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    LED PACKAGE AND METHOD FOR MAKING THE SAME
    1.
    发明申请
    LED PACKAGE AND METHOD FOR MAKING THE SAME 有权
    LED封装及其制造方法

    公开(公告)号：US20120305960A1

    公开(公告)日：2012-12-06

    申请号：US13337125

    申请日：2011-12-25

    申请人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

    发明人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

    IPC分类号： H01L33/60 ,  H01L33/62

    CPC分类号： H01L33/486 ,  C08G77/58 ,  C09D183/14 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48227

    摘要： An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allytrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.

    摘要翻译： LED封装包括基板，电极结构，LED管芯，封装部分和覆盖部分。 电极结构形成在基板上。 LED芯片安装在基板上，并与电极结构电连接。 封装部分覆盖LED管芯。 覆盖部分围绕LED封装的周边并密封基板，电极结构和封装部分之间的接合部。 覆盖部分由具有反应性单体的硅酸钛树脂制成，其中反应性单体包含超过60％的庚烷，7.0％至13.0％的烯丙基三甲氧基硅烷，5.0％至10.0％的四丁基钛酸酯和小于0.1％的四甲氧基硅烷 。

    LED ILLUMINATION MODULE
    2.
    发明申请
    LED ILLUMINATION MODULE 审中-公开
    LED照明模块

    公开(公告)号：US20130107511A1

    公开(公告)日：2013-05-02

    申请号：US13492926

    申请日：2012-06-11

    申请人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

    发明人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

    IPC分类号： F21V13/08 ,  F21V9/00

    CPC分类号： F21V7/048 ,  F21S2/005 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10

    摘要： An LED illumination module includes a base, first white-light LEDs mounted on a central portion of a top surface of the base, and second white-light LEDs mounted on a periphery of the top surface of the base and surrounding the first white-light LEDs. A power of the first white-light LEDs is equal to that of the second white-light LEDs. An average value of luminescence efficiencies of the first white-light LEDs is smaller than that of the second white-light LEDs. An average value of color rendering indexes of the first white-light LEDs is larger than that of the second white-light LEDs.

    摘要翻译： LED照明模块包括基座，安装在基座顶面的中心部分上的第一白光LED以及安装在基座顶表面周围并围绕第一白光的第二白光LED LED。 第一白光LED的功率等于第二白光LED的功率。 第一白光LED的发光效率的平均值小于第二白光LED的发光效率的平均值。 第一白光LED的显色指数的平均值大于第二白光LED的显色指数的平均值。

    LED PACKAGE DEVICE
    3.
    发明申请
    LED PACKAGE DEVICE 审中-公开
    LED封装设备

    公开(公告)号：US20130082293A1

    公开(公告)日：2013-04-04

    申请号：US13366376

    申请日：2012-02-06

    申请人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

    发明人： CHIA-CHIANG YANG ,  WEN-LIANG TSENG

    IPC分类号： H01L33/60

    CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

    摘要： An LED package device comprises a substrate, an LED chip, a reflector and a covering layer. The covering layer completely encapsulates the reflector, the LED chip and the substrate to enhance the robustness and unitary integrity of the LED package device; two electrodes comprising two bulges penetrate through the covering layer to reach a base of the LED package device. The LED package device is able to function as a side emitting type of LED package. Front sides of the two bulges are level with a front side of the LED package device and configured for being mounted to a printed circuit board and electrically connecting therewith.

    摘要翻译： LED封装器件包括衬底，LED芯片，反射器和覆盖层。 覆盖层完全封装反射器，LED芯片和基板，以增强LED封装器件的鲁棒性和统一的完整性; 包括两个凸起的两个电极穿过覆盖层以到达LED封装装置的基座。 LED封装器件能够用作LED封装的侧面发射型。 两个凸起的前侧与LED封装装置的前侧平齐，并且被配置为安装到印刷电路板并与其电连接。

    MANUFACTURING METHOD FOR LED PACKAGE
    4.
    发明申请
    MANUFACTURING METHOD FOR LED PACKAGE 失效
    LED封装制造方法

    公开(公告)号：US20120214264A1

    公开(公告)日：2012-08-23

    申请号：US13290144

    申请日：2011-11-07

    申请人： HSIN-CHIANG LIN ,  WEN-LIANG TSENG ,  CHIEH-LING CHANG

    发明人： HSIN-CHIANG LIN ,  WEN-LIANG TSENG ,  CHIEH-LING CHANG

    IPC分类号： H01L33/50

    CPC分类号： H01L33/504 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

    摘要： The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.

