半导体衬底侧并被配置为从电子电路接收电信号。 微流体结构（126）形成在半导体衬底中，并且被配置为限制流体并允许仅在与第一半导体衬底相反的第二半导体衬底侧上流体流过微流体结构， 衬底侧面和背面形成第一支撑件。 电子微流体装置形成用于形成各种系统级封装应用的灵活平台。 它实现了电气和湿化学界面之间的清晰分离。 所要求的制造本发明装置的方法还允许简单地形成热分离的微流体结构。

公开(公告)号：US20120116209A1

公开(公告)日：2012-05-10

申请号：US13265387

申请日：2010-04-13

Applicant: Mareike Klee ,  Axel Winkel ,  John Brean Mills ,  Ronald Dekker ,  Bernardus Hendrikus Wilhelmus Hendriks

Inventor： Mareike Klee ,  Axel Winkel ,  John Brean Mills ,  Ronald Dekker ,  Bernardus Hendrikus Wilhelmus Hendriks

IPC: A61B5/055 ,  H01L21/822 ,  H01F41/00

CPC classification number: G01R33/287 ,  G01R33/34007 ,  G01R33/34084 ,  Y10T29/4902

Abstract: An elongate device (e.g. a catheter) for interventional MRI has one or more passive LC-circuits (wireless markers) attached to its distal tip portion for position tracking. The LC-circuits comprise an inductor winding (480) and a three-dimensional “trench” capacitor (420-440) and are integrated in a piece of silicon (410). Optical fibres may be included in the device for optical probing of tissue surrounding the distal tip portion.

Abstract translation: 用于介入MRI的细长装置（例如，导管）具有附接到其远侧末端部分的位置跟踪的一个或多个无源LC电路（无线标记）。 LC电路包括电感器绕组（480）和三维“沟槽”电容器（420-440）并且集成在一块硅片（410）中。 光纤可以包括在用于光学探测围绕远端尖端部分的组织的装置中。

公开(公告)号：US20120094323A1

公开(公告)日：2012-04-19

申请号：US13147607

申请日：2010-02-02

Applicant: Ronald Dekker ,  Anja Van De Stolpe

Inventor： Ronald Dekker ,  Anja Van De Stolpe

IPC: C12Q1/18 ,  H01B13/00 ,  B05D5/00 ,  C12M1/34 ,  B05D1/36

CPC classification number: G01N1/30 ,  C12N5/0657 ,  C12N2503/02 ,  C12N2535/10 ,  G01N33/5061

Abstract: Disclosed is a device for determining the cardiotoxicity of a chemical compound, comprising a substrate (10) carrying a deformable stack (34), said stack being partially detached from the substrate by a cavity (32) allowing an out-of-plane deformation of the stack, said stack comprising a first deformable layer (16), a second deformable layer (20) and a multi-electrode structure (18) sandwiched between the first and second deformable layers, the second deformable layer carrying a pattern of cardiomyocytes (28) adhered thereto; and a liquid container (26) mounted on the substrate for exposing the cardiomyocytes to the chemical compound. A method of manufacturing such a device is also disclosed. The present invention further relates to the use of the device for drug target discovery and/or drug development and a method for developing a disease model for a disease that is caused by or modified by stretching of cells, in particular a cardiac disease model.

Abstract translation: 公开了一种用于确定化合物的心脏毒性的装置，包括承载可变形叠层（34）的基底（10），所述叠层通过空腔（32）部分地与基底分离，允许外部变形 所述堆叠包括夹在所述第一和第二可变形层之间的第一可变形层（16），第二可变形层（20）和多电极结构（18），所述第二可变形层承载心肌细胞图案（28 ） 和安装在基板上的用于将心肌细胞暴露于化合物的液体容器（26）。 还公开了制造这种装置的方法。 本发明还涉及该装置用于药物靶发现和/或药物开发的用途，以及用于开发由细胞拉伸，特别是心脏疾病模型引起或改变的疾病的疾病模型的方法。

公开(公告)号：US07915707B2

公开(公告)日：2011-03-29

申请号：US12377673

申请日：2007-08-07

Applicant: Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodoros Zoumpoulidis

