公开(公告)号：US20110062474A1

公开(公告)日：2011-03-17

申请号：US12879255

申请日：2010-09-10

申请人： Pin Chuan Chen ,  Chao Hsiung Chang ,  Shen Bo Lin ,  Wen Liang Tseng

发明人： Pin Chuan Chen ,  Chao Hsiung Chang ,  Shen Bo Lin ,  Wen Liang Tseng

IPC分类号： H01L33/58 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

摘要： A light-emitting diode device includes a frame, a light-emitting diode die, a fluorescent layer, a reflector, and a lens. The light-emitting diode die is disposed on the frame. The fluorescent layer is directly molded to cover the light-emitting diode die. The reflector is directly molded on the frame, surrounding the light-emitting diode die, and configured to direct light from the light-emitting die in a predetermined direction. The lens is directly molded within the reflector, covering the fluorescent layer.

摘要翻译： 发光二极管装置包括框架，发光二极管管芯，荧光层，反射器和透镜。 发光二极管管芯设置在框架上。 荧光层直接模制以覆盖发光二极管管芯。 反射器直接模制在框架上，围绕发光二极管管芯，并被配置成沿预定方向引导来自发光管芯的光。 透镜在反射器内直接模制，覆盖荧光层。

公开(公告)号：US07863717B2

公开(公告)日：2011-01-04

申请号：US12396898

申请日：2009-03-03

申请人： Shih Hsiung Chan ,  Shen Bo Lin ,  Pin Chuan Chen

发明人： Shih Hsiung Chan ,  Shen Bo Lin ,  Pin Chuan Chen

IPC分类号： H01L21/98

CPC分类号： H01L23/3107 ,  H01L23/49861 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2224/05599

摘要： A package structure of an integrated circuit device comprises a copper foil substrate, an integrated circuit device, a plurality of metal wires and an encapsulation material. The copper foil substrate comprises an IC bonding area, a plurality of conductive areas and an insulating dielectric material. The integrated circuit device is mounted on the surface of the IC bonding area, and is electrically connected to the plurality of conductive areas through the metal wires. The insulating dielectric material is between the IC bonding area and the conductive areas, and is also between two adjacent conductive areas. In addition, the encapsulation material covers the IC bonding area, the conductive areas and the integrated circuit device.

摘要翻译： 集成电路器件的封装结构包括铜箔衬底，集成电路器件，多个金属线和封装材料。 铜箔基板包括IC结合区域，多个导电区域和绝缘电介质材料。 集成电路器件安装在IC接合区域的表面上，并且通过金属线电连接到多个导电区域。 绝缘介电材料位于IC接合区域和导电区域之间，并且也在两个相邻导电区域之间。 此外，封装材料覆盖IC接合区域，导电区域和集成电路器件。

公开(公告)号：US08298861B2

公开(公告)日：2012-10-30

申请号：US12856052

申请日：2010-08-13

申请人： Pin Chuan Chen ,  Shen Bo Lin

发明人： Pin Chuan Chen ,  Shen Bo Lin

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating dielectric material. The die is mounted on the surface of the first conductive film, and is electrically connected to the first conductive film and the second conductive film through the metal wire. The transparent encapsulation material overlays the first conductive film, second conductive film, and die. The surfaces of the first conductive film and second conductive film which is opposite the transparent encapsulation material act as electrodes. The insulating dielectric material is between the first conductive film and second conductive film.

摘要翻译： 化合物半导体器件的封装结构包括薄膜衬底，裸片，至少一种金属线和透明封装材料。 薄膜基板包括第一导电膜，第二导电膜和绝缘电介质材料。 芯片安装在第一导电膜的表面上，并通过金属线与第一导电膜和第二导电膜电连接。 透明封装材料覆盖第一导电膜，第二导电膜和管芯。 与透明封装材料相对的第一导电膜和第二导电膜的表面充当电极。 绝缘电介质材料位于第一导电膜和第二导电膜之间。

公开(公告)号：US07893528B2

公开(公告)日：2011-02-22

申请号：US12370923

申请日：2009-02-13

申请人： Pin Chuan Chen ,  Shen Bo Lin

发明人： Pin Chuan Chen ,  Shen Bo Lin

IPC分类号： H01L23/12

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating dielectric material. The die is mounted on the surface of the first conductive film, and is electrically connected to the first conductive film and the second conductive film through the metal wire. The transparent encapsulation material overlays the first conductive film, second conductive film, and die. The surfaces of the first conductive film and second conductive film which is opposite the transparent encapsulation material act as electrodes. The insulating dielectric material is between the first conductive film and second conductive film.

摘要翻译： 化合物半导体器件的封装结构包括薄膜衬底，裸片，至少一种金属线和透明封装材料。 薄膜基板包括第一导电膜，第二导电膜和绝缘电介质材料。 芯片安装在第一导电膜的表面上，并通过金属线与第一导电膜和第二导电膜电连接。 透明封装材料覆盖第一导电膜，第二导电膜和管芯。 与透明封装材料相对的第一导电膜和第二导电膜的表面充当电极。 绝缘电介质材料位于第一导电膜和第二导电膜之间。

公开(公告)号：US08378378B2

公开(公告)日：2013-02-19

申请号：US12902332

申请日：2010-10-12

申请人： Shen Bo Lin ,  Chao Hsiung Chang ,  Wen Liang Tseng

发明人： Shen Bo Lin ,  Chao Hsiung Chang ,  Wen Liang Tseng

IPC分类号： H01L31/048

CPC分类号： H01L33/62 ,  H01L23/055 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode. The cap layer covers the light emitting diode die.

摘要翻译： 一种发光二极管封装，包括具有第一表面的基座，附接到基座的电极部分，设置在第一表面上的一对内部电极，一对外部电极，一对导电柱，发光二极管管芯， 和盖层。 每个外电极包括端表面部分和侧表面部分。 端面部分对应于内部电极设置在第二表面上。 每个侧表面部分延伸到电极部分的侧表面上。 导电柱贯穿内电极和外电极之间。 发光二极管管芯位于第一表面上，电连接内部电极。 盖层覆盖发光二极管管芯。