公开(公告)号：US08569791B2

公开(公告)日：2013-10-29

申请号：US13330704

申请日：2011-12-20

申请人： Pin-Chuan Chen ,  Hsin-Chiang Lin

发明人： Pin-Chuan Chen ,  Hsin-Chiang Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.

摘要翻译： LED（发光二极管）包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体限定了一个容纳芯片的腔体。 空腔包括与上室连通的上室和下室。 下室沿着LED的顶部到底部的方向逐渐扩大，并且上部腔室沿着LED的底部到顶部的方向逐渐扩大。 密封剂基本上填充下腔室和上腔室。

公开(公告)号：US08546160B2

公开(公告)日：2013-10-01

申请号：US13441934

申请日：2012-04-09

申请人： Pin-Chuan Chen

发明人： Pin-Chuan Chen

IPC分类号： H01L33/62 ,  H01L21/52

CPC分类号： H01L33/0095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00012

摘要： A method for packaging LEDs includes steps of: forming a substrate with a rectangular frame, a plurality of first and second electrode strips received within the frame and alternately arranged along a width direction of the frame; forming a carrier layer on each pair of the first and second electrode strips, the carrier layer defining a plurality of recesses; arranging an LED die in each recess and electrically connecting the LED die with first and second electrodes; forming an encapsulation in each recess to cover the LED die; and cutting the first and second electrode strips along the width direction of the frame to obtain a plurality of separated LED packages each including the first and second electrodes, the LED die, the encapsulation and a part of the carrier layer.

摘要翻译： 包装LED的方法包括以下步骤：形成具有矩形框架的基板，容纳在框架内的多个第一和第二电极条，并沿着框架的宽度方向交替布置; 在每对所述第一和第二电极条上形成载体层，所述载体层限定多个凹部; 在每个凹槽中布置LED管芯并将LED管芯与第一和第二电极电连接; 在每个凹部中形成封装以覆盖LED管芯; 以及沿着所述框架的宽度方向切割所述第一和第二电极条，以获得多个分离的LED封装，每个LED封装包括所述第一和第二电极，所述LED管芯，所述封装以及所述载体层的一部分。

公开(公告)号：US20130217160A1

公开(公告)日：2013-08-22

申请号：US13600128

申请日：2012-08-30

申请人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN

发明人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN

IPC分类号： H01L33/50 ,  B44C1/22 ,  B29C45/02

CPC分类号： C09K11/02 ,  C09K11/08 ,  H01L33/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.

摘要翻译： 一种制造用于LED封装的荧光膜的方法，包括以下步骤：提供包括第一和第二成型部件的模具，第一模制部件和第二模制部件协同地形成模制室，第一模制部件 限定与所述模制室连通的开口; 将荧光体颗粒和透明胶的混合物填充到第一开口中; 沿着从第一成型部到第二成型部的方向在第一开口中移动活塞，从而将混合物压入成型室; 使混合物固化形成荧光膜; 并从模具中去除荧光膜。 荧光体膜用于与安装有LED芯片的基板相对的LED芯片的顶面附着。

公开(公告)号：US20130217159A1

公开(公告)日：2013-08-22

申请号：US13571361

申请日：2012-08-10

申请人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

发明人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00

摘要： A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.

摘要翻译： 一种制造LED封装的方法，包括以下步骤：提供衬底并在衬底上形成间隔开的电极结构; 在基板的顶表面上提供模具，其中模具限定间隔开的环形槽，其与基板的顶表面配合以限定空腔; 用金属材料填充空腔; 去除模具并硬化金属材料以形成反射杯，其中每个反射杯围绕相应的电极结构并限定凹部; 抛光反射杯和电极结构的表面; 将LED芯片布置在凹陷中，每个LED芯片电连接到电极结构; 在所述凹部中注入密封层以密封所述LED芯片; 并切割基板以获得单独的LED封装。

公开(公告)号：US20130161681A1

公开(公告)日：2013-06-27

申请号：US13596024

申请日：2012-08-27

申请人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

发明人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

IPC分类号： H01L33/36

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip. The first lead and the second lead each include a first beam and a second beam connected to each other. Each of the first beam and the second beam has two opposite ends protruding beyond two opposite lateral faces of the base, respectively, for electrically connecting with a circuit board.

摘要翻译： LED包括基座，安装到基座的第一引线和第二引线，与第一引线和第二引线电连接的发光芯片，以及密封芯片的密封剂。 第一引线和第二引线各自包括彼此连接的第一光束和第二光束。 第一光束和第二光束中的每一个分别具有两个相对的端部，该两个相对端分别突出到基板的两个相对的侧面，用于与电路板电连接。

公开(公告)号：US20130052764A1

公开(公告)日：2013-02-28

申请号：US13523878

申请日：2012-06-14

申请人： LI-HSIANG CHEN ,  HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

发明人： LI-HSIANG CHEN ,  HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

IPC分类号： H01L33/52

CPC分类号： H01L33/642 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/189 ,  H05K3/0014 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0278 ,  H01L2924/00014

摘要： A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element.

