公开(公告)号：US20120305960A1

公开(公告)日：2012-12-06

申请号：US13337125

申请日：2011-12-25

申请人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

发明人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

IPC分类号： H01L33/60 ,  H01L33/62

CPC分类号： H01L33/486 ,  C08G77/58 ,  C09D183/14 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48227

摘要： An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allytrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.

摘要翻译： LED封装包括基板，电极结构，LED管芯，封装部分和覆盖部分。 电极结构形成在基板上。 LED芯片安装在基板上，并与电极结构电连接。 封装部分覆盖LED管芯。 覆盖部分围绕LED封装的周边并密封基板，电极结构和封装部分之间的接合部。 覆盖部分由具有反应性单体的硅酸钛树脂制成，其中反应性单体包含超过60％的庚烷，7.0％至13.0％的烯丙基三甲氧基硅烷，5.0％至10.0％的四丁基钛酸酯和小于0.1％的四甲氧基硅烷 。

公开(公告)号：US08816372B2

公开(公告)日：2014-08-26

申请号：US13337125

申请日：2011-12-25

申请人： Chia-Chiang Yang ,  Wen-Liang Tseng

发明人： Chia-Chiang Yang ,  Wen-Liang Tseng

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  C08G77/58 ,  C09D183/14 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48227

摘要： An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allyltrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.

摘要翻译： LED封装包括基板，电极结构，LED管芯，封装部分和覆盖部分。 电极结构形成在基板上。 LED芯片安装在基板上，并与电极结构电连接。 封装部分覆盖LED管芯。 覆盖部分围绕LED封装的周边并密封基板，电极结构和封装部分之间的接合部。 覆盖部分由具有反应性单体的硅酸钛树脂制成，其中反应性单体包含大于60％的庚烷，7.0％至13.0％的烯丙基三甲氧基硅烷，5.0％至10.0％的四丁基钛酸酯和小于0.1％的四甲氧基硅烷 。

公开(公告)号：US20130107511A1

公开(公告)日：2013-05-02

申请号：US13492926

申请日：2012-06-11

申请人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

发明人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

IPC分类号： F21V13/08 ,  F21V9/00

CPC分类号： F21V7/048 ,  F21S2/005 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10

摘要： An LED illumination module includes a base, first white-light LEDs mounted on a central portion of a top surface of the base, and second white-light LEDs mounted on a periphery of the top surface of the base and surrounding the first white-light LEDs. A power of the first white-light LEDs is equal to that of the second white-light LEDs. An average value of luminescence efficiencies of the first white-light LEDs is smaller than that of the second white-light LEDs. An average value of color rendering indexes of the first white-light LEDs is larger than that of the second white-light LEDs.

摘要翻译： LED照明模块包括基座，安装在基座顶面的中心部分上的第一白光LED以及安装在基座顶表面周围并围绕第一白光的第二白光LED LED。 第一白光LED的功率等于第二白光LED的功率。 第一白光LED的发光效率的平均值小于第二白光LED的发光效率的平均值。 第一白光LED的显色指数的平均值大于第二白光LED的显色指数的平均值。

公开(公告)号：US20130082293A1

公开(公告)日：2013-04-04

申请号：US13366376

申请日：2012-02-06

申请人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

发明人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

IPC分类号： H01L33/60

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： An LED package device comprises a substrate, an LED chip, a reflector and a covering layer. The covering layer completely encapsulates the reflector, the LED chip and the substrate to enhance the robustness and unitary integrity of the LED package device; two electrodes comprising two bulges penetrate through the covering layer to reach a base of the LED package device. The LED package device is able to function as a side emitting type of LED package. Front sides of the two bulges are level with a front side of the LED package device and configured for being mounted to a printed circuit board and electrically connecting therewith.

摘要翻译： LED封装器件包括衬底，LED芯片，反射器和覆盖层。 覆盖层完全封装反射器，LED芯片和基板，以增强LED封装器件的鲁棒性和统一的完整性; 包括两个凸起的两个电极穿过覆盖层以到达LED封装装置的基座。 LED封装器件能够用作LED封装的侧面发射型。 两个凸起的前侧与LED封装装置的前侧平齐，并且被配置为安装到印刷电路板并与其电连接。