发明申请
- 专利标题: Copper alloy
- 专利标题(中): 铜合金
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申请号: US12071666申请日: 2008-02-25
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公开(公告)号: US20090022993A1公开(公告)日: 2009-01-22
- 发明人: Yasutaka Sugawara , Kazuhiko Fukamachi
- 申请人: Yasutaka Sugawara , Kazuhiko Fukamachi
- 申请人地址: JP Tokyo
- 专利权人: NIPPON MINING & METALS CO., LTD
- 当前专利权人: NIPPON MINING & METALS CO., LTD
- 当前专利权人地址: JP Tokyo
- 优先权: JP2002-346979 20021129
- 主分类号: B32B5/16
- IPC分类号: B32B5/16
摘要:
Copper alloys having excellent strength while suppressing irregularity of wavelengths, etc., of the fluctuations and having excellent bendability are obtained while suppressing growth of crystal grains. The copper-based alloy contains 2.0 to 4.0 mass % of Ti, and the total content of unavoidable impurity elements Pb, Sn, Zn, Mn, Fe, Co, Ni, S, Si, Al, P, As, Se, Te, Sb, Bi, Au, and Ag is not more than 0.1 mass %, and contents of each element thereof is not more than 0.01 mass %, and not less than 80% of quality of a second-phase particles having an area of not less than 0.01 μm2 observed by a cross section speculum contains not less than 3% of the total amount of the above described unavoidable impurity elements in composition.
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