Magnetic device
    2.
    发明授权
    Magnetic device 有权
    磁性装置

    公开(公告)号:US08772887B2

    公开(公告)日:2014-07-08

    申请号:US13475520

    申请日:2012-05-18

    CPC classification number: H01L43/08

    Abstract: A magnetic tunnel junction element is provided. The magnetic tunnel junction element has first magnetic layer and second magnetic layer formed adjacent, e.g., on lower and upper portions of an insulating layer, respectively and each having a perpendicular magnetic anisotropy, a magnetic field adjustment layer formed on the second magnetic layer and having a perpendicular magnetic anisotropy, and a bather layer formed between the magnetic field adjustment layer and the second magnetic layer. The second magnetic layer and the magnetic field adjustment layer are magnetically decoupled from each other.

    Abstract translation: 提供磁性隧道结元件。 磁性隧道结元件分别具有第一磁性层和第二磁性层,该第一磁性层和第二磁性层分别形成在例如绝缘层的下部和上部上并且各自具有垂直的磁各向异性,磁场调节层形成在第二磁性层上并具有 垂直磁各向异性,以及形成在磁场调整层和第二磁性层之间的沐浴层。 第二磁性层和磁场调节层彼此磁耦合。

    Methods of forming pattern structures
    8.
    发明申请
    Methods of forming pattern structures 有权
    形成图案结构的方法

    公开(公告)号:US20110272380A1

    公开(公告)日:2011-11-10

    申请号:US13184127

    申请日:2011-07-15

    CPC classification number: H01L27/228 H01L43/12

    Abstract: An example embodiment relates to a method of forming a pattern structure, including forming an object layer on a substrate, and forming a hard mask on the object layer. A plasma reactive etching process is performed on the object layer using an etching gas including a fluorine containing gas and ammonia (NH3) gas together with oxygen gas to form a pattern. The oxygen gas is used for suppressing the removal of the hard mask during the etching process.

    Abstract translation: 示例性实施例涉及一种形成图案结构的方法,包括在基底上形成物体层,并在物体层上形成硬掩模。 使用包含含氟气体和氨(NH 3)气体的蚀刻气体与氧气一起在物体层上进行等离子体反应蚀刻工艺以形成图案。 氧气用于在蚀刻过程中抑制硬掩模的去除。

    Method of manufacturing semiconductor device having transition metal oxide layer and related device
    10.
    发明授权
    Method of manufacturing semiconductor device having transition metal oxide layer and related device 有权
    具有过渡金属氧化物层的半导体器件的制造方法和相关器件

    公开(公告)号:US07871866B2

    公开(公告)日:2011-01-18

    申请号:US12175602

    申请日:2008-07-18

    CPC classification number: H01L27/24 G11C13/003 G11C2213/76 H01L27/224

    Abstract: Provided is a method of manufacturing a semiconductor device having a switching device capable of preventing a snake current. First, a transition metal oxide layer and a leakage control layer are alternately stacked on a substrate 1 to 20 times to form a varistor layer. The transition metal oxide layer is formed to contain an excessive transition metal compared to its stable state. The leakage control layer may be formed of one selected from the group consisting of a Mg layer, a Ta layer, an Al layer, a Zr layer, a Hf layer, a polysilicon layer, a conductive carbon group layer, and a Nb layer.

    Abstract translation: 提供一种具有能够防止蛇电流的开关装置的半导体装置的制造方法。 首先,将过渡金属氧化物层和泄漏控制层交替层叠在基板上1〜20次,以形成可变电阻层。 与其稳定状态相比,过渡金属氧化物层形成为含有过量的过渡金属。 泄漏控制层可以由选自Mg层,Ta层,Al层,Zr层,Hf层,多晶硅层,导电性碳基层和Nb层中的一种形成。

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