公开(公告)号：US07334524B2

公开(公告)日：2008-02-26

申请号：US11553394

申请日：2006-10-26

申请人： Jerry M. Roane

发明人： Jerry M. Roane

IPC分类号： E01B29/00

CPC分类号： B60F1/043 ,  B60F1/04 ,  B60L11/18 ,  B60L2200/26 ,  B61B10/04 ,  B61B13/04 ,  B61B15/00 ,  E01B25/22 ,  E01B25/28 ,  Y02T10/7005 ,  Y02T30/30

摘要： A rail system for transporting dual use vehicles includes a network of multiple non-interconnected rails where each rail comprises an extruded triangular shell and a support material. The rails are supported by a system of support structures where each support structure includes a base with a rail adjustment actuator for selectively adjusting the position of the supported rail. Each rail is sized to support a standardized dual use passenger vehicle adapted for roadway and rail travel.

摘要翻译： 用于运输双重用途车辆的轨道系统包括多个非互连轨道的网络，其中每个轨道包括挤出的三角形壳体和支撑材料。 轨道由支撑结构系统支撑，其中每个支撑结构包括具有轨道调节致动器的基座，用于选择性地调节支撑的轨道的位置。 每个轨道的大小可以支持适用于道路和铁路旅行的标准化双用途乘用车。

公开(公告)号：US06923124B2

公开(公告)日：2005-08-02

申请号：US10606856

申请日：2003-06-26

申请人： Jerry M. Roane

发明人： Jerry M. Roane

IPC分类号： B60F1/04 ,  B61B13/04 ,  B61B15/00 ,  E01B25/28 ,  B61C7/00

CPC分类号： B60F1/043 ,  B60F1/04 ,  B60L11/18 ,  B60L2200/26 ,  B61B10/04 ,  B61B13/04 ,  B61B15/00 ,  E01B25/22 ,  E01B25/28 ,  Y02T10/7005 ,  Y02T30/30

摘要： A rail system for transporting dual use vehicles includes a network of multiple non-interconnected rails where each rail comprises an extruded triangular shell and a support material. The rails are supported by a system of support structures where each support structure includes a base with a rail adjustment actuator for selectively adjusting the position of the supported rail. Each rail is sized to support a standardized dual use passenger vehicle adapted for roadway and rail travel.

摘要翻译： 用于运输双重用途车辆的轨道系统包括多个非互连轨道的网络，其中每个轨道包括挤出的三角形壳体和支撑材料。 轨道由支撑结构系统支撑，其中每个支撑结构包括具有轨道调节致动器的基座，用于选择性地调节支撑的轨道的位置。 每个轨道的大小可以支持适用于道路和铁路旅行的标准化双用途乘用车。

公开(公告)号：US5236117A

公开(公告)日：1993-08-17

申请号：US903056

申请日：1992-06-22

申请人： Jerry M. Roane ,  Carmen D. Burns

发明人： Jerry M. Roane ,  Carmen D. Burns

IPC分类号： B23K1/08 ,  H05K3/34

CPC分类号： H05K3/3468 ,  B23K1/08 ,  H05K2201/10984 ,  H05K2203/0271 ,  H05K2203/044 ,  H05K3/3489

摘要： A method and apparatus for tinning and soldering metal parts of electronic components and assemblies, and removing excess solder therefrom. The metal parts of the electronic components and assemblies are heated to a temperature near that of molten solder. A holding fixture, adapted to hold the heated components, slidably connects to an acceleration means which dips the metal parts of the components into the molten solder. Then acceleration energy is applied to the acceleration means, causing it to rapidly remove the components from the molten solder. Rapidly removing the components from the molten solder leaves excess solder behind, whereby all metal parts of the components are thoroughly tinned and soldered together without leaving unwanted solder bridges therebetween. A vibration means may also be used to prevent solder voids and promote solder wetting in densely packed leads and rails being tinned.

