公开(公告)号：US09054160B2

公开(公告)日：2015-06-09

申请号：US13088054

申请日：2011-04-15

申请人： Robert L. Bruce ,  Qinghuang Lin ,  Alshakim Nelson ,  Satyanarayana V. Nitta ,  Dirk Pfeiffer ,  Jitendra S. Rathore

发明人： Robert L. Bruce ,  Qinghuang Lin ,  Alshakim Nelson ,  Satyanarayana V. Nitta ,  Dirk Pfeiffer ,  Jitendra S. Rathore

IPC分类号： H01L21/4763 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

CPC分类号： H01L23/5283 ,  H01L21/76801 ,  H01L21/76804 ,  H01L21/76808 ,  H01L21/7682 ,  H01L21/76825 ,  H01L21/76826 ,  H01L21/76828 ,  H01L21/76832 ,  H01L21/76835 ,  H01L23/5222 ,  H01L23/5329 ,  H01L23/53295 ,  H01L29/0649 ,  H01L2221/1031 ,  H01L2924/0002 ,  H01L2924/00

摘要： An interconnect structure includes a patterned and cured dielectric layer located directly on a surface of a patterned permanent antireflective coating. The patterned and cured dielectric layer and the permanent antireflective coating form shaped openings. The shaped openings include an inverse profile which narrows towards a top of the shaped openings. A conductive structure fills the shaped openings wherein the patterned and cured dielectric layer and the permanent antireflective coating each have a conductively filled region.

摘要翻译： 互连结构包括直接位于图案化的永久抗反射涂层的表面上的图案化和固化的电介质层。 图案化和固化的介电层和永久性抗反射涂层形成成形的开口。 成形的开口包括朝向成形开口的顶部变窄的反向轮廓。 导电结构填充成形开口，其中图案化和固化的介电层和永久性抗反射涂层各自具有导电填充区域。

公开(公告)号：US20120314625A1

公开(公告)日：2012-12-13

申请号：US13158135

申请日：2011-06-10

申请人： Robert L. Bruce

发明人： Robert L. Bruce

IPC分类号： H04L12/16

CPC分类号： H04L51/20

摘要： An approach is provided for certifying wireless access nodes for use in connection with emergency calls. A certification platform certifies location information of a wireless access node as part of an emergency response service for packetized voice calls. The location information is then stored in a database that includes a plurality of certified location information of a respective plurality of wireless access nodes including the activated wireless access node. The database is accessed in response to an emergency call to assist with determination of position information of wireless devices based on location information of the wireless access node that detects presence of the wireless device.

摘要翻译： 提供了一种用于认证与紧急呼叫相关联使用的无线接入节点的方法。 认证平台将无线接入节点的位置信息作为分组语音呼叫的应急响应服务的一部分进行认证。 然后将位置信息存储在数据库中，该数据库包括包括激活的无线接入节点的相应多个无线接入节点的多个认证位置信息。 响应于紧急呼叫来访问数据库，以基于检测无线设备的存在的无线接入节点的位置信息来协助确定无线设备的位置信息。

公开(公告)号：US4011562A

公开(公告)日：1977-03-08

申请号：US560339

申请日：1975-03-21

申请人： Robert L. Bruce

发明人： Robert L. Bruce

IPC分类号： G01S13/74 ,  G01B7/00 ,  G01B21/00 ,  G01S5/14 ,  G01S13/76 ,  G01S19/11 ,  G01S9/56

CPC分类号： G01S13/84 ,  G01S5/14

摘要： A precision radio ranging system that uses primarily a single carrier frequency interrogating and responding signal that is pulse amplitude modulated to provide phase shift information. A mobile interrogator finds its position by measuring ranges to each of two fixed responders. During a measurement, the interrogator has sole usage of the responder and transmits a pulse of a single frequency RF carrier. The responder measures the received carrier phase and later transmits a reply pulse on the same single frequency RF carrier which replicates this phase. The interrogator determines range to the responder from the phase difference of its own interrogation pulse and the responder reply pulse. In multiple system use, two closely spaced carrier frequencies may be time sequenced to provide multiparty two range service.

