公开(公告)号：US09048240B2

公开(公告)日：2015-06-02

申请号：US13728215

申请日：2012-12-27

Applicant: Young Woo Park ,  Nam Ju Kim ,  Kyoung Soo Park ,  Joon Mo Seo ,  Kyung Il Sul ,  Dong Seon Uh ,  Arum Yu ,  Hyun Min Choi

Inventor： Young Woo Park ,  Nam Ju Kim ,  Kyoung Soo Park ,  Joon Mo Seo ,  Kyung Il Sul ,  Dong Seon Uh ,  Arum Yu ,  Hyun Min Choi

IPC: H01B1/00 ,  H01L23/48 ,  H01L23/538 ,  C09J9/02 ,  C08G59/22 ,  C08G59/24 ,  H01L23/00 ,  C08L63/00

CPC classification number: H01L23/538 ,  C08G59/226 ,  C08G59/245 ,  C08K2201/001 ,  C08K2201/011 ,  C09J9/02 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  C08L63/00 ,  C08K3/36 ,  C08K3/10

Abstract: An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles.

Abstract translation: 电子器件包括各向异性导电膜作为连接材料，各向异性导电膜由各向异性导电膜形成组合物形成。 各向异性导电膜形成组合物包括多环芳族环的环氧树脂，芴环氧树脂，纳米二氧化硅和导电颗粒。

公开(公告)号：US20130154129A1

公开(公告)日：2013-06-20

申请号：US13718104

申请日：2012-12-18

Applicant: Kyung Il SUL ,  Dong Seon UH ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Young Woo PARK ,  Joon Mo SEO ,  Arum YU ,  Hyun Min CHOI

Inventor： Kyung Il SUL ,  Dong Seon UH ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Young Woo PARK ,  Joon Mo SEO ,  Arum YU ,  Hyun Min CHOI

IPC: C09J163/00 ,  H01L23/29

CPC classification number: C09J163/00 ,  C08G59/226 ,  C08G59/24 ,  C08G59/687 ,  C08L63/00 ,  C08L2205/02 ,  C09D5/24 ,  C09J9/02 ,  H01B1/20 ,  H01L23/29 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.

Abstract translation: 通过各向异性导电膜和各向异性导电膜组合物接合的半导体器件，各向异性导电膜包括环氧当量为约120至约180g / eq的反应性单体; 氢化环氧树脂; 和锍阳离子固化催化剂。

公开(公告)号：US20130154095A1

公开(公告)日：2013-06-20

申请号：US13720051

申请日：2012-12-19

Applicant: Arum YU ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Young Woo PARK ,  Joon Mo SEO ,  Motohide TAKEICHI ,  Dong Seon UH ,  Hyun Min CHOI

Inventor： Arum YU ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Young Woo PARK ,  Joon Mo SEO ,  Motohide TAKEICHI ,  Dong Seon UH ,  Hyun Min CHOI

IPC: H01L23/00

CPC classification number: H01L24/29 ,  H01L24/13 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29398 ,  H01L2224/29401 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15788 ,  H01L2924/20106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A semiconductor device includes an anisotropic conductive film for connecting the semiconductor device. The anisotropic conductive film includes a first conductive layer that has first conductive particles. The first conductive particles include cores containing silica or a silica composite, and have a 20% K-value ranging from about 7,000 N/mm2 to about 12,000 N/mm2.

Abstract translation: 半导体器件包括用于连接半导体器件的各向异性导电膜。 各向异性导电膜包括具有第一导电颗粒的第一导电层。 第一导电颗粒包括含有二氧化硅或二氧化硅复合材料的芯，并且具有约7,000N / mm 2至约12,000N / mm 2的20％K值。

公开(公告)号：US20130154093A1

公开(公告)日：2013-06-20

申请号：US13710728

申请日：2012-12-11

Applicant: Arum YU ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Young Woo PARK ,  Joon Mo SEO ,  Kyung Il SUL ,  Dong Seon UH ,  Hyun Min CHOI

Inventor： Arum YU ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Young Woo PARK ,  Joon Mo SEO ,  Kyung Il SUL ,  Dong Seon UH ,  Hyun Min CHOI

IPC: H01B1/20 ,  H01L23/532

CPC classification number: H01B1/20 ,  C08K3/08 ,  C08K5/41 ,  C08K9/02 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01B1/22 ,  H01L23/5328 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.