摘要翻译： 一种用于对电子部件和组件的金属部件进行镀锡和焊接以及从其中去除多余的焊料的方法和装置。 将电子部件和组件的金属部件加热到接近熔融焊料的温度。 固定夹具，适于保持加热部件，可滑动地连接到将部件的金属部分浸入熔融焊料中的加速装置。 然后将加速能量施加到加速装置，使其迅速从熔融焊料中去除组分。 从熔融焊料中快速去除部件会使多余的焊料在后面，从而将组件的所有金属部件完全镀锡并焊接在一起，而不会在其间留下不必要的焊料。 还可以使用振动装置来防止焊接空隙并促进密封的引线和导轨中的焊料润湿。

公开(公告)号：US5592364A

公开(公告)日：1997-01-07

申请号：US377578

申请日：1995-01-24

申请人： Jerry M. Roane

发明人： Jerry M. Roane

IPC分类号： H01L25/10 ,  H05K7/02 ,  H05K7/20

CPC分类号： H05K7/023 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/0002

摘要： The present invention includes a high density integrated circuit module which includes a plurality of stacked, individual integrated circuit devices wherein serpentine electrical interconnect rails connect electrical leads extending from the individual integrated circuit devices within the module.

摘要翻译： 本发明包括高密度集成电路模块，其包括多个堆叠的单独的集成电路器件，其中蛇形电互连轨道连接从模块内的各个集成电路器件延伸的电引线。

公开(公告)号：US5588205A

公开(公告)日：1996-12-31

申请号：US523201

申请日：1995-09-05

申请人： Jerry M. Roane

发明人： Jerry M. Roane

IPC分类号： H01L21/98 ,  H01L25/10 ,  H05K3/36

CPC分类号： H01L25/50 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49172

摘要： The present invention includes a high density integrated circuit module which includes a plurality of stacked, individual integrated circuit devices wherein serpentine electrical interconnect rails connect electrical leads extending from the individual integrated circuit devices within the module.

摘要翻译： 本发明包括高密度集成电路模块，其包括多个堆叠的单独的集成电路器件，其中蛇形电互连轨道连接从模块内的各个集成电路器件延伸的电引线。

公开(公告)号：US07497812B2

公开(公告)日：2009-03-03

申请号：US11495229

申请日：2006-07-28

申请人： John D. Neff ,  Matthew T. Verona ,  Jerry M. Roane

发明人： John D. Neff ,  Matthew T. Verona ,  Jerry M. Roane

IPC分类号： A63B69/03 ,  A63B24/00

CPC分类号： A63B21/00069 ,  A47B2220/06 ,  A63B21/00061 ,  A63B21/00072 ,  A63B21/005 ,  A63B21/0058 ,  A63B21/008 ,  A63B21/0083 ,  A63B21/0087 ,  A63B21/015 ,  A63B21/023 ,  A63B21/0421 ,  A63B21/055 ,  A63B21/0552 ,  A63B21/4047 ,  A63B22/0007 ,  A63B22/0012 ,  A63B22/0046 ,  A63B22/0076 ,  A63B22/02 ,  A63B22/0605 ,  A63B22/0664 ,  A63B22/0694 ,  A63B22/203 ,  A63B24/00 ,  A63B24/0084 ,  A63B69/06 ,  A63B71/0622 ,  A63B2022/0035 ,  A63B2022/0041 ,  A63B2022/0082 ,  A63B2069/064 ,  A63B2069/066 ,  A63B2071/0644 ,  A63B2208/0233 ,  A63B2210/50 ,  A63B2210/58 ,  A63B2220/13 ,  A63B2220/16 ,  A63B2225/05 ,  A63B2225/055 ,  A63B2225/20 ,  A63B2230/75 ,  A63F2300/1043 ,  A63F2300/6607 ,  G06F3/011 ,  G06F3/03

摘要： A computer simulation enhanced exercise device is provided which engages the user by directly relating the users exercise motion in real time to a visual simulation or interactive game. The exercise device may comprise any variety of machines including, stationary bikes, rowing machines, treadmills, stepper, elliptical gliders or under desk exercise. These exercise devices are configured with sensors to measure physical movements as the user exercises and are coupled to computer hardware with modeling and virtualization software to create the system. These sensor measurements are then sent to a computer for use in the physics based modeling and real-time visual simulation. The computer simulation enhanced exercise device is further provided with features including manual and automatic adjustment of resistance levels, visualization of accurate caloric burn rates and correlation to everyday food items, and network connectivity providing for multiplayer network simulations and directed advertising.

