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    Cu—Ni—Si—Co—Cr copper alloy for electronic materials and method for manufacturing same
    2.
    发明授权
    Cu—Ni—Si—Co—Cr copper alloy for electronic materials and method for manufacturing same 有权
    用于电子材料的Cu-Ni-Si-Co-Cr铜合金及其制造方法

    公开(公告)号：US08070893B2

    公开(公告)日：2011-12-06

    申请号：US11887660

    申请日：2006-03-31

    申请人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    发明人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    IPC分类号： C22C9/06 ,  C22F1/08

    CPC分类号： H01L23/49579 ,  C22C9/06 ,  C22F1/08 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4≦[Ni+Co]/Si≦about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5≦Ni/Co≦about 2, and wherein Pc is equal to or less than about 15/1000 μm2, or Pc/P is equal to or less than about 0.3 wherein P is the number of inclusions dispersed in the alloy and having the size of 1 μm or more, and Pc is the number of inclusions, among those having the size of 1 μm or more, whose carbon concentration is 10% or more by weight.

    摘要翻译： 本发明提供了具有优异特性的电子材料的Cu-Ni-Si-Co-Cr铜合金，例如显着提高的强度和导电性。 一方面，本发明是用于电子材料的Cu-Ni-Si-Co-Cr铜合金，其包含约0.5-约2.5重量％的Ni，约0.5-约2.5重量％的Co，约0.30-约 1.2重量％的Si，约0.09〜0.5重量％的Cr，余量为Cu和不可避免的杂质，其中Ni和Co的总重量与合金组成中的Si的重量比满足 约4＆nlE; [Ni + Co] / Si＆nlE;约5，合金组成中Ni与Co的比例满足下式：约0.5＆nlE; Ni / Co＆nlE;约2，其中Pc等于或小于 大于约15/1000μm2，或Pc / P等于或小于约0.3，其中P是分散在合金中并且具有1μm或更大的尺寸的夹杂物的数量，Pc是夹杂物的数量，其中 其碳浓度为10重量％以上的尺寸为1μm以上。

    Cu-Ni-Si-Co-Cr Copper Alloy for Electronic Materials and Method for Manufacturing Same
    3.
    发明申请
    Cu-Ni-Si-Co-Cr Copper Alloy for Electronic Materials and Method for Manufacturing Same 有权
    用于电子材料的Cu-Ni-Si-Co-Cr铜合金及其制造方法

    公开(公告)号：US20090025840A1

    公开(公告)日：2009-01-29

    申请号：US11887660

    申请日：2006-03-31

    申请人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    发明人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    IPC分类号： C22F1/08 ,  C22C9/06 ,  C22C9/02 ,  C22C9/04

    CPC分类号： H01L23/49579 ,  C22C9/06 ,  C22F1/08 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09-about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4≦[Ni+Co]/Si≦about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5≦Ni/Co≦about 2, and wherein Pc is equal to or less than about 15/1000 μm2, or Pc/P is equal to or less than about 0.3 wherein P is the number of inclusions dispersed in the alloy and having the size of 1 μm or more, and Pc is the number of inclusions, among those having the size of 1 μm or more, whose carbon concentration is 10% or more by weight.

    摘要翻译： 本发明提供了具有优异特性的电子材料的Cu-Ni-Si-Co-Cr铜合金，例如显着提高的强度和导电性。 一方面，本发明是用于电子材料的Cu-Ni-Si-Co-Cr铜合金，其包含约0.5-约2.5重量％的Ni，约0.5-约2.5重量％的Co，约0.30-约 1.2重量％的Si和约0.09〜约0.5重量％的Cr，余量为Cu和不可避免的杂质，其中Ni和Co的总重量与合金组合物中的Si的重量比满足 式：约4 <= [Ni + Co] / Si <=约5，合金组成中Ni与Co的比例满足下式：约0.5 <= Ni / Co <= 2，其中Pc相等 或小于约15/1000mum2，或Pc / P等于或小于约0.3，其中P是分散在合金中并且具有1um或更大的尺寸的夹杂物的数量，Pc是夹杂物的数量 ，其中碳浓度为10重量％以上的大小为1μm以上的那些。