Abstract translation: 用于接合电子器件的各向异性导电膜组合物可以包括由式1表示的氢化双酚A环氧单体或由式2表示的氢化双酚A环氧低聚物：其中n可以是1至约50的整数。

公开(公告)号：US20120168213A1

公开(公告)日：2012-07-05

申请号：US13311920

申请日：2011-12-06

Applicant: Young Woo PARK ,  Arum Amy Yu ,  Nam Ju Kim ,  Hyun Min Choi ,  Jin Seong Park ,  Dong Seon Uh

Inventor： Young Woo PARK ,  Arum Amy Yu ,  Nam Ju Kim ,  Hyun Min Choi ,  Jin Seong Park ,  Dong Seon Uh

IPC: H05K1/09

CPC classification number: H05K3/323 ,  B32B7/02 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2264/102 ,  B32B2264/12 ,  B32B2307/202 ,  B32B2307/706 ,  B32B2457/202 ,  C08J5/18 ,  C08J2363/00 ,  C09J163/00 ,  G02F1/13452 ,  H01R4/04 ,  Y10T428/1055

Abstract: An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa·s to about 10,000 Pa·s at about 30° C. to about 200° C.

Abstract translation: 一种装置包括：第一构件，包括在第一衬底上的多个第一电极，第二构件，在第二衬底上包括多个第二电极，第二电极面对第一构件的第一电极;以及各向异性导电膜（ACF ），所述ACF具有双层结构并且电连接所述第一构件和所述第二构件，所述ACF包括具有多环芳环的环氧树脂并且具有约3,000Pa的最小熔体粘度 在约30℃至约200℃的温度下至约10,000Pa·s

公开(公告)号：US09540549B2

公开(公告)日：2017-01-10

申请号：US13718104

申请日：2012-12-18

Applicant: Kyung Il Sul ,  Dong Seon Uh ,  Nam Ju Kim ,  Kyoung Soo Park ,  Young Woo Park ,  Joon Mo Seo ,  Arum Yu ,  Hyun Min Choi

Inventor： Kyung Il Sul ,  Dong Seon Uh ,  Nam Ju Kim ,  Kyoung Soo Park ,  Young Woo Park ,  Joon Mo Seo ,  Arum Yu ,  Hyun Min Choi

IPC: H01B1/20 ,  C09D5/24 ,  C09J9/00 ,  H01L23/00 ,  C09J163/00 ,  C09J9/02 ,  H01L23/29 ,  C08G59/22 ,  C08G59/24 ,  C08G59/68 ,  C08L63/00

CPC classification number: C09J163/00 ,  C08G59/226 ,  C08G59/24 ,  C08G59/687 ,  C08L63/00 ,  C08L2205/02 ,  C09D5/24 ,  C09J9/02 ,  H01B1/20 ,  H01L23/29 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.

Abstract translation: 通过各向异性导电膜和各向异性导电膜组合物接合的半导体器件，各向异性导电膜包括环氧当量为约120至约180g / eq的反应性单体; 氢化环氧树脂; 和锍阳离子固化催化剂。

公开(公告)号：US09173303B2

公开(公告)日：2015-10-27

申请号：US13311920

申请日：2011-12-06

Applicant: Young Woo Park ,  Arum Amy Yu ,  Nam Ju Kim ,  Hyun Min Choi ,  Jin Seong Park ,  Dong Seon Uh

Inventor： Young Woo Park ,  Arum Amy Yu ,  Nam Ju Kim ,  Hyun Min Choi ,  Jin Seong Park ,  Dong Seon Uh

IPC: C09K19/00 ,  H05K3/32 ,  C09J163/00 ,  B32B7/02 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  C08J5/18 ,  G02F1/1345 ,  H01R4/04

CPC classification number: H05K3/323 ,  B32B7/02 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2264/102 ,  B32B2264/12 ,  B32B2307/202 ,  B32B2307/706 ,  B32B2457/202 ,  C08J5/18 ,  C08J2363/00 ,  C09J163/00 ,  G02F1/13452 ,  H01R4/04 ,  Y10T428/1055

Abstract: An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa·s to about 10,000 Pa·s at about 30° C. to about 200° C.

