Invention Grant
US09540549B2 Anisotropic conductive film and semiconductor device bonded by the same
有权
各向异性导电膜和与其结合的半导体器件
- Patent Title: Anisotropic conductive film and semiconductor device bonded by the same
- Patent Title (中): 各向异性导电膜和与其结合的半导体器件
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Application No.: US13718104Application Date: 2012-12-18
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Publication No.: US09540549B2Publication Date: 2017-01-10
- Inventor: Kyung Il Sul , Dong Seon Uh , Nam Ju Kim , Kyoung Soo Park , Young Woo Park , Joon Mo Seo , Arum Yu , Hyun Min Choi
- Applicant: Kyung Il Sul , Dong Seon Uh , Nam Ju Kim , Kyoung Soo Park , Young Woo Park , Joon Mo Seo , Arum Yu , Hyun Min Choi
- Applicant Address: KR Gumi-Si, Kyeongsangbuk-Do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-Si, Kyeongsangbuk-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0136957 20111219
- Main IPC: H01B1/20
- IPC: H01B1/20 ; C09D5/24 ; C09J9/00 ; H01L23/00 ; C09J163/00 ; C09J9/02 ; H01L23/29 ; C08G59/22 ; C08G59/24 ; C08G59/68 ; C08L63/00
Abstract:
A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.
Public/Granted literature
- US20130154129A1 ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE BONDED BY THE SAME Public/Granted day:2013-06-20
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