摘要翻译： 一种封装发光二极管的方法，包括：提供具有导热层的柔性衬底，覆盖在导热层的表面上的绝缘层和位于绝缘层上的导电层; 蚀刻所述导电层以在所述导电层中形成间隙并暴露所述绝缘层的一部分，所述导电层被所述间隙分隔成彼此隔离的第一电极和第二电极; 在间隙的位置用模具冲压柔性基板以在柔性基板中形成凹部; 将发光元件定位在所述导电层上并将所述发光元件电连接到所述导电层; 并形成封装以覆盖发光元件。

公开(公告)号：US08356003B2

公开(公告)日：2013-01-15

申请号：US12618869

申请日：2009-11-16

申请人： Pin-Chuan Chen ,  Shu-Fen Lin ,  Chen-Kun Hsu ,  Yu-Huan Wang

发明人： Pin-Chuan Chen ,  Shu-Fen Lin ,  Chen-Kun Hsu ,  Yu-Huan Wang

IPC分类号： G06F17/00 ,  G06F7/00 ,  G06F15/18 ,  H04N5/77

CPC分类号： G08B25/14

摘要： A system for automated integration of events, configured for use in a building with a network system, includes a plurality of surveillance systems, a processing center connected to the surveillance systems through the network system and a user device connected to the processing center through the network system. The surveillance systems are adapted to monitor various kinds of irregular events occurring in the building and the surroundings thereof and output corresponding event messages through the network system. The processing center receives the event messages in a preset receiving mode and further classifies and analyzes the event messages. The user device allows users to input filtering conditions and enables the processing center to integrate the classified and analyzed event messages according to the input filtering conditions so as to generate composite filtered messages to be displayed on the user device, thereby achieving efficient acquisition and integration of the event messages.

摘要翻译： 用于自动整合事件的系统，被配置为用于具有网络系统的建筑物中，包括多个监视系统，通过网络系统连接到监视系统的处理中心和通过网络连接到处理中心的用户设备 系统。 监控系统适用于监控建筑物及其周围环境中发生的各种不规则事件，并通过网络系统输出相应的事件消息。 处理中心以预设接收模式接收事件消息，并对事件消息进行分类和分析。 用户设备允许用户输入过滤条件，使得处理中心可以根据输入的过滤条件对分类和分析的事件消息进行整合，以便生成要显示在用户设备上的复合过滤消息，从而实现高效的采集和集成 事件消息。

公开(公告)号：US20130001629A1

公开(公告)日：2013-01-03

申请号：US13330704

申请日：2011-12-20

申请人： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

发明人： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

IPC分类号： H01L33/62 ,  H01L33/48

CPC分类号： H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.

摘要翻译： LED（发光二极管）包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体限定了一个容纳芯片的腔体。 空腔包括与上室连通的上室和下室。 下室沿着LED的顶部到底部的方向逐渐扩大，并且上部腔室沿着LED的底部到顶部的方向逐渐扩大。 密封剂基本上填充下腔室和上腔室。

公开(公告)号：US20120322179A1

公开(公告)日：2012-12-20

申请号：US13441934

申请日：2012-04-09

申请人： PIN-CHUAN CHEN

发明人： PIN-CHUAN CHEN

IPC分类号： H01L33/52

CPC分类号： H01L33/0095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00012

摘要： A method for packaging LEDs includes steps of: forming a substrate with a rectangular frame, a plurality of first and second electrode strips received within the frame and alternately arranged along a width direction of the frame; forming a carrier layer on each pair of the first and second electrode strips, the carrier layer defining a plurality of recesses; arranging an LED die in each recess and electrically connecting the LED die with first and second electrodes; forming an encapsulation in each recess to cover the LED die; and cutting the first and second electrode strips along the width direction of the frame to obtain a plurality of separated LED packages each including the first and second electrodes, the LED die, the encapsulation and a part of the carrier layer.

摘要翻译： 包装LED的方法包括以下步骤：形成具有矩形框架的基板，容纳在框架内的多个第一和第二电极条，并沿着框架的宽度方向交替布置; 在每对所述第一和第二电极条上形成载体层，所述载体层限定多个凹部; 在每个凹槽中布置LED管芯并将LED管芯与第一和第二电极电连接; 在每个凹部中形成封装以覆盖LED管芯; 以及沿着所述框架的宽度方向切割所述第一和第二电极条，以获得多个分离的LED封装，每个LED封装包括所述第一和第二电极，所述LED管芯，所述封装以及所述载体层的一部分。

公开(公告)号：US08298861B2

公开(公告)日：2012-10-30

申请号：US12856052

申请日：2010-08-13

申请人： Pin Chuan Chen ,  Shen Bo Lin

发明人： Pin Chuan Chen ,  Shen Bo Lin

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating dielectric material. The die is mounted on the surface of the first conductive film, and is electrically connected to the first conductive film and the second conductive film through the metal wire. The transparent encapsulation material overlays the first conductive film, second conductive film, and die. The surfaces of the first conductive film and second conductive film which is opposite the transparent encapsulation material act as electrodes. The insulating dielectric material is between the first conductive film and second conductive film.

摘要翻译： 化合物半导体器件的封装结构包括薄膜衬底，裸片，至少一种金属线和透明封装材料。 薄膜基板包括第一导电膜，第二导电膜和绝缘电介质材料。 芯片安装在第一导电膜的表面上，并通过金属线与第一导电膜和第二导电膜电连接。 透明封装材料覆盖第一导电膜，第二导电膜和管芯。 与透明封装材料相对的第一导电膜和第二导电膜的表面充当电极。 绝缘电介质材料位于第一导电膜和第二导电膜之间。