Abstract translation: 一种装置包括：第一构件，包括在第一衬底上的多个第一电极，第二构件，在第二衬底上包括多个第二电极，第二电极面对第一构件的第一电极;以及各向异性导电膜（ACF ），所述ACF具有双层结构并且电连接所述第一构件和所述第二构件，所述ACF包括具有多环芳环的环氧树脂并且具有约3,000Pa的最小熔体粘度 在约30℃至约200℃的温度下至约10,000Pa·s

公开(公告)号：US08766443B2

公开(公告)日：2014-07-01

申请号：US13710728

申请日：2012-12-11

Applicant: Arum Yu ,  Nam Ju Kim ,  Kyoung Soo Park ,  Young Woo Park ,  Joon Mo Seo ,  Kyung Il Sul ,  Dong Seon Uh ,  Hyun Min Choi

Inventor： Arum Yu ,  Nam Ju Kim ,  Kyoung Soo Park ,  Young Woo Park ,  Joon Mo Seo ,  Kyung Il Sul ,  Dong Seon Uh ,  Hyun Min Choi

IPC: H01L23/48

CPC classification number: H01B1/20 ,  C08K3/08 ,  C08K5/41 ,  C08K9/02 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01B1/22 ,  H01L23/5328 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.

Abstract translation: 用于接合电子器件的各向异性导电膜组合物可以包括由式1表示的氢化双酚A环氧单体或由式2表示的氢化双酚A环氧低聚物：其中n可以是1至约50的整数。

公开(公告)号：US20140067422A1

公开(公告)日：2014-03-06

申请号：US14009161

申请日：2011-08-11

Applicant: Nam Ju Kim

Inventor： Nam Ju Kim

IPC: G06F19/00

CPC classification number: G06F19/321 ,  G06F19/00 ,  G06Q10/10 ,  G06Q50/24

Abstract: The present invention relates to a system for providing clinical information in real time, to a method for providing clinical information in real time, and to a storage medium on which a program performing same is recorded. According to the present invention, the advantage of providing ultrasonic images of an unborn child in real time without an additional storage medium is that the level of clinical service provided to a pregnant woman and her family can be improved.

Abstract translation: 本发明涉及实时提供临床信息的系统，实时提供临床信息的方法以及记录执行相同程序的存储介质。 根据本发明，无需额外的存储介质即可实时提供未出生儿童的超声图像的优点在于可以提高提供给孕妇及其家人的临床服务水平。

公开(公告)号：US09390831B2

公开(公告)日：2016-07-12

申请号：US13680893

申请日：2012-11-19

Applicant: Kyoung Soo Park ,  Nam Ju Kim ,  Young Woo Park ,  Joon Mo Seo ,  Kyung Il Sul ,  Dong Seon Uh ,  Arum Yu ,  Hyun Min Choi ,  Jae Sun Han

Inventor： Kyoung Soo Park ,  Nam Ju Kim ,  Young Woo Park ,  Joon Mo Seo ,  Kyung Il Sul ,  Dong Seon Uh ,  Arum Yu ,  Hyun Min Choi ,  Jae Sun Han

IPC: H01B1/22 ,  H01R4/04 ,  H05K3/32 ,  C09J9/02 ,  H01B1/12

CPC classification number: H01B1/22 ,  C09J9/02 ,  H01B1/12 ,  H01B1/122 ,  H01R4/04 ,  H05K3/323

Abstract: An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, where, in Formula 1, R1 may be selected from the group of hydrogen, C1-C6 alkyl, C6-C14 aryl, —C(═O)R4, —C(═O)OR5, and —C(═O)NHR6 (in which R4, R5, and R6 may each independently be selected from C1-C6 alkyl and C6-C14 aryl), R2 may be C1-C6 alkyl, and R3 may be selected from the group of a nitrobenzyl group, a dinitrobenzyl group, a trinitrobenzyl group, a benzyl group, a C1-C6 alkyl-substituted benzyl group, and a naphthylmethyl group.

Abstract translation: 电子装置包括由粘合剂组合物形成的连接材料，所述粘合剂组合物包括：聚合物树脂; 由式1表示的阳离子聚合催化剂; 和有机碱，其中，在式1中，R 1可以选自氢，C 1 -C 6烷基，C 6 -C 14芳基，-C（= O）R 4，-C（= O）OR 5和-C （ΟO）NHR 6（其中R 4，R 5和R 6可各自独立地选自C 1 -C 6烷基和C 6 -C 14芳基），R 2可以是C 1 -C 6烷基，R 3可以选自硝基苄基 二硝基苄基，三硝基苄基，苄基，C1-C6烷基取代的苄基和萘基甲基。