公开(公告)号：US08455274B2

公开(公告)日：2013-06-04

申请号：US13286090

申请日：2011-10-31

申请人： Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Wen-Liang Tseng

发明人： Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Wen-Liang Tseng

IPC分类号： H01L33/48

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85

摘要： A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages.

摘要翻译： 一种制造发光二极管的方法，包括以下步骤：提供具有形成在其顶面和底面上的上导电层和下导电层的基板; 将上导电层和下导电层分别分成第一区和第二区; 通过上导电层的第一区域限定衬底中的空腔，以暴露下导电层; 在所述衬底内形成导电柱; 形成覆盖层以连接上和下导电层的第一区域; 将芯片安装在空腔内的覆盖层上，并将每个芯片与相邻的第一区域和柱子电连接; 在所述基板上形成密封剂以覆盖所述芯片; 并将基材切割成单独的包装。

公开(公告)号：US09012248B2

公开(公告)日：2015-04-21

申请号：US13612895

申请日：2012-09-13

申请人： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

发明人： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

IPC分类号： H01L33/50 ,  H01L33/52 ,  H01L33/00 ,  H01L33/48

CPC分类号： H01L33/50 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00

摘要： A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages.

摘要翻译： 一种用于封装LED的方法包括以下步骤：为基板提供其上形成的电路结构，将基板堆叠在支撑板上，并在基板上布置多个LED管芯; 提供模具和凝胶态荧光膜，将支撑板定位在模具中并用凝胶态荧光膜覆盖模具，以协调地限定荧光膜，模具和支撑板之间的接收空间，基板和 LED管芯在接收空间中被接收; 在接收空间排出空气，将凝胶态荧光膜附着在LED管芯上; 固化凝胶状荧光膜并去除模具; 在衬底上形成封装以覆盖LED管芯; 切割基板并移除支撑板以获得几个单独的LED封装。

公开(公告)号：US08455275B2

公开(公告)日：2013-06-04

申请号：US13309576

申请日：2011-12-02

申请人： Meng-Hsien Hong ,  Wen-Liang Tseng ,  Hsin-Tung Chiang ,  Pin-Chuan Chen

发明人： Meng-Hsien Hong ,  Wen-Liang Tseng ,  Hsin-Tung Chiang ,  Pin-Chuan Chen

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode package includes a substrate with a first metal layer, a second metal layer and an insulating layer between the first metal layer and the second metal layer. A cavity is defined in the insulating layer and the second metal layer. The second metal layer surrounding the cavity is divided into a first conductive portion and a second conductive portion. An LED chip is positioned inside the cavity and on an upper surface of the first metal layer. The LED chip has two electrodes electrically connected to the first conductive portion and the second conductive portion respectively. The cavity is filled with an encapsulation to cover the LED chip. A method for manufacturing the LED package is also disclosed.

摘要翻译： 发光二极管封装包括在第一金属层和第二金属层之间具有第一金属层，第二金属层和绝缘层的衬底。 在绝缘层和第二金属层中限定空腔。 围绕空腔的第二金属层被分成第一导电部分和第二导电部分。 LED芯片位于空腔内部和第一金属层的上表面上。 LED芯片具有分别与第一导电部分和第二导电部分电连接的两个电极。 空腔填充有封装以覆盖LED芯片。 还公开了一种用于制造LED封装的方法。

公开(公告)号：US08906715B2

公开(公告)日：2014-12-09

申请号：US13600236

申请日：2012-08-31

申请人： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

发明人： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

IPC分类号： H01L21/00

CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

摘要： A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.

摘要翻译： 一种LED封装方法，包括以下步骤：在支撑板上提供支撑板，然后将与荧光体混合的凝胶滴下; 用刮板在支撑板上刮擦凝胶，在支撑板上形成凝胶状荧光膜，并固化凝胶状荧光膜片以形成凝固的荧光膜; 将固化的荧光膜切割成单独的片，并将固体荧光膜从支撑板剥离; 将一片荧光膜附接到LED管芯的光输出表面上; 将LED管芯安装在基板上，并将LED管芯电连接到电路结构; 以及在所述衬底上形成封装以覆盖所述LED管芯。

公开(公告)号：US08658445B2

公开(公告)日：2014-02-25

申请号：US13600128

申请日：2012-08-30

申请人： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

发明人： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

IPC分类号： H01L21/00

CPC分类号： C09K11/02 ,  C09K11/08 ,  H01L33/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.

