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    Traffic light
    3.
    发明授权
    Traffic light 失效
    红绿灯

    公开(公告)号：US08459838B2

    公开(公告)日：2013-06-11

    申请号：US12900502

    申请日：2010-10-08

    申请人： Chi-Wei Liao ,  Wen-Liang Tseng ,  Min-Tsun Hsieh ,  Chih-Yung Lin ,  Ching-Lien Yeh

    发明人： Chi-Wei Liao ,  Wen-Liang Tseng ,  Min-Tsun Hsieh ,  Chih-Yung Lin ,  Ching-Lien Yeh

    IPC分类号： F21V33/00

    CPC分类号： F21V15/00 ,  G08G1/095

    摘要： A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.

    摘要翻译： 交通灯组件包括至少一个灯模块，位于所述至少一个灯模块前面的至少一个透镜，位于所述至少一个透镜前面的透明壳体和清洁装置。 清洁装置包括位于透明壳体的外表面上的擦拭器和驱动刮水器以刷透透明壳体的驱动器。

    LED PACKAGE
    4.
    发明申请
    LED PACKAGE 审中-公开
    LED封装

    公开(公告)号：US20110266574A1

    公开(公告)日：2011-11-03

    申请号：US13007677

    申请日：2011-01-17

    申请人： CHI-WEI LIAO ,  WEN-LIANG TSENG ,  CHIH-YUNG LIN ,  MIN-TSUN HSIEH ,  CHING-LIEN YEH

    发明人： CHI-WEI LIAO ,  WEN-LIANG TSENG ,  CHIH-YUNG LIN ,  MIN-TSUN HSIEH ,  CHING-LIEN YEH

    IPC分类号： H01L33/54

    CPC分类号： H01L33/508 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00014

    摘要： An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.

    摘要翻译： LED封装包括基板，LED管芯和封装层。 LED芯片设置在基板上。 封装层覆盖LED管芯和至少一部分衬底。 封装层包括光分散元件。 光散射元件的光散射强度与由LED管芯产生的光的光强度成比例，并在封装层处照射。 LED封装的中心处的亮度基本上与LED封装的周边相同。

    LIGHT EMITTING DIODE AND PACKAGE METHOD THEREOF
    9.
    发明申请
    LIGHT EMITTING DIODE AND PACKAGE METHOD THEREOF 审中-公开
    发光二极管及其封装方法

    公开(公告)号：US20090278152A1

    公开(公告)日：2009-11-12

    申请号：US12435937

    申请日：2009-05-05

    申请人： CHIA CHEN CHANG ,  YI HSUN CHEN ,  CHI WEI LIAO

    发明人： CHIA CHEN CHANG ,  YI HSUN CHEN ,  CHI WEI LIAO

    IPC分类号： H01L33/00 ,  H01L21/02

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    摘要： A light emitting diode comprises a sheet-like package body, a barricade, a light emitting diode die, and fluorescent filler. The sheet-like package body has a die-bonding region. The barricade is a transparent wall that is disposed on the die-bonding region, and is integrated with the sheet-like package body or is adhered to sheet-like package body. The light emitting diode die is disposed on the region enclosed by the barricade, and the fluorescent filler is also filled into the region and surrounds the light emitting diode die. The light emitting diode and the method for packaging the light emitting diode can improve the uniformity and efficiency of the outputting light emitted from the light emitting diode, and the loss of the outputted light is reduced.

    摘要翻译： 发光二极管包括片状封装体，路障，发光二极管管芯和荧光填料。 片状包装体具有芯片接合区域。 路障是设置在芯片接合区域上的透明壁，与片状封装体一体化，或者粘接在片状封装体上。 发光二极管管芯设置在由路障包围的区域上，并且荧光填料也填充到该区域中并且围绕发光二极管管芯。 发光二极管和封装发光二极管的方法可以提高从发光二极管发射的输出光的均匀性和效率，并且减少输出光的损失。