公开(公告)号：US06194247B1

公开(公告)日：2001-02-27

申请号：US09159120

申请日：1998-09-23

申请人： Carmen D. Burns ,  James W. Cady ,  Jerry M. Roane ,  Phillip Randall Troetschel

发明人： Carmen D. Burns ,  James W. Cady ,  Jerry M. Roane ,  Phillip Randall Troetschel

IPC分类号： H01L2144

CPC分类号： H01L23/49555 ,  H01L23/16 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/562 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/3421 ,  H05K7/023 ,  Y10S438/977 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention provides a method for fabricating modified integrated circuit packages that are ultra-thin and resist warping. The integrated circuit packages are made thinner by removing some of the casing material uniformly from the upper and lower major surfaces of the integrated circuit package. To prevent the resulting ultra-thin integrated circuit package from warping, a thin layer of material with a coefficient of thermal expansion less than that of silicon is mounted to the upper major surface of the package after some of the casing material has been removed uniformly from the upper major surface. Also, a thin layer of material with a coefficient of thermal expansion greater than that of silicon may be mounted to the lower major surface of the package after some of the casing material has been removed uniformly from the lower major surface. The result is an ultra-thin integrated circuit package that is thermally and mechanically balanced to prevent warping.

摘要翻译： 本发明提供一种制造超薄且抗翘曲的改进的集成电路封装的方法。 通过从集成电路封装的上下表面均匀地去除一些外壳材料，使集成电路封装变薄。 为了防止所得到的超薄集成电路封装翘曲，将一些热膨胀系数小于硅的材料薄层安装到封装的上主表面上，其中一些外壳材料已经从 上主表面。 此外，在从下主表面均匀地除去一些外壳材料之后，可以将热膨胀系数大于硅的材料的薄层安装到封装的下主表面。 其结果是一种超薄的集成电路封装，其热和机械平衡以防止翘曲。

公开(公告)号：US5581121A

公开(公告)日：1996-12-03

申请号：US280968

申请日：1994-07-27

申请人： Carmen D. Burns ,  James W. Cady ,  Jerry M. Roane ,  Phillip R. Troetschel

发明人： Carmen D. Burns ,  James W. Cady ,  Jerry M. Roane ,  Phillip R. Troetschel

IPC分类号： H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K7/02 ,  H01L23/36

CPC分类号： H01L23/49555 ,  H01L23/16 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/562 ,  H01L25/105 ,  H05K7/023 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/3421 ,  Y10S438/977

摘要： The present invention provides a method for fabricating modified integrated circuit packages that are ultra-thin and resist warping. The integrated circuit packages are made thinner by removing some of the casing material uniformly from the upper and lower major surfaces of the integrated circuit package. To prevent the resulting ultra-thin integrated circuit package from warping, a thin layer of material with a coefficient of thermal expansion less than that of silicon is mounted to the upper major surface of the package after some of the casing material has been removed uniformly from the upper major surface. Also, a thin layer of material with a coefficient of thermal expansion greater than that of silicon may be mounted to the lower major surface of the package after some of the casing material has been removed uniformly from the lower major surface. The result is an ultra-thin integrated circuit package that is thermally and mechanically balanced to prevent warping.