Inventor： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodoros Zoumpoulidis

IPC: H01L29/00

CPC classification number: H01L23/49833 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated-circuit device includes a rigid substrate island having a main substrate surface with a circuit region circuit elements and at least one fold structure. The fold structure is attached to the substrate island and is unfoldable from a relaxed, folded state to a strained unfolded state. The fold structure contains at least one passive electrical component. The fold structure further has in its folded state at least one surface with an area vector that includes a non-vanishing area-vector component in a direction parallel to the main substrate surface, which area-vector component is diminished or vanishes when deforming the fold structure from the folded into the unfolded state.

Abstract translation: 集成电路器件包括具有主衬底表面的刚性衬底岛，其具有电路区域电路元件和至少一个折叠结构。 折叠结构附接到基底岛，并且可以从松弛的折叠状态展开到应变展开状态。 折叠结构包含至少一个无源电组件。 折叠结构在其折叠状态下进一步具有面向向的至少一个表面，该区域向量在平行于主衬底表面的方向上包括非消失的面积 - 矢量分量，该区域 - 矢量分量在折叠变形时减少或消失 结构从折叠到展开状态。

公开(公告)号：US07893632B2

公开(公告)日：2011-02-22

申请号：US11719298

申请日：2005-11-15

Applicant: Eduard Johannes Meijer ,  Ronald Dekker ,  Eugene Timmering ,  Christoph Gerard August Hoelen ,  Johannes Petrus Maria Ansems

Inventor： Eduard Johannes Meijer ,  Ronald Dekker ,  Eugene Timmering ,  Christoph Gerard August Hoelen ,  Johannes Petrus Maria Ansems

IPC: H05B37/00 ,  F21V5/00 ,  F21V5/04

CPC classification number: F21V23/0442 ,  F21S10/02 ,  F21V23/0457 ,  F21Y2115/10 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0414 ,  G01J1/32 ,  G02B19/0028 ,  G02B19/0066 ,  G02B19/0085 ,  H01L25/167 ,  H01L2924/0002 ,  H05B33/0869 ,  H05B37/029 ,  H01L2924/00

Abstract: The present invention relates to a luminaire comprising an array of LEDs emitting light of at least one color, and a control system for controlling the light output of the luminaire. The control system comprises photosensor array for detecting light output of the luminaire. An imaging unit is arranged in front of the photosensor array such that it maps an image of said array of LEDs on said photosensor array. The photosensor array is divided into subareas each detecting light output from a single one of the LEDs. The control system uses the output of the subareas for controlling the luminaire light output. Thus, it is possible to act on different LED light colors or the light output of individual LEDs without having to separate them in time by means of a time pulsing method.

Abstract translation: 本发明涉及一种包括发射至少一种颜色的光的LED阵列的照明器和用于控制照明器的光输出的控制系统。 控制系统包括用于检测照明器的光输出的光电传感器阵列。 成像单元布置在光电传感器阵列的前面，使得它将所述LED阵列的图像映射在所述光传感器阵列上。 光传感器阵列被分成每个检测来自单个LED的光输出的子区域。 控制系统使用子区域的输出来控制照明器光输出。 因此，可以通过时间脉冲方式对不同的LED光颜色或各个LED的光输出作用，而不必在时间上分离它们。

公开(公告)号：US07891836B2

公开(公告)日：2011-02-22

申请号：US11577367

申请日：2005-10-17

Applicant: Ronald Dekker ,  Eduard Johannes Meijer ,  Eugene Timmering ,  Marc Andre De Samber

Inventor： Ronald Dekker ,  Eduard Johannes Meijer ,  Eugene Timmering ,  Marc Andre De Samber

IPC: F21V4/00

CPC classification number: H01L33/647 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: The present invention relates to a light-emitting device comprising a substrate, a circuitry, a LED in electrical connection with said circuitry, and a heat sink arranged to transport heat away from the LED, wherein the LED is in thermal contact with said heat sink through an opening in said substrate. The present invention also relates to methods for the manufacture of such a device.