摘要翻译： 一种精密无线电测距系统，主要使用脉冲幅度调制的单载波频率询问和响应信号来提供相移信息。 移动询问器通过对两个固定响应者中的每一个测量范围来找到它的位置。 在测量期间，询问器具有响应者的唯一使用并且传送单频RF载波的脉冲。 响应者测量接收到的载波相位，并且稍后在复制该阶段的相同的单频RF载波上发送应答脉冲。 询问器根据其自身的询问脉冲和应答器应答脉冲的相位差确定响应者的范围。 在多系统使用中，可以对两个紧密间隔的载波频率进行时间排序以提供多方的两范围服务。

公开(公告)号：US09190316B2

公开(公告)日：2015-11-17

申请号：US13281732

申请日：2011-10-26

申请人： Markus Brink ,  Robert L. Bruce ,  Sebastian U. Engelmann ,  Nicholas C. M. Fuller ,  Hiroyuki Miyazoe ,  Masahiro Nakamura

发明人： Markus Brink ,  Robert L. Bruce ,  Sebastian U. Engelmann ,  Nicholas C. M. Fuller ,  Hiroyuki Miyazoe ,  Masahiro Nakamura

IPC分类号： H01L21/00 ,  H01L21/768 ,  H01L21/311 ,  H01L21/321

CPC分类号： H01L23/53295 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/3212 ,  H01L21/76802 ,  H01L21/76813 ,  H01L21/76831 ,  H01L21/76834 ,  H01L21/76835 ,  H01L23/5226 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

摘要： A stack that includes, from bottom to top, a nitrogen-containing dielectric layer, an interconnect level dielectric material layer, and a hard mask layer is formed on a substrate. The hard mask layer and the interconnect level dielectric material layer are patterned by an etch. Employing the patterned hard mask layer as an etch mask, the nitrogen-containing dielectric layer is patterned by a break-through anisotropic etch, which employs a fluorohydrocarbon-containing plasma to break through the nitrogen-containing dielectric layer. Fluorohydrocarbon gases used to generate the fluorohydrocarbon-containing plasma generate a carbon-rich polymer residue, which interact with the nitrogen-containing dielectric layer to form volatile compounds. Plasma energy can be decreased below 100 eV to reduce damage to physically exposed surfaces of the interconnect level dielectric material layer.

摘要翻译： 在基板上形成从底部到顶部包括含氮介电层，互连层介电材料层和硬掩模层的堆叠。 通过蚀刻对硬掩模层和互连层电介质材料层进行图案化。 使用图案化的硬掩模层作为蚀刻掩模，通过使用含氟烃的等离子体穿过含氮介电层的穿透各向异性蚀刻来对含氮介电层进行图案化。 用于产生含氟烃的等离子体的氟烃气体产生富含碳的聚合物残余物，其与含氮介电层相互作用以形成挥发性化合物。 等离子体能量可以降低到低于100eV，以减少互连层介电材料层的物理暴露表面的损伤。

公开(公告)号：US09042298B2

公开(公告)日：2015-05-26

申请号：US13158135

申请日：2011-06-10

申请人： Robert L. Bruce

发明人： Robert L. Bruce

IPC分类号： H04W4/00 ,  H04L12/58

CPC分类号： H04L51/20

摘要： An approach is provided for certifying wireless access nodes for use in connection with emergency calls. A certification platform certifies location information of a wireless access node as part of an emergency response service for packetized voice calls. The location information is then stored in a database that includes a plurality of certified location information of a respective plurality of wireless access nodes including the activated wireless access node. The database is accessed in response to an emergency call to assist with determination of position information of wireless devices based on location information of the wireless access node that detects presence of the wireless device.

