公开(公告)号：US08541799B2

公开(公告)日：2013-09-24

申请号：US13113081

申请日：2011-05-23

申请人： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin ,  Ching-Lien Yeh ,  Chi-Wei Liao

发明人： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin ,  Ching-Lien Yeh ,  Chi-Wei Liao

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0083

摘要： A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.

摘要翻译： 发光元件封装包括用于封装发光元件的封装构件。 在封装构件上形成多个光子晶体图案。 光子晶体图案的分布密度对应于发光元件的光分布。 每个光子晶体图案由多个光子晶体组成。

公开(公告)号：US20130244355A1

公开(公告)日：2013-09-19

申请号：US13653634

申请日：2012-10-17

申请人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG

发明人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC分类号： H01L33/58

CPC分类号： H01L33/486 ,  H01L33/501 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.

摘要翻译： 制造LED封装的示例性方法包括以下步骤：提供衬底; 在所述基板上形成反射器，其中所述接收室限定在所述反射器中; 提供LED芯片并将LED芯片安装在基板上，其中LED芯片被容纳在接收室中; 提供凝胶状荧光体层，并将凝胶状磷光体层设置在反射器的顶端，其中，凝胶状磷光体层覆盖接收室，荧光体粉末均匀地分布在凝胶磷光体层中; 提供加压模具并将压模布置在凝胶磷光体层的顶端上; 将压模压向凝胶状磷光体层，使凝胶状磷光体层填充在接收室中; 凝胶化荧光体层。

公开(公告)号：US20130217160A1

公开(公告)日：2013-08-22

申请号：US13600128

申请日：2012-08-30

申请人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN

发明人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN

IPC分类号： H01L33/50 ,  B44C1/22 ,  B29C45/02

CPC分类号： C09K11/02 ,  C09K11/08 ,  H01L33/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.

摘要翻译： 一种制造用于LED封装的荧光膜的方法，包括以下步骤：提供包括第一和第二成型部件的模具，第一模制部件和第二模制部件协同地形成模制室，第一模制部件 限定与所述模制室连通的开口; 将荧光体颗粒和透明胶的混合物填充到第一开口中; 沿着从第一成型部到第二成型部的方向在第一开口中移动活塞，从而将混合物压入成型室; 使混合物固化形成荧光膜; 并从模具中去除荧光膜。 荧光体膜用于与安装有LED芯片的基板相对的LED芯片的顶面附着。

公开(公告)号：US20130217159A1

公开(公告)日：2013-08-22

申请号：US13571361

申请日：2012-08-10

申请人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

发明人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00

摘要： A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.

摘要翻译： 一种制造LED封装的方法，包括以下步骤：提供衬底并在衬底上形成间隔开的电极结构; 在基板的顶表面上提供模具，其中模具限定间隔开的环形槽，其与基板的顶表面配合以限定空腔; 用金属材料填充空腔; 去除模具并硬化金属材料以形成反射杯，其中每个反射杯围绕相应的电极结构并限定凹部; 抛光反射杯和电极结构的表面; 将LED芯片布置在凹陷中，每个LED芯片电连接到电极结构; 在所述凹部中注入密封层以密封所述LED芯片; 并切割基板以获得单独的LED封装。

公开(公告)号：US08470621B2

公开(公告)日：2013-06-25

申请号：US12722231

申请日：2010-03-11

申请人： Chester Kuo ,  Lung Hsin Chen ,  Wen Liang Tseng ,  Shih Cheng Huang ,  Po Min Tu ,  Ying Chao Yeh ,  Wen Yu Lin ,  Peng Yi Wu ,  Shih Hsiung Chan

发明人： Chester Kuo ,  Lung Hsin Chen ,  Wen Liang Tseng ,  Shih Cheng Huang ,  Po Min Tu ,  Ying Chao Yeh ,  Wen Yu Lin ,  Peng Yi Wu ,  Shih Hsiung Chan

IPC分类号： H01L33/48 ,  H01L27/15 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L27/156 ,  H01L33/0079 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.

摘要翻译： 用于制造倒装芯片半导体光电器件的方法首先将连接到外延衬底的半导体光电芯片倒装芯片结合到封装衬底。 然后使用剥离技术分离外延衬底。

公开(公告)号：US20120074827A1

公开(公告)日：2012-03-29

申请号：US13167704

申请日：2011-06-24

申请人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH

发明人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH

IPC分类号： H01J7/24

CPC分类号： F21V29/004 ,  F21K9/233 ,  F21V7/0083 ,  F21V13/04 ,  F21V17/102 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2115/10

摘要： An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.