Abstract translation: 本发明涉及一种发光装置，其包括基板，电路，与所述电路电连接的LED，以及布置成将热量从LED传送的散热器，其中所述LED与所述散热片热接触 通过所述衬底中的开口。 本发明还涉及制造这种装置的方法。

公开(公告)号：US20100270640A1

公开(公告)日：2010-10-28

申请号：US12377673

申请日：2007-08-07

Applicant: Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodoros Zoumpoulidis

Inventor： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodoros Zoumpoulidis

IPC: H01L23/52 ,  H01L21/98

CPC classification number: H01L23/49833 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated-circuit device is provided, which comprises a rigid substrate island having a main substrate surface with a circuit region circuit elements and at least one fold structure. The fold structure is attached to the substrate island and is unfoldable from a relaxed, folded state to a strained unfolded state. The fold structure contains at least one passive electrical component. The fold structure further has in its folded state at least one surface with an area vector that includes a non-vanishing area-vector component in a direction parallel to the main substrate surface, which area-vector component is diminished or vanishes when deforming the fold structure from the folded into the unfolded state. The fold structure provided by the present invention allows fabricating the integrated-circuit device with small lateral extensions and thus takes up a particularly small amount of chip area, which reduces the cost per device.

Abstract translation: 提供了一种集成电路器件，其包括具有主衬底表面的刚性衬底岛，其具有电路区域电路元件和至少一个折叠结构。 折叠结构附接到基底岛，并且可以从松弛的折叠状态展开到应变展开状态。 折叠结构包含至少一个无源电组件。 折叠结构在其折叠状态下进一步具有面向向的至少一个表面，该区域向量在平行于主衬底表面的方向上包括非消失的面积 - 矢量分量，该区域 - 矢量分量在折叠变形时减少或消失 结构从折叠到展开状态。 由本发明提供的折叠结构允许制造具有小横向延伸的集成电路器件，因此占据特别小量的芯片面积，这降低了每个器件的成本。

公开(公告)号：US20100045440A1

公开(公告)日：2010-02-25

申请号：US12447678

申请日：2007-10-31

Applicant: Remco Henricus Wilhelmus Pijnenburg ,  Youri Victorovitch Ponomarev ,  Matthias Merz ,  Ronald Dekker

Inventor： Remco Henricus Wilhelmus Pijnenburg ,  Youri Victorovitch Ponomarev ,  Matthias Merz ,  Ronald Dekker

IPC: H04Q5/22

CPC classification number: G06K19/0723 ,  G06K7/0008

Abstract: The invention relates to a remotely readable electronic device (10), particularly an implantable device, with an O associated reader (20). The device comprises a resonance circuit (12) that can selectively be set into one of at least three different resonance states, wherein this state can wirelessly be sensed by the remote reader. In a particular embodiment, the resonance circuit (12) comprises two capacitors (C1, C2) that can selectively be connected or disconnected to the resonance circuit (12). The reader (20) preferably scans a given frequency range to detect spectral absorption patterns that correspond to certain resonance states of the resonance circuit (12).

Abstract translation: 本发明涉及一种具有O相关阅读器（20）的远程可读电子设备（10），特别是可植入设备。 该装置包括可选择性地设置为至少三种不同共振状态中的一种的谐振电路（12），其中该状态可以由远程读取器无线地感测。 在一个具体实施例中，谐振电路（12）包括两个电容器（C1，C2），可以选择性地连接或断开到谐振电路（12）。 读取器（20）优选地扫描给定的频率范围以检测对应于谐振电路（12）的某些谐振状态的光谱吸收模式。

公开(公告)号：US20080150118A1

公开(公告)日：2008-06-26

申请号：US11816750

申请日：2006-02-27

Applicant: Nicolaas Johannes Anthonius Van Veen ,  Ronald Dekker ,  Coen C. Tak

Inventor： Nicolaas Johannes Anthonius Van Veen ,  Ronald Dekker ,  Coen C. Tak

IPC: H01L23/52 ,  H01L23/48 ,  H01L21/02

CPC classification number: H01L23/5389 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/24226 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2224/82 ,  H01L2924/00

Abstract: The flexible package (100) has between a first (1) and a second side (2) a semiconductor device (20) with a thinned back substrate (10) and an interconnect structure. Contact means (31,33) for external contact and a first resin layer (52) are present at the first side (2) of the package (100), which contact means (31,33) are coupled to the interconnect structure. At the second side (2) the semiconductor device (20) is at least substantially covered with a second resin layer (12). The contact means (31,33) are present on the first resin layer (52) and are coupled to the interconnect structure with redistribution tracks (32,34) extending through the first resin layer (52). A passivation layer (55) covers the first resin layer (52) and the redistribution tracks (32,34) at least substantially.

