公开(公告)号：US08569791B2

公开(公告)日：2013-10-29

申请号：US13330704

申请日：2011-12-20

申请人： Pin-Chuan Chen ,  Hsin-Chiang Lin

发明人： Pin-Chuan Chen ,  Hsin-Chiang Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.

摘要翻译： LED（发光二极管）包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体限定了一个容纳芯片的腔体。 空腔包括与上室连通的上室和下室。 下室沿着LED的顶部到底部的方向逐渐扩大，并且上部腔室沿着LED的底部到顶部的方向逐渐扩大。 密封剂基本上填充下腔室和上腔室。

公开(公告)号：US20130217159A1

公开(公告)日：2013-08-22

申请号：US13571361

申请日：2012-08-10

申请人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

发明人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00

摘要： A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.

摘要翻译： 一种制造LED封装的方法，包括以下步骤：提供衬底并在衬底上形成间隔开的电极结构; 在基板的顶表面上提供模具，其中模具限定间隔开的环形槽，其与基板的顶表面配合以限定空腔; 用金属材料填充空腔; 去除模具并硬化金属材料以形成反射杯，其中每个反射杯围绕相应的电极结构并限定凹部; 抛光反射杯和电极结构的表面; 将LED芯片布置在凹陷中，每个LED芯片电连接到电极结构; 在所述凹部中注入密封层以密封所述LED芯片; 并切割基板以获得单独的LED封装。

公开(公告)号：US20130161681A1

公开(公告)日：2013-06-27

申请号：US13596024

申请日：2012-08-27

申请人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

发明人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

IPC分类号： H01L33/36

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip. The first lead and the second lead each include a first beam and a second beam connected to each other. Each of the first beam and the second beam has two opposite ends protruding beyond two opposite lateral faces of the base, respectively, for electrically connecting with a circuit board.

摘要翻译： LED包括基座，安装到基座的第一引线和第二引线，与第一引线和第二引线电连接的发光芯片，以及密封芯片的密封剂。 第一引线和第二引线各自包括彼此连接的第一光束和第二光束。 第一光束和第二光束中的每一个分别具有两个相对的端部，该两个相对端分别突出到基板的两个相对的侧面，用于与电路板电连接。

公开(公告)号：US20130065332A1

公开(公告)日：2013-03-14

申请号：US13593473

申请日：2012-08-23

申请人： HSIN-CHIANG LIN ,  WEN-LIANG TSENG

发明人： HSIN-CHIANG LIN ,  WEN-LIANG TSENG

IPC分类号： H01L33/52 ,  H01L33/50

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85

摘要： A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs.

摘要翻译： 公开了一种用于制造LED的方法。 首先提供基地。 底座包括板，形成在板上的侧壁和连接到板的引线对。 侧壁包围板上方的空腔。 发光芯片固定在空腔中并分别与引线电连接。 密封剂形成在空腔中以密封发光芯片。 每个密封剂具有突出超过侧壁顶面的凸顶面。 将密封剂的凸起的顶面研磨成平坦的。 最后，将基座切割成单独的LED。

公开(公告)号：US20130052764A1

公开(公告)日：2013-02-28

申请号：US13523878

申请日：2012-06-14

申请人： LI-HSIANG CHEN ,  HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

发明人： LI-HSIANG CHEN ,  HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

IPC分类号： H01L33/52

CPC分类号： H01L33/642 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/189 ,  H05K3/0014 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0278 ,  H01L2924/00014

摘要： A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element.

摘要翻译： 一种封装发光二极管的方法，包括：提供具有导热层的柔性衬底，覆盖在导热层的表面上的绝缘层和位于绝缘层上的导电层; 蚀刻所述导电层以在所述导电层中形成间隙并暴露所述绝缘层的一部分，所述导电层被所述间隙分隔成彼此隔离的第一电极和第二电极; 在间隙的位置用模具冲压柔性基板以在柔性基板中形成凹部; 将发光元件定位在所述导电层上并将所述发光元件电连接到所述导电层; 并形成封装以覆盖发光元件。

公开(公告)号：US20130001629A1

公开(公告)日：2013-01-03

申请号：US13330704

申请日：2011-12-20

申请人： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

发明人： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

IPC分类号： H01L33/62 ,  H01L33/48

CPC分类号： H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.

摘要翻译： LED（发光二极管）包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体限定了一个容纳芯片的腔体。 空腔包括与上室连通的上室和下室。 下室沿着LED的顶部到底部的方向逐渐扩大，并且上部腔室沿着LED的底部到顶部的方向逐渐扩大。 密封剂基本上填充下腔室和上腔室。

公开(公告)号：US06632399B1

公开(公告)日：2003-10-14

申请号：US09315114

申请日：1999-05-19

申请人： Gregory Kellogg ,  Stephen G. Kieffer-Higgins ,  Mona D. Jensen ,  Shari Ommert ,  Mikayla Kob ,  Andrea Pierce ,  Keith Morneau ,  Hsin Chiang Lin

发明人： Gregory Kellogg ,  Stephen G. Kieffer-Higgins ,  Mona D. Jensen ,  Shari Ommert ,  Mikayla Kob ,  Andrea Pierce ,  Keith Morneau ,  Hsin Chiang Lin

