公开(公告)号：US08569791B2

公开(公告)日：2013-10-29

申请号：US13330704

申请日：2011-12-20

申请人： Pin-Chuan Chen ,  Hsin-Chiang Lin

发明人： Pin-Chuan Chen ,  Hsin-Chiang Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.

摘要翻译： LED（发光二极管）包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体限定了一个容纳芯片的腔体。 空腔包括与上室连通的上室和下室。 下室沿着LED的顶部到底部的方向逐渐扩大，并且上部腔室沿着LED的底部到顶部的方向逐渐扩大。 密封剂基本上填充下腔室和上腔室。

公开(公告)号：US08883533B2

公开(公告)日：2014-11-11

申请号：US13571361

申请日：2012-08-10

申请人： Hsin-Chiang Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen

发明人： Hsin-Chiang Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC分类号： H01L21/00

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00

摘要： A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.

摘要翻译： 一种制造LED封装的方法，包括以下步骤：提供衬底并在衬底上形成间隔开的电极结构; 在基板的顶表面上提供模具，其中模具限定间隔开的环形槽，其与基板的顶表面配合以限定空腔; 用金属材料填充空腔; 去除模具并硬化金属材料以形成反射杯，其中每个反射杯围绕对应的电极结构并限定凹部; 抛光反射杯和电极结构的表面; 将LED芯片布置在凹陷中，每个LED芯片电连接到电极结构; 在所述凹部中注入密封层以密封所述LED芯片; 并切割基板以获得单独的LED封装。

公开(公告)号：US08535960B2

公开(公告)日：2013-09-17

申请号：US13600147

申请日：2012-08-30

申请人： Pin-Chuan Chen ,  Hsin-Chiang Lin

发明人： Pin-Chuan Chen ,  Hsin-Chiang Lin

IPC分类号： H01L21/00

CPC分类号： H01L33/50 ,  H01L2933/0041 ,  H01L2933/005

摘要： A method for packaging an LED, includes steps: providing a substrate; arranging an LED die on the substrate; forming a photoresist layer on the substrate to cover the LED die; arranging a mask directly on the photoresist layer; exposing the photoresist layer with the mask to a radiation source; removing the mask and the unexposed portion of the photoresist layer formerly sheltered by the mask, thereby leaving the exposed portion of the photoresist layer formerly unsheltered by the mask on the substrate, wherein the remained exposed portion of the photoresist layer surrounds the LED die; spraying fluorescent material toward the LED die surrounded by the remained exposed portion of the photoresist layer; removing the remained exposed portion of the photoresist layer; and finally encapsulating the LED die covered by the fluorescent material.

摘要翻译： 一种LED封装方法，包括：提供基板; 在基板上布置LED管芯; 在所述基板上形成光致抗蚀剂层以覆盖所述LED管芯; 在光致抗蚀剂层上直接配置掩模; 将具有掩模的光致抗蚀剂层暴露于辐射源; 去除掩模和以前被掩模掩蔽的光致抗蚀剂层的未曝光部分，从而使光致抗蚀剂层的暴露部分以前不被衬底上的掩模保护，其中光致抗蚀剂层的残留曝光部分围绕LED管芯; 向由光致抗蚀剂层的残留的暴露部分包围的LED管芯喷射荧光材料; 去除光致抗蚀剂层的残留的暴露部分; 并最终封装由荧光材料覆盖的LED管芯。

公开(公告)号：US08492180B2

公开(公告)日：2013-07-23

申请号：US13330688

申请日：2011-12-20

申请人： Hsin-Chiang Lin ,  Pin-Chuan Chen

发明人： Hsin-Chiang Lin ,  Pin-Chuan Chen

IPC分类号： H01L21/00

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing. A method for manufacturing the LED is also disclosed.

摘要翻译： LED包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体在其中心区域中限定空腔和邻近其周向周边的腔室。 引线的顶面暴露在腔室中。 在室中形成阻挡壁以接触引线的暴露的顶面。 阻挡壁和引线之间的接合力大于引线和外壳之间的结合力。 还公开了一种制造LED的方法。

公开(公告)号：US08373189B2

公开(公告)日：2013-02-12

申请号：US13290145

申请日：2011-11-07

申请人： Hsin-Chiang Lin ,  Pin-Chuan Chen

发明人： Hsin-Chiang Lin ,  Pin-Chuan Chen

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes an insulated frame, a first metallic conductor and a second metallic conductor, a chip and an encapsulation. The insulated frame has a receiving groove defined therein. The two metallic conductors are both mounted on bottom of the insulated frame and separated from each other. The chip is placed in the receiving groove and electrically connected to the two metallic conductors. The encapsulation is located in the receiving groove. The first metallic conductor and the second metallic conductor each comprise a mounting portion exposed to the receiving groove and a reflecting portion extending from the mounting portion into the insulated frame. The first reflecting portion and the second reflecting portion cooperatively surround the receiving groove of the insulated frame.

摘要翻译： LED封装包括绝缘框架，第一金属导体和第二金属导体，芯片和封装。 绝缘框架具有限定在其中的接收槽。 两个金属导体都安装在绝缘框架的底部并彼此分离。 芯片放置在接收槽中并电连接到两个金属导体。 封装位于接收槽中。 第一金属导体和第二金属导体各自包括暴露于接收槽的安装部分和从安装部分延伸到绝缘框架中的反射部分。 第一反射部分和第二反射部分协作地围绕绝缘框架的接收槽。

公开(公告)号：US08569080B2

公开(公告)日：2013-10-29

申请号：US13523878

申请日：2012-06-14

申请人： Li-Hsiang Chen ,  Hsin-Chiang Lin ,  Pin-Chuan Chen

发明人： Li-Hsiang Chen ,  Hsin-Chiang Lin ,  Pin-Chuan Chen

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/189 ,  H05K3/0014 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0278 ,  H01L2924/00014

摘要： A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element.