摘要翻译： 一种制造用于LED封装的荧光膜的方法，包括以下步骤：提供包括第一和第二成型部件的模具，第一模制部件和第二模制部件协同地形成模制室，第一模制部件 限定与所述模制室连通的开口; 将荧光体颗粒和透明胶的混合物填充到第一开口中; 沿着从第一成型部到第二成型部的方向在第一开口中移动活塞，从而将混合物压入成型室; 使混合物固化形成荧光膜; 并从模具中去除荧光膜。 荧光体膜用于与安装有LED芯片的基板相对的LED芯片的顶面附着。

公开(公告)号：US08664018B2

公开(公告)日：2014-03-04

申请号：US13290144

申请日：2011-11-07

申请人： Hsin-Chiang Lin ,  Wen-Liang Tseng ,  Chieh-Ling Chang

发明人： Hsin-Chiang Lin ,  Wen-Liang Tseng ,  Chieh-Ling Chang

IPC分类号： H01L21/00

CPC分类号： H01L33/504 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.

摘要翻译： 本公开提供了一种用于LED封装的制造方法。 包含一个第一发光转换元件的第一发光转换层位于LED芯片上，其中第一发光转换元件通过围绕LED芯片离心沉淀而不遮挡LED芯片。 此后，第二发光转换层位于第一发光转换层上。 第二发光层具有比第一发光转换元件低的激发效率的第二发光转换元件。

公开(公告)号：US08476664B2

公开(公告)日：2013-07-02

申请号：US13288038

申请日：2011-11-03

申请人： Hsin-Chiang Lin ,  Wen-Liang Tseng ,  Chieh-Ling Chang

发明人： Hsin-Chiang Lin ,  Wen-Liang Tseng ,  Chieh-Ling Chang

IPC分类号： H01L33/00 ,  H01L27/15

CPC分类号： H01L33/504 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2933/0041 ,  H01L2924/00014

摘要： A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.

摘要翻译： 一种发光二极管封装，包括在第一发光转换层上的发光二极管芯片，第一发光转换层和单独的第二发光转换层。 第一发光转换层具有围绕发光二极管芯片的第一发光转换元件。 第二发光转换层具有位于发光二极管芯片上方的第二发光转换元件。 第一发光转换元件的激发效率高于第二发光转换元件的激发效率。

公开(公告)号：US08541799B2

公开(公告)日：2013-09-24

申请号：US13113081

申请日：2011-05-23

申请人： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin ,  Ching-Lien Yeh ,  Chi-Wei Liao

发明人： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin ,  Ching-Lien Yeh ,  Chi-Wei Liao

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0083

摘要： A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.

摘要翻译： 发光元件封装包括用于封装发光元件的封装构件。 在封装构件上形成多个光子晶体图案。 光子晶体图案的分布密度对应于发光元件的光分布。 每个光子晶体图案由多个光子晶体组成。

公开(公告)号：US08459838B2

公开(公告)日：2013-06-11

申请号：US12900502

申请日：2010-10-08

申请人： Chi-Wei Liao ,  Wen-Liang Tseng ,  Min-Tsun Hsieh ,  Chih-Yung Lin ,  Ching-Lien Yeh

发明人： Chi-Wei Liao ,  Wen-Liang Tseng ,  Min-Tsun Hsieh ,  Chih-Yung Lin ,  Ching-Lien Yeh

IPC分类号： F21V33/00

CPC分类号： F21V15/00 ,  G08G1/095

摘要： A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.

摘要翻译： 交通灯组件包括至少一个灯模块，位于所述至少一个灯模块前面的至少一个透镜，位于所述至少一个透镜前面的透明壳体和清洁装置。 清洁装置包括位于透明壳体的外表面上的擦拭器和驱动刮水器以刷透透明壳体的驱动器。

公开(公告)号：US07031854B2

公开(公告)日：2006-04-18

申请号：US10883788

申请日：2004-07-06

申请人： Syh-Shoei Lin ,  Wen-Liang Tseng ,  Jan-Ku Chen

发明人： Syh-Shoei Lin ,  Wen-Liang Tseng ,  Jan-Ku Chen

IPC分类号： G01R21/00

CPC分类号： G01R21/133

摘要： A universal power measurement SoC includes an analog signal conditioning circuit, analog-to-digital converter circuit, memory and micro control unit. The analog signal conditioning circuit receives physical signals from a signal sensor and adjusts the polarities and amplitudes of the signals to produce suitable analog signals and gain status. The analog-to-digital converter circuit converts the adjusted analog signals into digital signals. The memory stores the pre-setup parameters of the power measurement. The micro control unit, according to users' choices, processes the converted digital signals with the gain status to produce the output signals of the power measurement.

摘要翻译： 通用功率测量SoC包括模拟信号调理电路，模数转换器电路，存储器和微控制单元。 模拟信号调理电路从信号传感器接收物理信号，并调整信号的极性和振幅，以产生合适的模拟信号和增益状态。 模拟 - 数字转换器电路将经调整的模拟信号转换为数字信号。 存储器存储功率测量的预设参数。 微控制单元根据用户的选择，对具有增益状态的转换数字信号进行处理，以产生功率测量的输出信号。