    Copper alloy
    4.
    发明申请
    Copper alloy 审中-公开
    铜合金

    公开(公告)号：US20090022993A1

    公开(公告)日：2009-01-22

    申请号：US12071666

    申请日：2008-02-25

    申请人： Yasutaka Sugawara ,  Kazuhiko Fukamachi

    发明人： Yasutaka Sugawara ,  Kazuhiko Fukamachi

    IPC分类号： B32B5/16

    CPC分类号： C22C9/00 ,  Y10T428/2982

    摘要： Copper alloys having excellent strength while suppressing irregularity of wavelengths, etc., of the fluctuations and having excellent bendability are obtained while suppressing growth of crystal grains. The copper-based alloy contains 2.0 to 4.0 mass % of Ti, and the total content of unavoidable impurity elements Pb, Sn, Zn, Mn, Fe, Co, Ni, S, Si, Al, P, As, Se, Te, Sb, Bi, Au, and Ag is not more than 0.1 mass %, and contents of each element thereof is not more than 0.01 mass %, and not less than 80% of quality of a second-phase particles having an area of not less than 0.01 μm2 observed by a cross section speculum contains not less than 3% of the total amount of the above described unavoidable impurity elements in composition.

    摘要翻译： 在抑制晶粒生长的同时，获得具有优异强度的铜合金，同时抑制波动的波动等，并且具有优异的弯曲性。 铜基合金含有2.0〜4.0质量％的Ti，不可避免的杂质元素Pb，Sn，Zn，Mn，Fe，Co，Ni，S，Si，Al，P，As，Se，Te， Sb，Bi，Au，Ag为0.1质量％以下，各元素的含量为0.01质量％以下，面积为以下的第二相粒子的品质不低于80质量％ 通过截面窥器观察到的0.01μm2以上不包含上述不可避免的杂质元素总量的3％以上。

    Strike plating solution useful in applying primer plating to electronic parts
    5.
    发明授权
    Strike plating solution useful in applying primer plating to electronic parts 失效
    罢工电镀液可用于将底漆涂在电子部件上

    公开(公告)号：US4767508A

    公开(公告)日：1988-08-30

    申请号：US16942

    申请日：1987-02-20

    申请人： Yasuhiro Arakida ,  Kazuhiko Fukamachi

    发明人： Yasuhiro Arakida ,  Kazuhiko Fukamachi

    IPC分类号： C25D3/56

    CPC分类号： C25D3/562

    摘要： Disclosed herein is a noble metal plated material having good solderability and bonderability and suited for use as parts of electronic and electric equipment as well as a strike plating solution useful in the formation of a primer plating upon production of the plated material. The strike plating solution comprises 5-300 g/l of nickel chloride, 5-300 g/l of cobalt chloride and 30-300 g/l of hydrochloric acid.

    摘要翻译： 本发明公开了一种具有良好的可焊性和可粘合性的贵金属电镀材料，并且适合用作电子和电气设备的部件以及用于在生产电镀材料时形成底漆电镀的冲击电镀溶液。 冲击镀液含有5-300g / l氯化镍，5-300g / l氯化钴和30-300g / l盐酸。

    High-strength copper alloys with excellent bending workability and terminal connectors using the same
    6.
    发明申请
    High-strength copper alloys with excellent bending workability and terminal connectors using the same 审中-公开
    具有优异的弯曲加工性的高强度铜合金和使用其的端子连接器

    公开(公告)号：US20080210353A1

    公开(公告)日：2008-09-04

    申请号：US12082531

    申请日：2008-04-11

    申请人： Kazuhiko Fukamachi ,  Masato Shigyo

    发明人： Kazuhiko Fukamachi ,  Masato Shigyo

    IPC分类号： C22F1/08 ,  C22C9/02

    CPC分类号： C22C9/02 ,  C22F1/08

    摘要： The invention aims at providing high-strength copper alloy, especially phosphor bronze, with excellent bending workability. The excellently bendable high-strength copper alloy is obtained through grain size control whereby a finally cold rolled copper alloy with a tensile strength and 0.2% yield strength different by not more than 80 MPa is allowed to have characteristics such that its mean grain size (mGS) after annealing at 425° C. for 10,000 seconds is not more than 5 μm and the standard deviation of the mean grain size (σGS) is not more than ⅓×mGS. Improvements in characteristics presumably attributable to the synergistic effect of grain-boundary strengthening and dislocation strengthening are stably achieved by the adjustments of cold rolling and annealing conditions and by the study of the correlation between pertinent characteristic values after the final rolling. The method of processing the alloy comprises cold rolling to a reduction percentage of at least 45%, final annealing to the extent that the mean grain size (mGS) is not more than 3 μm and the standard deviation of the mean grain size (σGS) is not more than 2 μm, and final cold rolling to a reduction percentage of 10-45%.