IPC分类号： G01N128

CPC分类号： B01L3/502738 ,  B01F13/0059 ,  B01F15/0232 ,  B01F15/0233 ,  B01F2215/0037 ,  B01F2215/0073 ,  B01L3/5025 ,  B01L3/50273 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/0806 ,  B01L2300/0867 ,  B01L2300/087 ,  B01L2300/0887 ,  B01L2300/1827 ,  B01L2400/0406 ,  B01L2400/0409 ,  B01L2400/0677 ,  B01L2400/0688 ,  F16K31/002 ,  G01N21/07 ,  G01N35/00069 ,  H01C17/06586 ,  H01R39/64 ,  Y10T436/111666 ,  Y10T436/25375

摘要： This invention provides methods and apparatus for performing microanalytic and microsynthetic analyses and procedures. Specifically, the invention provides a microsystem platform for use with a micromanipulation device to manipulate the platform by rotation, thereby utilizing the centripetal force resulting from rotation of the platform to motivate fluid movement through microchannels embedded in the microplatform. The microsystem platforms of the invention are also provided having microfluidics components, resistive heating elements, temperature sensing elements, mixing structures, capillary and sacrificial valves, and methods for using these microsystems platforms for performing biological, enzymatic, immunological and chemical assays.

摘要翻译： 本发明提供了用于进行微量分析和微合成分析和方法的方法和装置。 具体而言，本发明提供了一种微系统平台，用于与微操纵装置一起通过旋转来操纵平台，由此利用由平台的旋转产生的向心力，以激励通过嵌入在微平台中的微通道的流体运动。 还提供了本发明的微系统平台，其具有微流体组件，电阻加热元件，温度感测元件，混合结构，毛细管和牺牲阀，以及使用这些微系统平台进行生物，酶，免疫学和化学测定的方法。

公开(公告)号：US20130164868A1

公开(公告)日：2013-06-27

申请号：US13600147

申请日：2012-08-30

申请人： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

发明人： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

IPC分类号： H01L33/40

CPC分类号： H01L33/50 ,  H01L2933/0041 ,  H01L2933/005

摘要： A method for packaging an LED, includes steps: providing a substrate; arranging an LED die on the substrate; forming a photoresist layer on the substrate to cover the LED die; arranging a mask directly on the photoresist layer; exposing the photoresist layer with the mask to a radiation source; removing the mask and the unexposed portion of the photoresist layer formerly sheltered by the mask, thereby leaving the exposed portion of the photoresist layer formerly unsheltered by the mask on the substrate, wherein the remained exposed portion of the photoresist layer surrounds the LED die; spraying fluorescent material toward the LED die surrounded by the remained exposed portion of the photoresist layer; removing the remained exposed portion of the photoresist layer; and finally encapsulating the LED die covered by the fluorescent material.

摘要翻译： 一种LED封装方法，包括：提供基板; 在基板上布置LED管芯; 在所述基板上形成光致抗蚀剂层以覆盖所述LED管芯; 在光致抗蚀剂层上直接配置掩模; 将具有掩模的光致抗蚀剂层暴露于辐射源; 去除掩模和以前被掩模掩蔽的光致抗蚀剂层的未曝光部分，从而使光致抗蚀剂层的暴露部分以前不被衬底上的掩模保护，其中光致抗蚀剂层的残留曝光部分围绕LED管芯; 向由光致抗蚀剂层的残留的暴露部分包围的LED管芯喷射荧光材料; 去除光致抗蚀剂层的残留的暴露部分; 并最终封装由荧光材料覆盖的LED管芯。

公开(公告)号：US20130069092A1

公开(公告)日：2013-03-21

申请号：US13414726

申请日：2012-03-08

申请人： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

发明人： PIN-CHUAN CHEN ,  HSIN-CHIANG LIN

IPC分类号： H01L33/60

CPC分类号： H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85

摘要： An LED includes a base, first and second electrodes embedded in the base, and an LED chip electrically connected with the first and second electrodes. The first electrode includes a first main body portion and three first branch portions. The second electrode includes a second main body and three second branch portions. The first and second branch portions are exposed at sidewalls of the base. One of the first branch portions and one of the second branch portions are exposed at two opposite lateral sides of the base respectively, and another one of the first branch portions and another one of the second branch portions are exposed at the same lateral side of the base. This disclosure also discloses a manufacture method for making the LED.

摘要翻译： LED包括嵌入基座中的基极，第一和第二电极以及与第一和第二电极电连接的LED芯片。 第一电极包括第一主体部分和三个第一分支部分。 第二电极包括第二主体和三个第二分支部分。 第一和第二分支部分暴露在基部的侧壁处。 第一分支部分中的一个和第二分支部分中的一个分别暴露在基部的两个相对的横向侧上，另一个第一分支部分和另一个第二分支部分在相同的侧面 基础。 本公开还公开了一种制造LED的制造方法。

公开(公告)号：US20130015490A1

公开(公告)日：2013-01-17

申请号：US13330688

申请日：2011-12-20

申请人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

发明人： HSIN-CHIANG LIN ,  PIN-CHUAN CHEN

IPC分类号： H01L33/52 ,  H01L33/48

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing. A method for manufacturing the LED is also disclosed.

摘要翻译： LED包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体在其中心区域中限定空腔和邻近其周向周边的腔室。 引线的顶面暴露在腔室中。 在室中形成阻挡壁以接触引线的暴露的顶面。 阻挡壁和引线之间的接合力大于引线和外壳之间的结合力。 还公开了一种制造LED的方法。