    摘要翻译： 本公开提供了一种用于LED封装的制造方法。 包含一个第一发光转换元件的第一发光转换层位于LED芯片上，其中第一发光转换元件通过围绕LED芯片离心沉淀而不遮挡LED芯片。 此后，第二发光转换层位于第一发光转换层上。 第二发光层具有比第一发光转换元件低的激发效率的第二发光转换元件。

    LIGHT EMITTING DIODE PACKAGE
    7.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20110278601A1

    公开(公告)日：2011-11-17

    申请号：US12979368

    申请日：2010-12-28

    申请人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

    发明人： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

    IPC分类号： H01L33/48

    CPC分类号： H01L33/486 ,  H01L25/167 ,  H01L33/507 ,  H01L33/508 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip.

    摘要翻译： LED封装包括硅基，LED和玻璃密封剂。 硅基部具有与第一表面相对的第一表面和第二表面。 LED芯片位于硅基底的第一表面上。 玻璃密封剂覆盖LED芯片。 玻璃密封剂和硅基底在其间限定了接收LED芯片的接收空间。 玻璃密封剂与硅基体的第一表面固定接合，因此玻璃密封剂和硅基底包围LED芯片。

    TRAFFIC LIGHT
    8.
    发明申请
    TRAFFIC LIGHT 失效
    红绿灯

    公开(公告)号：US20110261562A1

    公开(公告)日：2011-10-27

    申请号：US12900502

    申请日：2010-10-08

    申请人： CHI-WEI LIAO ,  WEN-LIANG TSENG ,  MIN-TSUN HSIEH ,  CHIH-YUNG LIN ,  CHING-LIEN YEH

    发明人： CHI-WEI LIAO ,  WEN-LIANG TSENG ,  MIN-TSUN HSIEH ,  CHIH-YUNG LIN ,  CHING-LIEN YEH

    IPC分类号： F21V5/00 ,  F21S4/00

    CPC分类号： F21V15/00 ,  G08G1/095

    摘要： A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.

    摘要翻译： 交通灯组件包括至少一个灯模块，位于所述至少一个灯模块前面的至少一个透镜，位于所述至少一个透镜前面的透明壳体和清洁装置。 清洁装置包括位于透明壳体的外表面上的擦拭器和驱动刮水器以刷透透明壳体的驱动器。

    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING THE SAME
    9.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING THE SAME 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20130001613A1

    公开(公告)日：2013-01-03

    申请号：US13309576

    申请日：2011-12-02

    申请人： MENG-HSIEN HONG ,  WEN-LIANG TSENG ,  HSIN-TUNG CHIANG ,  PIN-CHUAN CHEN

    发明人： MENG-HSIEN HONG ,  WEN-LIANG TSENG ,  HSIN-TUNG CHIANG ,  PIN-CHUAN CHEN

    IPC分类号： H01L33/50 ,  H01L33/52

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting diode package includes a substrate with a first metal layer, a second metal layer and an insulating layer between the first metal layer and the second metal layer. A cavity is defined in the insulating layer and the second metal layer. The second metal layer surrounding the cavity is divided into a first conductive portion and a second conductive portion. An LED chip is positioned inside the cavity and on an upper surface of the first metal layer. The LED chip has two electrodes electrically connected to the first conductive portion and the second conductive portion respectively. The cavity is filled with an encapsulation to cover the LED chip. A method for manufacturing the LED package is also disclosed.

    摘要翻译： 发光二极管封装包括在第一金属层和第二金属层之间具有第一金属层，第二金属层和绝缘层的衬底。 在绝缘层和第二金属层中限定空腔。 围绕空腔的第二金属层被分成第一导电部分和第二导电部分。 LED芯片位于空腔内部和第一金属层的上表面上。 LED芯片具有分别与第一导电部分和第二导电部分电连接的两个电极。 空腔填充有封装以覆盖LED芯片。 还公开了一种用于制造LED封装的方法。

    LIGHT EMITTING DIODE PACKAGE
    10.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 有权
    发光二极管封装

    公开(公告)号：US20120235192A1

    公开(公告)日：2012-09-20

    申请号：US13288038

    申请日：2011-11-03

    申请人： HSIN-CHIANG LIN ,  WEN-LIANG TSENG ,  CHIEH-LING CHANG

    发明人： HSIN-CHIANG LIN ,  WEN-LIANG TSENG ,  CHIEH-LING CHANG

    IPC分类号： H01L33/60

    CPC分类号： H01L33/504 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2933/0041 ,  H01L2924/00014

    摘要： A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.

    摘要翻译： 一种发光二极管封装，包括在第一发光转换层上的发光二极管芯片，第一发光转换层和单独的第二发光转换层。 第一发光转换层具有围绕发光二极管芯片的第一发光转换元件。 第二发光转换层具有位于发光二极管芯片上方的第二发光转换元件。 第一发光转换元件的激发效率高于第二发光转换元件的激发效率。