摘要翻译： 提供了一种用于认证与紧急呼叫相关联使用的无线接入节点的方法。 认证平台将无线接入节点的位置信息作为分组语音呼叫的应急响应服务的一部分进行认证。 然后将位置信息存储在数据库中，该数据库包括包括激活的无线接入节点的相应多个无线接入节点的多个认证位置信息。 响应于紧急呼叫来访问数据库，以基于检测无线设备的存在的无线接入节点的位置信息来协助确定无线设备的位置信息。

公开(公告)号：US08927430B2

公开(公告)日：2015-01-06

申请号：US13180710

申请日：2011-07-12

申请人： Robert L. Bruce ,  Geraud Jean-Michel Dubois ,  Theo J. Frot ,  Willi Volksen

发明人： Robert L. Bruce ,  Geraud Jean-Michel Dubois ,  Theo J. Frot ,  Willi Volksen

IPC分类号： H01L21/302 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/02

CPC分类号： H01L21/3105 ,  H01L21/02203 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76822 ,  H01L21/76826 ,  H01L21/76828 ,  H01L2221/1047

摘要： In one exemplary embodiment of the invention, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer; after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores, where heating the structure results in residual filling material being left on the surface of the first layer; and after heating the structure, removing the residual filling material by applying a solvent wash.

摘要翻译： 在本发明的一个示例性实施例中，一种方法包括：提供具有覆盖在衬底上的第一层的结构，其中第一层包括具有多个孔的电介质材料; 将填充材料施加到所述第一层的表面; 在施加填充材料之后，加热结构以使得填充材料至少部分地填充多个孔，其中加热结构导致剩余的填充材料留在第一层的表面上; 并且在加热结构之后，通过施加溶剂洗涤来除去残留的填充材料。

公开(公告)号：US08492239B2

公开(公告)日：2013-07-23

申请号：US13602957

申请日：2012-09-04

申请人： Robert L. Bruce ,  Geraud Jean-Michel Dubois ,  Theo J. Frot ,  Teddie P. Magbitang ,  Sampath Purushothaman ,  David L. Rath ,  Willi Volksen

发明人： Robert L. Bruce ,  Geraud Jean-Michel Dubois ,  Theo J. Frot ,  Teddie P. Magbitang ,  Sampath Purushothaman ,  David L. Rath ,  Willi Volksen

IPC分类号： H01L21/76

CPC分类号： H01L21/3105 ,  H01L21/02203 ,  H01L21/76802 ,  H01L21/76826 ,  H01L21/76828

摘要： In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one first process on the structure; after performing the at least one first process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material; and after removing the filling material from the plurality of pores, performing at least one second process on the structure, where the at least one second process is performed at a third temperature that is greater than the second temperature.

摘要翻译： 在一个示例性实施例中，一种方法包括：提供具有覆盖衬底的第一层的结构，其中第一层包括具有多个孔的电介质材料; 将填充材料施加到第一层的暴露表面; 将结构加热到第一温度以使填充材料均匀地填充多个孔; 在填充所述多个孔之后，在所述结构上执行至少一个第一处理; 在执行所述至少一个第一处理之后，通过将所述结构加热至第二温度以分解所述填充材料，从所述多个孔中除去所述填充材料; 并且在从所述多个孔中除去所述填充材料之后，对所述结构执行至少一个第二工艺，其中所述至少一个第二工艺在大于所述第二温度的第三温度下进行。

公开(公告)号：US20130105996A1

公开(公告)日：2013-05-02

申请号：US13281732

申请日：2011-10-26

申请人： Markus Brink ,  Robert L. Bruce ,  Sebastian U. Engelmann ,  Nicholas C. M. Fuller ,  Hiroyuki Miyazoe ,  Masahiro Nakamura

发明人： Markus Brink ,  Robert L. Bruce ,  Sebastian U. Engelmann ,  Nicholas C. M. Fuller ,  Hiroyuki Miyazoe ,  Masahiro Nakamura

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/53295 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/3212 ,  H01L21/76802 ,  H01L21/76813 ,  H01L21/76831 ,  H01L21/76834 ,  H01L21/76835 ,  H01L23/5226 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

摘要： A stack that includes, from bottom to top, a nitrogen-containing dielectric layer, an interconnect level dielectric material layer, and a hard mask layer is formed on a substrate. The hard mask layer and the interconnect level dielectric material layer are patterned by an etch. Employing the patterned hard mask layer as an etch mask, the nitrogen-containing dielectric layer is patterned by a break-through anisotropic etch, which employs a fluorohydrocarbon-containing plasma to break through the nitrogen-containing dielectric layer. Fluorohydrocarbon gases used to generate the fluorohydrocarbon-containing plasma generate a carbon-rich polymer residue, which interact with the nitrogen-containing dielectric layer to form volatile compounds. Plasma energy can be decreased below 100 eV to reduce damage to physically exposed surfaces of the interconnect level dielectric material layer.