摘要翻译： LED灯结构包括散热器和基座。 散热器包括第一接收腔，与第一接收腔相对的第二接收腔和隔板。 具有LED模块的灯板安装在隔板上。 隔板在其中限定了两个第一螺纹通孔。 基座具有两个定位突起，该突起与散热器的两个定位槽啮合。 因此，基座的两个螺柱的第二螺钉孔在散热器的隔板的第一螺钉孔处对准。 螺丝用于螺纹接合灯板中的第一螺钉孔，第二螺钉孔和第三螺钉孔，从而将散热器，基座和灯板组装在一起。

公开(公告)号：US07989237B2

公开(公告)日：2011-08-02

申请号：US12232882

申请日：2008-09-25

申请人： Wen Liang Tseng ,  Lung Hsin Chen

发明人： Wen Liang Tseng ,  Lung Hsin Chen

IPC分类号： H01L33/00

CPC分类号： H01L33/641 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.

摘要翻译： 将硅衬底应用于固态照明器件的封装结构。 对硅基板的顶表面和底表面进行湿蚀刻以形成反射腔和电极访问孔。 反射层和电极的材料可以彼此不同，其优选的材料可以根据相应的功能来选择。 电极的形成可以通过蚀刻方法或剥离法进行图案化。

公开(公告)号：US20140049955A1

公开(公告)日：2014-02-20

申请号：US13663492

申请日：2012-10-30

申请人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG

发明人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC分类号： F21V21/00 ,  F21V9/16

CPC分类号： H01L25/0753 ,  F21K9/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/504 ,  H01L33/507 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/10106 ,  H01L2924/00014

摘要： An exemplary LED illumination device includes a lighting member and a supporting member. The lighting member includes a base plate allowing light passing therethrough and LEDs mounted on a top surface of the base plate. The supporting member includes a bottom wall allowing light passing therethrough and side walls extending upwardly from edges of the bottom wall. The side walls and the bottom plate cooperatively define a receiving chamber therebetween to receive the base plate therein. Light generated by the LEDs radiates upwardly, downwardly and laterally from the LED illumination device.

摘要翻译： 示例性的LED照明装置包括照明部件和支撑部件。 照明构件包括允许穿过其中的光的基板和安装在基板的顶表面上的LED。 支撑构件包括允许光穿过的底壁​​和从底壁的边缘向上延伸的侧壁。 侧壁和底板协同地在其间限定接收室，以在其中容纳基板。 由LED产生的光从LED照明装置向上，向下和向外辐射。

公开(公告)号：US20130178003A1

公开(公告)日：2013-07-11

申请号：US13612895

申请日：2012-09-13

申请人： Lung-Hsin CHEN ,  Wen-Liang TSENG ,  Pin-Chuan CHEN

发明人： Lung-Hsin CHEN ,  Wen-Liang TSENG ,  Pin-Chuan CHEN

IPC分类号： H01L33/52

CPC分类号： H01L33/50 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00

摘要： A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages.

摘要翻译： 一种用于封装LED的方法包括以下步骤：为基板提供其上形成的电路结构，将基板堆叠在支撑板上，并在基板上布置多个LED管芯; 提供模具和凝胶态荧光膜，将支撑板定位在模具中并用凝胶态荧光膜覆盖模具，以协调地限定荧光膜，模具和支撑板之间的接收空间，基板和 LED管芯在接收空间中被接收; 在接收空间排出空气，将凝胶态荧光膜附着在LED管芯上; 固化凝胶状荧光膜并去除模具; 在衬底上形成封装以覆盖LED管芯; 切割基板并移除支撑板以获得几个单独的LED封装。

公开(公告)号：US20130161673A1

公开(公告)日：2013-06-27

申请号：US13600236

申请日：2012-08-31

申请人： Lung-Hsin CHEN ,  Wen-Liang TSENG ,  Pin-Chuan CHEN

发明人： Lung-Hsin CHEN ,  Wen-Liang TSENG ,  Pin-Chuan CHEN

IPC分类号： H01L33/52 ,  C09K11/00 ,  H01L33/48

CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

摘要： A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.

摘要翻译： 一种LED封装方法，包括以下步骤：在支撑板上提供支撑板，然后将与荧光体混合的凝胶滴下; 用刮板在支撑板上刮擦凝胶，在支撑板上形成凝胶状荧光膜，并固化凝胶状荧光膜片以形成凝固的荧光膜; 将固化的荧光膜切割成单独的片，并将固体荧光膜从支撑板剥离; 将一片荧光膜附接到LED管芯的光输出表面上; 将LED管芯安装在基板上，并将LED管芯电连接到电路结构; 以及在所述衬底上形成封装以覆盖所述LED管芯。