摘要翻译： 一种封装发光二极管的方法，包括：提供具有导热层的柔性衬底，覆盖在导热层的表面上的绝缘层和位于绝缘层上的导电层; 蚀刻所述导电层以在所述导电层中形成间隙并暴露所述绝缘层的一部分，所述导电层被所述间隙分隔成彼此隔离的第一电极和第二电极; 在间隙的位置用模具冲压柔性基板以在柔性基板中形成凹部; 将发光元件定位在所述导电层上并将所述发光元件电连接到所述导电层; 并形成封装以覆盖发光元件。

公开(公告)号：US08735933B2

公开(公告)日：2014-05-27

申请号：US13370316

申请日：2012-02-10

申请人： Hsin-Chiang Lin ,  Pin-Chuan Chen

发明人： Hsin-Chiang Lin ,  Pin-Chuan Chen

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/16 ,  H01L2933/0033

摘要： An LED package includes a base, an LED chip, and an electrode layer. The base has thereon a first electrical connecting layer and a separated second electrical connecting layer. The LED chip is placed on the base and electrically connected with the first electrical connecting layer and the second electrical connecting layer by flip chip bonding. The electrode layer comprises a first electrode and a separated second electrode, and a receiving groove being defined between the first electrode and the second electrode. The base is received in the receiving groove of the electrode layer with the first electrical connecting layer being electrically connected to the first electrode, and the second electrical connecting layer being electrically connected to the second electrode.

摘要翻译： LED封装包括基底，LED芯片和电极层。 底座上具有第一电连接层和分开的第二电连接层。 LED芯片放置在基座上，并通过倒装芯片接合与第一电连接层和第二电连接层电连接。 电极层包括第一电极和分离的第二电极，以及限定在第一电极和第二电极之间的接收槽。 基座被容纳在电极层的接收槽中，其中第一电连接层电连接到第一电极，并且第二电连接层电连接到第二电极。

公开(公告)号：US08633507B2

公开(公告)日：2014-01-21

申请号：US13596024

申请日：2012-08-27

申请人： Hsin-Chiang Lin ,  Pin-Chuan Chen

发明人： Hsin-Chiang Lin ,  Pin-Chuan Chen

IPC分类号： H01L33/00 ,  H01L23/48 ,  H01L21/00

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip. The first lead and the second lead each include a first beam and a second beam connected to each other. Each of the first beam and the second beam has two opposite ends protruding beyond two opposite lateral faces of the base, respectively, for electrically connecting with a circuit board.

摘要翻译： LED包括基座，安装到基座的第一引线和第二引线，与第一引线和第二引线电连接的发光芯片，以及密封芯片的密封剂。 第一引线和第二引线各自包括彼此连接的第一光束和第二光束。 第一光束和第二光束中的每一个分别具有两个相对的端部，该两个相对端分别突出到基板的两个相对的侧面，用于与电路板电连接。

公开(公告)号：US08513695B2

公开(公告)日：2013-08-20

申请号：US13326341

申请日：2011-12-15

申请人： Hsin-Chiang Lin ,  Pin-Chuan Chen

发明人： Hsin-Chiang Lin ,  Pin-Chuan Chen

IPC分类号： H01L33/00

CPC分类号： H01L33/52 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate, an LED die, electrodes, a reflective cup, a barrier portion and an encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. The electrodes are formed on the substrate and spaced from each other. The barrier portion is formed on the electrodes and covered by the reflective cup, wherein a bonding force between the barrier portion and the electrodes is larger than that between the reflective cup and the electrodes. The LED die is mounted on one of the electrodes, received in the reflective cup and electrically connected to the electrodes via wire bonding. The disclosure also provides a method for making an LED package.

摘要翻译： LED封装包括基板，LED管芯，电极，反射杯，阻挡部分和封装。 基板包括第一表面和与第一表面相对的第二表面。 电极形成在基板上并且彼此间隔开。 阻挡部分形成在电极上并被反射杯覆盖，其中阻挡部分和电极之间的结合力大于反射杯和电极之间的结合力。 LED管芯安装在一个电极上，容纳在反射杯中，并通过引线接合电连接到电极。 本公开还提供了一种制造LED封装的方法。

公开(公告)号：US08455274B2

公开(公告)日：2013-06-04

申请号：US13286090

申请日：2011-10-31

申请人： Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Wen-Liang Tseng

发明人： Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Wen-Liang Tseng

IPC分类号： H01L33/48

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85

摘要： A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages.

摘要翻译： 一种制造发光二极管的方法，包括以下步骤：提供具有形成在其顶面和底面上的上导电层和下导电层的基板; 将上导电层和下导电层分别分成第一区和第二区; 通过上导电层的第一区域限定衬底中的空腔，以暴露下导电层; 在所述衬底内形成导电柱; 形成覆盖层以连接上和下导电层的第一区域; 将芯片安装在空腔内的覆盖层上，并将每个芯片与相邻的第一区域和柱子电连接; 在所述基板上形成密封剂以覆盖所述芯片; 并将基材切割成单独的包装。