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    LIGHT EMITTING DIODE PACKAGE
    3.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20110278601A1

    公开(公告)日：2011-11-17

    申请号：US12979368

    申请日：2010-12-28

    申请人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

    发明人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

    IPC分类号： H01L33/48

    CPC分类号： H01L33/486 ,  H01L25/167 ,  H01L33/507 ,  H01L33/508 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip.

    摘要翻译： LED封装包括硅基，LED和玻璃密封剂。 硅基部具有与第一表面相对的第一表面和第二表面。 LED芯片位于硅基底的第一表面上。 玻璃密封剂覆盖LED芯片。 玻璃密封剂和硅基底在其间限定了接收LED芯片的接收空间。 玻璃密封剂与硅基体的第一表面固定接合，因此玻璃密封剂和硅基底包围LED芯片。

    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
    4.
    发明申请
    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 有权
    制造发光二极管封装的方法

    公开(公告)号：US20130244355A1

    公开(公告)日：2013-09-19

    申请号：US13653634

    申请日：2012-10-17

    申请人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG

    发明人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG

    IPC分类号： H01L33/58

    CPC分类号： H01L33/486 ,  H01L33/501 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

    摘要： An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.

    摘要翻译： 制造LED封装的示例性方法包括以下步骤：提供衬底; 在所述基板上形成反射器，其中所述接收室限定在所述反射器中; 提供LED芯片并将LED芯片安装在基板上，其中LED芯片被容纳在接收室中; 提供凝胶状荧光体层，并将凝胶状磷光体层设置在反射器的顶端，其中，凝胶状磷光体层覆盖接收室，荧光体粉末均匀地分布在凝胶磷光体层中; 提供加压模具并将压模布置在凝胶磷光体层的顶端上; 将压模压向凝胶状磷光体层，使凝胶状磷光体层填充在接收室中; 凝胶化荧光体层。

    METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM
    5.
    发明申请
    METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM 有权
    用于制造磷光体膜的方法和制造具有磷光体膜的LED封装的方法

    公开(公告)号：US20130217160A1

    公开(公告)日：2013-08-22

    申请号：US13600128

    申请日：2012-08-30

    申请人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN

    发明人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN

    IPC分类号： H01L33/50 ,  B44C1/22 ,  B29C45/02

    CPC分类号： C09K11/02 ,  C09K11/08 ,  H01L33/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.

    摘要翻译： 一种制造用于LED封装的荧光膜的方法，包括以下步骤：提供包括第一和第二成型部件的模具，第一模制部件和第二模制部件协同地形成模制室，第一模制部件 限定与所述模制室连通的开口; 将荧光体颗粒和透明胶的混合物填充到第一开口中; 沿着从第一成型部到第二成型部的方向在第一开口中移动活塞，从而将混合物压入成型室; 使混合物固化形成荧光膜; 并从模具中去除荧光膜。 荧光体膜用于与安装有LED芯片的基板相对的LED芯片的顶面附着。

    LED LAMP STRUCTURE
    6.
    发明申请
    LED LAMP STRUCTURE 有权
    LED灯结构

    公开(公告)号：US20120074827A1

    公开(公告)日：2012-03-29

    申请号：US13167704

    申请日：2011-06-24

    申请人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH

    发明人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH

    IPC分类号： H01J7/24

    CPC分类号： F21V29/004 ,  F21K9/233 ,  F21V7/0083 ,  F21V13/04 ,  F21V17/102 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.

    摘要翻译： LED灯结构包括散热器和基座。 散热器包括第一接收腔，与第一接收腔相对的第二接收腔和隔板。 具有LED模块的灯板安装在隔板上。 隔板在其中限定了两个第一螺纹通孔。 基座具有两个定位突起，该突起与散热器的两个定位槽啮合。 因此，基座的两个螺柱的第二螺钉孔在散热器的隔板的第一螺钉孔处对准。 螺丝用于螺纹接合灯板中的第一螺钉孔，第二螺钉孔和第三螺钉孔，从而将散热器，基座和灯板组装在一起。

    LED BULB
    8.
    发明申请
    LED BULB 审中-公开
    LED灯泡

    公开(公告)号：US20120075858A1

    公开(公告)日：2012-03-29

    申请号：US13172728

    申请日：2011-06-29

    申请人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH ,  CHUAN-FU YANG

    发明人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH ,  CHUAN-FU YANG

    IPC分类号： F21S4/00 ,  F21V29/00

    CPC分类号： F21K9/23 ,  F21V3/00 ,  F21V29/74 ,  F21Y2115/10

    摘要： An exemplary LED bulb includes a holder, a housing, a heat spreader, a power module and an LED module. The housing connects to the holder. The heat spreader detachably engages with the housing. The power module detachably engages with the housing and is received in the housing. The LED module is arranged on the heat spreader. The LED module electrically connects to the holder via the power module. The LED module is physically separated from the power module.

    摘要翻译： 示例性的LED灯泡包括保持器，壳体，散热器，功率模块和LED模块。 外壳连接到支架。 散热器可拆卸地与壳体接合。 电源模块可拆卸地与壳体接合并被容纳在壳体中。 LED模块布置在散热器上。 LED模块通过电源模块电连接到支架。 LED模块与电源模块物理分离。