公开(公告)号：US07031854B2

公开(公告)日：2006-04-18

申请号：US10883788

申请日：2004-07-06

申请人： Syh-Shoei Lin ,  Wen-Liang Tseng ,  Jan-Ku Chen

发明人： Syh-Shoei Lin ,  Wen-Liang Tseng ,  Jan-Ku Chen

IPC分类号： G01R21/00

CPC分类号： G01R21/133

摘要： A universal power measurement SoC includes an analog signal conditioning circuit, analog-to-digital converter circuit, memory and micro control unit. The analog signal conditioning circuit receives physical signals from a signal sensor and adjusts the polarities and amplitudes of the signals to produce suitable analog signals and gain status. The analog-to-digital converter circuit converts the adjusted analog signals into digital signals. The memory stores the pre-setup parameters of the power measurement. The micro control unit, according to users' choices, processes the converted digital signals with the gain status to produce the output signals of the power measurement.

摘要翻译： 通用功率测量SoC包括模拟信号调理电路，模数转换器电路，存储器和微控制单元。 模拟信号调理电路从信号传感器接收物理信号，并调整信号的极性和振幅，以产生合适的模拟信号和增益状态。 模拟 - 数字转换器电路将经调整的模拟信号转换为数字信号。 存储器存储功率测量的预设参数。 微控制单元根据用户的选择，对具有增益状态的转换数字信号进行处理，以产生功率测量的输出信号。

公开(公告)号：US20050143961A1

公开(公告)日：2005-06-30

申请号：US10883788

申请日：2004-07-06

申请人： Syh-Shoei Lin ,  Wen-Liang Tseng ,  Jan-Ku Chen

发明人： Syh-Shoei Lin ,  Wen-Liang Tseng ,  Jan-Ku Chen

IPC分类号： G01R21/133 ,  G06F19/00

CPC分类号： G01R21/133

摘要： A universal power measurement SoC includes an analog signal conditioning circuit, analog-to-digital converter circuit, memory and micro control unit. The analog signal conditioning circuit receives physical signals from a signal sensor and adjusts the polarities and amplitudes of the signals to produce suitable analog signals and gain status. The analog-to-digital converter circuit converts the adjusted analog signals into digital signals. The memory stores the pre-setup parameters of the power measurement. The micro control unit, according to users' choices, processes the converted digital signals with the gain status to produce the output signals of the power measurement. The SoC can reduce the number of the needed devices, cost, and the production adjusting period for promoting the system functions, increase the stability, accuracy, and the flexibility of application, and simplify the procedure of adjusting and production.

摘要翻译： 通用功率测量SoC包括模拟信号调理电路，模数转换器电路，存储器和微控制单元。 模拟信号调理电路从信号传感器接收物理信号，并调整信号的极性和振幅，以产生合适的模拟信号和增益状态。 模拟 - 数字转换器电路将经调整的模拟信号转换为数字信号。 存储器存储功率测量的预设参数。 微控制单元根据用户的选择，对具有增益状态的转换数字信号进行处理，以产生功率测量的输出信号。 SoC可以减少所需设备的数量，成本和生产调整周期，以促进系统功能，提高应用的稳定性，准确性和灵活性，简化调整和生产过程。

公开(公告)号：US06577191B2

公开(公告)日：2003-06-10

申请号：US09986482

申请日：2001-11-08

申请人： Syh-Shoei Lin ,  Sandra Young ,  Wen-Liang Tseng ,  Seng-Fa Chang

发明人： Syh-Shoei Lin ,  Sandra Young ,  Wen-Liang Tseng ,  Seng-Fa Chang

IPC分类号： H03G320

CPC分类号： H03M1/186

摘要： A front-end signal-processing device having an automatic gain-control function used in the analog-to-digital conversion. The circuit comprises a buffer circuit, an amplifying/attenuating circuit, a pre-processing gain-adjusting circuit and an amplification/attenuation gain-adjusting circuit. In the front-end signal-processing device having an automatic gain-control function used in the analog-to-digital conversion, a set of gain-adjusting signals S1 and S2 are produced by hardware for controlling the amplification or attenuation gain of signals, thereby automatically adjusting the amplitude of the input signals. In addition, the microprocessor can select an appropriate restoring parameter according to the gain-adjusting signals to ensure that the numeral result conforms to the original input signal.

公开(公告)号：US5229699A

公开(公告)日：1993-07-20

申请号：US776837

申请日：1991-10-15

申请人： Yao-Tung Chu ,  Jan-Ku Chen ,  Wen-Liang Tseng ,  Ching-Gueg Tseng ,  Shin-Far Chang ,  Kwo-Guang Chong

发明人： Yao-Tung Chu ,  Jan-Ku Chen ,  Wen-Liang Tseng ,  Ching-Gueg Tseng ,  Shin-Far Chang ,  Kwo-Guang Chong

IPC分类号： G05B11/42

CPC分类号： G05B11/42

摘要： A method for tuning P-, I- and D-type controller which is used in combination or individually to control a variable y of a process in a feedback system, which comprises making the integrating (I) and derivative (D) unit of the controller inoperative; increasing the proportional control gain K until a desired oscillation is obtained; calculating the ultimate gain Ku and ultimate period Tu in accordance with the amplitude and period measured from the oscillation; and setting the parameters of the PID controller in dependence upon the Ku and Tu values, wherein the control signal U resulting from the controller gain K is restricted to a range from a lower limit Umin to an upper limit Umax to avoid the system being operated in an unstable condition. An apparatus suitable for performing the present method is also disclosed.

