Maleimide Resin Composition, Prepreg, Cured Product Of Same And Semiconductor Device

    公开(公告)号:US20190203048A1

    公开(公告)日:2019-07-04

    申请号:US16322514

    申请日:2017-08-02

    摘要: To provide a maleimide resin composition which is curable by a curing process equivalent to that of an epoxy resin and can achieve moldability (curability) at 200° C. or less, heat resistance of 250° C. or more, retention of high thermal stability and high elastic modulus at 250° C., and low dielectric constant/low dielectric loss tangent. A maleimide resin composition including a maleimide compound (A) and a sulfonyl compound (B) containing, in the molecule, a structure represented by the following formula (1): (wherein each of the plurality of R's independently represents an alkenyl group, an alkenyl ether group, a hydrogen tom, a halogen atom, an alkyl group having a carbon number of 1 to 10, a fluoroalkyl group having a carbon number of 1 to 4, a hydroxyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxyl group, a tertiary carbon structure-containing group, a cyclic alkyl group, or a glycidyl group; at least one R is an alkenyl group or an alkenyl ether group; and a represents an integer of 1 to 4).