Non-volatile memory device and method of manufacturing the same
    1.
    发明授权
    Non-volatile memory device and method of manufacturing the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US08654579B2

    公开(公告)日:2014-02-18

    申请号:US13298591

    申请日:2011-11-17

    Abstract: A non-volatile memory device includes a plurality of memory cells stacked along a channel protruded from a substrate, a first select transistor connected to one end of the plurality of memory cells, a first interlayer dielectric layer for being coupled between a source line and the first select transistor, and a second interlayer dielectric layer disposed between the first select transistor and the one end of the plurality of memory cells, and configured to include a first recess region.

    Abstract translation: 非易失性存储器件包括沿着从衬底突出的通道堆叠的多个存储器单元,连接到多个存储器单元的一端的第一选择晶体管,用于耦合在源极线与源极之间的第一层间电介质层 第一选择晶体管和设置在第一选择晶体管和多个存储单元的一端之间的第二层间电介质层,并且被配置为包括第一凹部区域。

    NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US20120126308A1

    公开(公告)日:2012-05-24

    申请号:US13298591

    申请日:2011-11-17

    Abstract: A non-volatile memory device includes a plurality of memory cells stacked along a channel protruded from a substrate, a first select transistor connected to one end of the plurality of memory cells, a first interlayer dielectric layer for being coupled between a source line and the first select transistor, and a second interlayer dielectric layer disposed between the first select transistor and the one end of the plurality of memory cells, and configured to include a first recess region.

    Abstract translation: 非易失性存储器件包括沿着从衬底突出的通道堆叠的多个存储器单元,连接到多个存储器单元的一端的第一选择晶体管,用于耦合在源极线与源极之间的第一层间电介质层 第一选择晶体管和设置在第一选择晶体管和多个存储单元的一端之间的第二层间电介质层,并且被配置为包括第一凹部区域。

    Method for fabricating capacitor utilizes a sacrificial pattern enclosing the upper outer walls of the storage nodes
    7.
    发明授权
    Method for fabricating capacitor utilizes a sacrificial pattern enclosing the upper outer walls of the storage nodes 失效
    用于制造电容器的方法利用包围存储节点的上外壁的牺牲图案

    公开(公告)号:US08048757B2

    公开(公告)日:2011-11-01

    申请号:US13069290

    申请日:2011-03-22

    CPC classification number: H01L28/91 H01L27/10852 H01L28/65

    Abstract: A method for fabricating a capacitor includes forming an isolation layer over a cell region and a peripheral region of a substrate. The isolation layer forms a plurality of open regions in the cell region. Storage nodes are formed on surfaces of the open regions. An upper portion of the isolation layer is etched to expose upper outer walls of the storage nodes. A sacrificial pattern is formed over the isolation layer to enclose the upper outer walls of the storage nodes. The isolation layer in the peripheral region is etched to expose side portions of the resulting structure obtained after forming the sacrificial pattern in the cell region. With the sacrificial pattern supporting the storage nodes, the isolation layer in the cell region is removed. The sacrificial pattern is then removed.

    Abstract translation: 制造电容器的方法包括在衬底的单元区域和周边区域上形成隔离层。 隔离层在单元区域中形成多个开放区域。 存储节点形成在开放区域的表面上。 蚀刻隔离层的上部以露出存储节点的上部外壁。 在隔离层上形成牺牲图案以封闭存储节点的上外壁。 对外围区域中的隔离层进行蚀刻,以在单元区域中形成牺牲图案之后获得的所得结构的侧面露出。 利用支持存储节点的牺牲图案,移除单元区域中的隔离层。 然后去除牺牲图案。

    METHOD FOR FABRICATING CAPACITOR
    8.
    发明申请
    METHOD FOR FABRICATING CAPACITOR 失效
    电容器制作方法

    公开(公告)号:US20110171807A1

    公开(公告)日:2011-07-14

    申请号:US13069290

    申请日:2011-03-22

    CPC classification number: H01L28/91 H01L27/10852 H01L28/65

    Abstract: A method for fabricating a capacitor includes forming an isolation layer over a cell region and a peripheral region of a substrate. The isolation layer forms a plurality of open regions in the cell region. Storage nodes are formed on surfaces of the open regions. An upper portion of the isolation layer is etched to expose upper outer walls of the storage nodes. A sacrificial pattern is formed over the isolation layer to enclose the upper outer walls of the storage nodes. The isolation layer in the peripheral region is etched to expose side portions of the resulting structure obtained after forming the sacrificial pattern in the cell region. With the sacrificial pattern supporting the storage nodes, the isolation layer in the cell region is removed. The sacrificial pattern is then removed.

    Abstract translation: 制造电容器的方法包括在衬底的单元区域和周边区域上形成隔离层。 隔离层在单元区域中形成多个开放区域。 存储节点形成在开放区域的表面上。 蚀刻隔离层的上部以露出存储节点的上部外壁。 在隔离层上形成牺牲图案以封闭存储节点的上外壁。 对外围区域中的隔离层进行蚀刻,以在单元区域中形成牺牲图案之后获得的所得结构的侧面露出。 利用支持存储节点的牺牲图案,移除单元区域中的隔离层。 然后去除牺牲图案。

    PHASE CHANGE MEMORY DEVICE HAVING A LAYERED PHASE CHANGE LAYER COMPOSED OF MULTIPLE PHASE CHANGE MATERIALS AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明申请
    PHASE CHANGE MEMORY DEVICE HAVING A LAYERED PHASE CHANGE LAYER COMPOSED OF MULTIPLE PHASE CHANGE MATERIALS AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    具有多相相变材料的层状相变层的相变记忆体装置及其制造方法

    公开(公告)号:US20100096609A1

    公开(公告)日:2010-04-22

    申请号:US12493672

    申请日:2009-06-29

    Abstract: A phase change memory device that has a layered phase change layer composed of multiple phase change materials is presented. The device includes a semiconductor substrate, an interlayer dielectric layer, a high-temperature crystallization phase change, a low-temperature crystallization phase change layer, and an upper electrode. The interlayer dielectric layer formed on the semiconductor substrate and the high-temperature crystallization phase change layer is formed on the interlayer dielectric layer. The low-temperature crystallization phase change layer is formed over the high-temperature crystallization phase change layer. The upper electrode is formed over the low-temperature crystallization phase change layer. An optional diffusion barrier may be interposed between the two phase change layers.

    Abstract translation: 提出了具有由多个相变材料构成的分层相变层的相变存储器件。 该器件包括半导体衬底,层间介电层,高温结晶相变,低温结晶相变层和上电极。 形成在半导体衬底上的层间电介质层和高温结晶相变层形成在层间电介质层上。 在高温结晶相变层上形成低温结晶相变层。 上电极形成在低温结晶相变层上。 可以在两个相变层之间插入可选的扩散阻挡层。

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