摘要翻译： 本发明提供一种制造超薄且抗翘曲的改进的集成电路封装的方法。 通过从集成电路封装的上下表面均匀地去除一些外壳材料，使集成电路封装变薄。 为了防止所得到的超薄集成电路封装翘曲，将一些薄层的热膨胀系数小于硅的材料层安装在封装的上主表面上，其中一些外壳材料已从 上主表面。 此外，在从下主表面均匀地除去一些外壳材料之后，可以将热膨胀系数大于硅的材料的薄层安装到封装的下主表面。 其结果是一种超薄的集成电路封装，其热和机械平衡以防止翘曲。

公开(公告)号：US5475920A

公开(公告)日：1995-12-19

申请号：US206311

申请日：1994-03-04

申请人： Carmen D. Burns ,  Jerry M. Roane ,  James W. Cady

发明人： Carmen D. Burns ,  Jerry M. Roane ,  James W. Cady

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/433 ,  H01L25/10 ,  H05K7/02 ,  H05K7/20 ,  H01R43/00

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L23/564 ,  H01L25/10 ,  H01L25/105 ,  H05K7/023 ,  H01L2224/32245 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/3011 ,  Y10T29/49158 ,  Y10T29/49172

摘要： A method and apparatus for providing a multiple-element ultra high density level-two integrated circuit modular package utilizing a temporary manufacturing fixture to achieve a stack of individual thin ultra high density integrated circuit packages.

摘要翻译： 一种用于利用临时制造夹具提供多元件超高密度二级集成电路模块化封装以实现单个薄型超高密度集成电路封装的堆叠的方法和装置。

公开(公告)号：US07497807B2

公开(公告)日：2009-03-03

申请号：US11582030

申请日：2006-10-16

申请人： John D. Neff ,  Matthew T. Verona ,  Jerry M. Roane

发明人： John D. Neff ,  Matthew T. Verona ,  Jerry M. Roane

IPC分类号： A63B69/00

CPC分类号： A63B21/008 ,  A47B2220/06 ,  A63B21/00061 ,  A63B21/005 ,  A63B21/0058 ,  A63B21/0083 ,  A63B21/0087 ,  A63B21/015 ,  A63B21/023 ,  A63B21/0421 ,  A63B21/055 ,  A63B21/0552 ,  A63B21/4047 ,  A63B22/0007 ,  A63B22/0012 ,  A63B22/0046 ,  A63B22/0076 ,  A63B22/02 ,  A63B22/0605 ,  A63B22/0664 ,  A63B22/0694 ,  A63B22/203 ,  A63B24/0084 ,  A63B69/06 ,  A63B71/0622 ,  A63B2022/0035 ,  A63B2022/0041 ,  A63B2022/0082 ,  A63B2069/064 ,  A63B2069/066 ,  A63B2071/0644 ,  A63B2208/0233 ,  A63B2210/50 ,  A63B2210/58 ,  A63B2220/13 ,  A63B2220/16 ,  A63B2225/05 ,  A63B2225/055 ,  A63B2225/20 ,  A63B2230/75 ,  A63F2300/1043 ,  A63F2300/6607

摘要： A computer simulation enhanced exercise device is provided which engages the user by directly relating the users exercise motion in real time to a visual simulation or interactive game. The exercise device may comprise any variety of machines including, stationary bikes, rowing machines, treadmills, stepper, elliptical gliders or under desk exercise. These exercise devices are configured with sensors to measure physical movements as the user exercises and are coupled to computer hardware with modeling and virtualization software to create the system. These sensor measurements are then sent to a computer for use in the physics based modeling and real-time visual simulation. The computer simulation enhanced exercise device is further provided with features including manual and automatic adjustment of resistance levels, visualization of accurate caloric burn rates and correlation to everyday food items, and network connectivity providing for multiplayer network simulations and directed advertising.

摘要翻译： 提供了一种计算机模拟增强锻炼装置，其通过将用户的实时运动直接与视觉模拟或交互式游戏相关联来使用户接合。 锻炼装置可以包括任何各种机器，包括固定式自行车，划船机，跑步机，步进器，椭圆形滑翔机或桌子下运动。 这些运动装置配置有传感器，用于在用户锻炼时测量身体运动，并通过建模和虚拟化软件耦合到计算机硬件以创建系统。 然后将这些传感器测量发送到计算机，以用于基于物理的建模和实时视觉模拟。 计算机模拟增强锻炼装置还具有包括手动和自动调整阻力水平，可视化准确的热量燃烧率和与日常食品相关的特征，以及提供多人网络模拟和定向广告的网络连接。