摘要翻译： 一种用于调整P，I和D型控制器的方法，其组合或单独地用于控制反馈系统中的处理的变量y，其包括使得所述反馈系统中的积分（I）和微分（D）单元 控制器不工作 增加比例控制增益K，直到获得期望的振荡; 根据振荡测量的振幅和周期计算最终增益Ku和最终周期Tu; 并且根据Ku和Tu值设定PID控制器的参数，其中由控制器增益K产生的控制信号U被限制在从下限Umin到上限Umax的范围内，以避免系统在 一个不稳定的状况。 还公开了适用于执行本方法的装置。

公开(公告)号：US08541799B2

公开(公告)日：2013-09-24

申请号：US13113081

申请日：2011-05-23

申请人： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin ,  Ching-Lien Yeh ,  Chi-Wei Liao

发明人： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin ,  Ching-Lien Yeh ,  Chi-Wei Liao

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0083

摘要： A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.

摘要翻译： 发光元件封装包括用于封装发光元件的封装构件。 在封装构件上形成多个光子晶体图案。 光子晶体图案的分布密度对应于发光元件的光分布。 每个光子晶体图案由多个光子晶体组成。

公开(公告)号：US08459838B2

公开(公告)日：2013-06-11

申请号：US12900502

申请日：2010-10-08

申请人： Chi-Wei Liao ,  Wen-Liang Tseng ,  Min-Tsun Hsieh ,  Chih-Yung Lin ,  Ching-Lien Yeh

发明人： Chi-Wei Liao ,  Wen-Liang Tseng ,  Min-Tsun Hsieh ,  Chih-Yung Lin ,  Ching-Lien Yeh

IPC分类号： F21V33/00

CPC分类号： F21V15/00 ,  G08G1/095

摘要： A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.

摘要翻译： 交通灯组件包括至少一个灯模块，位于所述至少一个灯模块前面的至少一个透镜，位于所述至少一个透镜前面的透明壳体和清洁装置。 清洁装置包括位于透明壳体的外表面上的擦拭器和驱动刮水器以刷透透明壳体的驱动器。

公开(公告)号：US09012248B2

公开(公告)日：2015-04-21

申请号：US13612895

申请日：2012-09-13

申请人： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

发明人： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

IPC分类号： H01L33/50 ,  H01L33/52 ,  H01L33/00 ,  H01L33/48

CPC分类号： H01L33/50 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00

摘要： A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages.

摘要翻译： 一种用于封装LED的方法包括以下步骤：为基板提供其上形成的电路结构，将基板堆叠在支撑板上，并在基板上布置多个LED管芯; 提供模具和凝胶态荧光膜，将支撑板定位在模具中并用凝胶态荧光膜覆盖模具，以协调地限定荧光膜，模具和支撑板之间的接收空间，基板和 LED管芯在接收空间中被接收; 在接收空间排出空气，将凝胶态荧光膜附着在LED管芯上; 固化凝胶状荧光膜并去除模具; 在衬底上形成封装以覆盖LED管芯; 切割基板并移除支撑板以获得几个单独的LED封装。

公开(公告)号：US08816372B2

公开(公告)日：2014-08-26

申请号：US13337125

申请日：2011-12-25

申请人： Chia-Chiang Yang ,  Wen-Liang Tseng

发明人： Chia-Chiang Yang ,  Wen-Liang Tseng

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  C08G77/58 ,  C09D183/14 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48227

摘要： An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allyltrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.

摘要翻译： LED封装包括基板，电极结构，LED管芯，封装部分和覆盖部分。 电极结构形成在基板上。 LED芯片安装在基板上，并与电极结构电连接。 封装部分覆盖LED管芯。 覆盖部分围绕LED封装的周边并密封基板，电极结构和封装部分之间的接合部。 覆盖部分由具有反应性单体的硅酸钛树脂制成，其中反应性单体包含大于60％的庚烷，7.0％至13.0％的烯丙基三甲氧基硅烷，5.0％至10.0％的四丁基钛酸酯和小于0.1％的四甲氧基硅烷 。

公开(公告)号：US08664018B2

公开(公告)日：2014-03-04

申请号：US13290144

申请日：2011-11-07

申请人： Hsin-Chiang Lin ,  Wen-Liang Tseng ,  Chieh-Ling Chang

发明人： Hsin-Chiang Lin ,  Wen-Liang Tseng ,  Chieh-Ling Chang

IPC分类号： H01L21/00

CPC分类号： H01L33/504 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.

摘要翻译： 本公开提供了一种用于LED封装的制造方法。 包含一个第一发光转换元件的第一发光转换层位于LED芯片上，其中第一发光转换元件通过围绕LED芯片离心沉淀而不遮挡LED芯片。 此后，第二发光转换层位于第一发光转换层上。 第二发光层具有比第一发光转换元件低的激发效率的第二发光转换元件。

公开(公告)号：US08270444B2

公开(公告)日：2012-09-18

申请号：US12900676

申请日：2010-10-08

申请人： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin

发明人： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin

IPC分类号： H01S3/00 ,  H01L33/00

CPC分类号： H01L25/0756 ,  H01L25/167 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01S5/4025 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.

摘要翻译： 侧面发射半导体封装包括形成在封装的硅衬底上的双面电路和接合在电路的两个双面上的多个半导体发光器件，以提供具有两个发光侧的表面安装器件。