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公开(公告)号：US20130232446A1
公开(公告)日：2013-09-05
申请号：US13564380
申请日：2012-08-01
申请人： Chih-Yung Lin
发明人： Chih-Yung Lin
CPC分类号： G06F3/04886 , G06F2203/04804
摘要： The present invention provides an electronic device including a touch screen, an image processing unit, a determination unit, and a switching unit. The touch screen receives a predetermined gesture and displays a plurality of screen layers including a lock layer and a desktop. The image processing unit inserts the lock layer above the desktop in a locked mode, wherein the lock layer comprises a lock icon disposed at a predetermined position. The determination unit determines whether the predetermined gesture has been executed at the predetermined position on the lock layer when the touch screen has been triggered by the predetermined gesture in the lock mode. The switching unit forces the electronic device to enter a normal operating mode from the lock mode and execute an application corresponding to the lock icon at the predetermined position when the predetermined gesture has been executed at the predetermined position.
摘要翻译： 本发明提供一种包括触摸屏，图像处理单元，确定单元和切换单元的电子设备。 触摸屏接收预定的手势并显示包括锁定层和桌面的多个屏幕层。 图像处理单元将锁定层以锁定模式插入桌面上方，其中锁定层包括设置在预定位置的锁定图标。 当在锁定模式中触摸屏已经被预定手势触发时，确定单元确定在锁定层上的预定位置是否已经执行了预定手势。 切换单元迫使电子设备从锁定模式进入正常操作模式，并且当在预定位置执行预定手势时，执行与预定位置处的锁定图标相对应的应用。
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公开(公告)号：US08344406B2
公开(公告)日：2013-01-01
申请号：US12970976
申请日：2010-12-17
申请人： Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao , Jian-Shihn Tsang
发明人： Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao , Jian-Shihn Tsang
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/46 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.
摘要翻译： 在发光器件封装及其制造方法中，将多层结构分配在基板上，其中至少两个具有不同折射率的膜交替堆叠在一起。
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公开(公告)号：US20120280639A1
公开(公告)日：2012-11-08
申请号：US13300619
申请日：2011-11-20
申请人： CHIH-YUNG LIN , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHING-LIEN YEH , MIN-TSUN HSIEH , CHUAN-FU YANG
发明人： CHIH-YUNG LIN , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHING-LIEN YEH , MIN-TSUN HSIEH , CHUAN-FU YANG
IPC分类号： H05B37/02
CPC分类号： F21S8/06 , F21V15/01 , F21V23/005 , F21V2200/20 , F21Y2103/10 , F21Y2115/10
摘要： A planar lighting module comprises a substrate, at least one light guide device and a driver. A frame is located on the substrate for fastening the at least one light guide device and the driver. By manipulation and binding, the planar lighting module can be easily assembled or dismantled, no screws or welded joints are used, and it is also convenient to service.
摘要翻译： 平面照明模块包括基板，至少一个导光装置和驱动器。 框架位于基板上，用于紧固至少一个导光装置和驱动器。 通过操作和装订，可以容易地组装或拆卸平面照明模块，不使用螺丝或焊接接头，也方便使用。
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公开(公告)号：US20120075858A1
公开(公告)日：2012-03-29
申请号：US13172728
申请日：2011-06-29
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHUAN-FU YANG
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHUAN-FU YANG
CPC分类号： F21K9/23 , F21V3/00 , F21V29/74 , F21Y2115/10
摘要： An exemplary LED bulb includes a holder, a housing, a heat spreader, a power module and an LED module. The housing connects to the holder. The heat spreader detachably engages with the housing. The power module detachably engages with the housing and is received in the housing. The LED module is arranged on the heat spreader. The LED module electrically connects to the holder via the power module. The LED module is physically separated from the power module.
摘要翻译： 示例性的LED灯泡包括保持器，壳体，散热器，功率模块和LED模块。 外壳连接到支架。 散热器可拆卸地与壳体接合。 电源模块可拆卸地与壳体接合并被容纳在壳体中。 LED模块布置在散热器上。 LED模块通过电源模块电连接到支架。 LED模块与电源模块物理分离。
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公开(公告)号：US20110291135A1
公开(公告)日：2011-12-01
申请号：US13038385
申请日：2011-03-02
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号： H01L33/58
CPC分类号： H01L33/641 , H01L33/486 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/00011 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/01004 , H01L2924/00012
摘要： A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip.
摘要翻译： 发光二极管封装包括具有第一表面和与第一表面相对的第二表面的硅衬底，其中第一表面包括空腔，固定在空腔底部的发光二极管芯片和固定到 硅衬底并覆盖发光二极管芯片。
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公开(公告)号：US20110266570A1
公开(公告)日：2011-11-03
申请号：US12970976
申请日：2010-12-17
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO , JIAN-SHIHN TSANG
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO , JIAN-SHIHN TSANG
CPC分类号： H01L33/486 , H01L33/46 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.
摘要翻译： 在发光器件封装及其制造方法中，将多层结构分配在基板上，其中至少两个具有不同折射率的膜交替堆叠在一起。
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公开(公告)号：USD644189S1
公开(公告)日：2011-08-30
申请号：US29375805
申请日：2010-09-28
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公开(公告)号：US20110206079A1
公开(公告)日：2011-08-25
申请号：US12900676
申请日：2010-10-08
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
CPC分类号： H01L25/0756 , H01L25/167 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01S5/4025 , H01L2924/00012 , H01L2924/00014
摘要： A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.
摘要翻译： 侧面发射半导体封装包括形成在封装的硅衬底上的双面电路和接合在电路的两个双面上的多个半导体发光器件，以提供具有两个发光侧的表面安装器件。
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公开(公告)号：USD642998S1
公开(公告)日：2011-08-09
申请号：US29380580
申请日：2010-12-08
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公开(公告)号：USD642995S1
公开(公告)日：2011-08-09
申请号：US29375808
申请日：2010-09-28
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