摘要翻译： 在基板上形成从底部到顶部包括含氮介电层，互连层介电材料层和硬掩模层的堆叠。 通过蚀刻对硬掩模层和互连层电介质材料层进行图案化。 使用图案化的硬掩模层作为蚀刻掩模，通过使用含氟烃的等离子体穿过含氮介电层的穿透各向异性蚀刻来对含氮介电层进行图案化。 用于产生含氟烃的等离子体的氟烃气体产生富含碳的聚合物残余物，其与含氮介电层相互作用以形成挥发性化合物。 等离子体能量可以降低到低于100eV，以减少互连层介电材料层的物理暴露表面的损伤。

公开(公告)号：US20120329273A1

公开(公告)日：2012-12-27

申请号：US13602957

申请日：2012-09-04

申请人： Robert L. Bruce ,  Geraud Jean-Michel Dubois ,  Theo J. Frot ,  Teddie P. Magbitang ,  Sampath Purushothaman ,  David L. Rath ,  Willi Volksen

发明人： Robert L. Bruce ,  Geraud Jean-Michel Dubois ,  Theo J. Frot ,  Teddie P. Magbitang ,  Sampath Purushothaman ,  David L. Rath ,  Willi Volksen

IPC分类号： H01L21/28

CPC分类号： H01L21/3105 ,  H01L21/02203 ,  H01L21/76802 ,  H01L21/76826 ,  H01L21/76828

摘要： In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one first process on the structure; after performing the at least one first process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material; and after removing the filling material from the plurality of pores, performing at least one second process on the structure, where the at least one second process is performed at a third temperature that is greater than the second temperature.

摘要翻译： 在一个示例性实施例中，一种方法包括：提供具有覆盖衬底的第一层的结构，其中第一层包括具有多个孔的电介质材料; 将填充材料施加到第一层的暴露表面; 将结构加热到第一温度以使填充材料均匀地填充多个孔; 在填充所述多个孔之后，在所述结构上执行至少一个第一处理; 在执行所述至少一个第一处理之后，通过将所述结构加热至第二温度以分解所述填充材料，从所述多个孔中除去所述填充材料; 并且在从所述多个孔中除去所述填充材料之后，对所述结构进行至少一个第二工艺，其中所述至少一个第二工艺在大于所述第二温度的第三温度下进行。

公开(公告)号：US08337648B2

公开(公告)日：2012-12-25

申请号：US10773516

申请日：2004-02-05

申请人： Frederick M. Mako ,  Robert L. Bruce

发明人： Frederick M. Mako ,  Robert L. Bruce

IPC分类号： C03B29/00

CPC分类号： C04B37/005 ,  B32B2315/02 ,  B82Y30/00 ,  C04B35/565 ,  C04B2235/3217 ,  C04B2235/383 ,  C04B2235/3873 ,  C04B2235/425 ,  C04B2235/428 ,  C04B2235/465 ,  C04B2235/483 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/5472 ,  C04B2235/5481 ,  C04B2235/6562 ,  C04B2235/94 ,  C04B2237/083 ,  C04B2237/343 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/368

摘要： A method for the production of joints between ceramic bodies such as silicon carbide bodies in which a preceramic polymer mixed with a powder, such as bimodal silicon carbide, is applied in slurry form. The mechanical and hermetic properties may be enhanced by the inclusion of additional bodies constraining the polymer slurry in the joint region, such as a collar. The thermal processing of the joint is described which provides a useful joint.

摘要翻译： 陶瓷体如碳化硅体之间的接合体的制造方法，其中与粉末混合的陶瓷前体如双峰碳化硅以浆料的形式被施加。 可以通过将约束聚合物浆料的附加体包含在接合区域（例如轴环）中来增强机械和密封性能。 描述了关节的热处理，其提供了有用的关节。