Abstract translation: 柔性封装（100）在第一（1）和第二侧（2）之间具有带有薄的背衬基板（10）和互连结构的半导体器件（20）。 用于外部接触的接触装置（31,33）和第一树脂层（52）存在于封装（100）的第一侧（2）处，该接触装置（31,33）联接到互连结构。 在第二侧（2），半导体器件（20）至少基本被第二树脂层（12）覆盖。 接触装置（31,33）存在于第一树脂层（52）上，并且通过延伸穿过第一树脂层（52）的再分布轨道（32,34）与互连结构耦合。 钝化层（55）至少基本上覆盖第一树脂层（52）和再分布轨道（32,34）。

公开(公告)号：US20060046439A1

公开(公告)日：2006-03-02

申请号：US10527777

申请日：2003-08-21

Applicant: Ronald Dekker ,  Jan Baptist Van Der Putten ,  Ramon Havens

Inventor： Ronald Dekker ,  Jan Baptist Van Der Putten ,  Ramon Havens

IPC: H01L21/20 ,  H01L21/30 ,  H01L21/332 ,  H01L21/8234 ,  H01L21/50

CPC classification number: H01L29/66712 ,  H01L21/78 ,  H01L29/6631 ,  H01L29/781

Abstract: The invention relates to a method of manufacturing a semiconductor device (10) in which, in a semiconductor body (1) with a temporary substrate (2), at least one semiconductor element (3) is formed which, on a side of the semiconductor body (1) opposite to the substrate (2), is provided with at least one connection region (4), and, on the said side, a dielectric (5) is formed and patterned to leave free the connection region (4), after which a metal layer (6) is deposited over the dielectric (5) so as to be in contact with the connection region (4), which metal layer (6) serves as an electric connection conductor of the connection region (4), after which the temporary substrate (2) is removed and the metal layer (6) also serves as a substrate of the device (10). According to the invention, before the metal layer (6) is deposited, there is formed, around the patterned part of the dielectric (5) and around the semiconductor element (3), an annular region (7) of a resin having a larger thickness than the dielectric (5), and the metal layer (6) is deposited within the rectangular annular region (7). In this way, an individual device (10) can readily be formed after the metal layer (6) has been deposited, preferably by pushing the device (10) out of the region (7). Preferably, a (different) photoresist is chosen for the dielectric (5) and the region (7). The invention also comprises a semiconductor device (10) obtained in this way.

Abstract translation: 本发明涉及一种制造半导体器件（10）的方法，其中在具有临时衬底（2）的半导体本体（1）中，形成至少一个半导体元件（3），其在半导体 本体（1）与基板（2）相对设置有至少一个连接区域（4），并且在所述侧面上形成有电介质（5）并图案化以使连接区域（4）免费， 之后将金属层（6）沉积在电介质（5）上以与连接区域（4）接触，该金属层（6）用作连接区域（4）的电连接导体， 之后移除临时衬底（2），金属层（6）也用作器件（10）的衬底。 根据本发明，在金属层（6）沉积之前，在电介质（5）的图案化部分周围形成围绕半导体元件（3）的环形区域（7），具有较大的 厚度比电介质（5）厚，并且金属层（6）沉积在矩形环形区域（7）内。 以这种方式，优选地，通过将​​装置（10）推出区域（7）之后，可以容易地在沉积金属层（6）之后形成单个装置（10）。 优选地，为电介质（5）和区域（7）选择（不同的）光致抗蚀剂。 本发明还包括以这种方式获得的半导体器件（10）。