    摘要翻译： 本发明旨在提供优异的弯曲加工性的高强度铜合金，特别是磷青铜。 通过晶粒尺寸控制获得优异的可弯曲的高强度铜合金，使得具有拉伸强度和0.2％屈服强度不同于80MPa的最终冷轧铜合金具有使其平均晶粒尺寸（mGS） ）在425℃退火10,000秒后不大于5um，平均晶粒尺寸（sigmaGS）的标准偏差不大于1/3×mGS。 通过调整冷轧和退火条件以及通过研究最终轧制后的相关特征值之间的相关性，稳定地实现了通过晶界强化和位错强化的协同效应推测的特性的改善。 处理合金的方法包括冷轧至至少45％的还原率，最终退火至平均晶粒尺寸（mGS）不大于3μm，平均晶粒尺寸（sigmaGS）的标准偏差 不超过2毫米，最终冷轧减少百分比为10-45％。

    Copper Alloy for Electronic Materials
    7.
    发明申请
    Copper Alloy for Electronic Materials 有权
    铜合金电子材料

    公开(公告)号：US20090035174A1

    公开(公告)日：2009-02-05

    申请号：US11886829

    申请日：2006-03-23

    申请人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    发明人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    IPC分类号： C22C9/06 ,  C22F1/08

    CPC分类号： C22C9/06 ,  C22F1/00 ,  C22F1/08 ,  H01R13/03

    摘要： The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4≦[Ni+Co]/Si≦about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5≦Ni/Co≦about 2.

    摘要翻译： 本发明提供含有Co的Cu-Ni-Si合金，并且具有优异的强度和导电性。 根据本发明的用于电子材料的铜合金包含约0.5-约2.5重量％的Ni，约0.5-约2.5重量％的Co，约0.30-约1.2重量％的Si，余量为Cu 和不可避免的杂质，其中Ni和Co的总重量与Si（[Ni + Co] / Si比）的重量比满足下式：约4 <= [Ni + Co] / Si <=约5， 并且Ni与Co的比例（Ni / Co比）满足下式：约0.5≤Ni/Co≤2。

    Copper alloy for electronic materials
    9.
    发明授权
    Copper alloy for electronic materials 有权
    铜合金电子材料

    公开(公告)号：US08317948B2

    公开(公告)日：2012-11-27

    申请号：US11886829

    申请日：2006-03-23

    申请人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    发明人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    IPC分类号： C22C9/06 ,  C22F1/08

    CPC分类号： C22C9/06 ,  C22F1/00 ,  C22F1/08 ,  H01R13/03

    摘要： The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4≦[Ni+Co]/Si≦about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5≦Ni/Co≦about 2.

    摘要翻译： 本发明提供含有Co的Cu-Ni-Si合金，并且具有优异的强度和导电性。 根据本发明的用于电子材料的铜合金包含约0.5-约2.5重量％的Ni，约0.5-约2.5重量％的Co，约0.30-约1.2重量％的Si，余量为Cu 和不可避免的杂质，其中Ni和Co的总重量与Si（[Ni + Co] / Si比率）的重量比满足下式：约4＆nlE; [Ni + Co] / Si＆nlE;约5， Ni与Co的比例（Ni / Co比）满足公式：约0.5＆nlE; Ni / Co＆nlE;约2。

    Cu-Ni-Si system copper alloy for electronic materials
    10.
    发明申请
    Cu-Ni-Si system copper alloy for electronic materials 审中-公开
    Cu-Ni-Si系统铜合金电子材料

    公开(公告)号：US20080175746A1

    公开(公告)日：2008-07-24

    申请号：US11654864

    申请日：2007-01-18

    申请人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    发明人： Naohiko Era ,  Kazuhiko Fukamachi ,  Hiroshi Kuwagaki

    IPC分类号： C22C9/06

    CPC分类号： C22C9/06 ,  C22C1/02

    摘要： The present invention provides Corson alloy having remarkably improved properties, in particular, by bringing out the effect of added Cr more efficiently. A copper alloy for electronic materials comprising 2.5-4.5% by mass of Ni; 0.50-1.2% by mass of Si; 0.0030-0.2% by mass of Cr; balance Cu and inevitable impurities, wherein the weight ratio of Ni to Si is in the range of 3 to 7 and the content of carbon is 50 ppm by mass or less is provided.

    摘要翻译： 本发明提供了具有显着提高的性能的Corson合金，特别是通过更有效地产生添加的Cr的作用。 一种电子材料用铜合金，含有2.5〜4.5质量％的Ni; 0.50-1.2质量％的Si; 0.0030-0.2质量％的Cr; 平衡Cu和不可避免的杂质，其中Ni与Si的重量比在3至7的范围内，并且碳的含量为50质量ppm以下。