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    Method of molding semiconductor package
    4.
    发明授权
    Method of molding semiconductor package 有权

    公开(公告)号：US08420450B2

    公开(公告)日：2013-04-16

    申请号：US13094216

    申请日：2011-04-26

    申请人： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

    发明人： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

    IPC分类号： H01L21/16

    CPC分类号： H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

    摘要： A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

    System and method for providing packet network-based multimedia ringback tone service
    5.
    发明授权
    System and method for providing packet network-based multimedia ringback tone service 有权
    提供基于分组网络的多媒体回铃音服务的系统和方法

    公开(公告)号：US08259622B2

    公开(公告)日：2012-09-04

    申请号：US12599399

    申请日：2008-05-08

    申请人： Won Jun Lee ,  Jae Yong Park ,  Ki Mun Kim ,  Min Seok Kim ,  Young Ho Joo

    发明人： Won Jun Lee ,  Jae Yong Park ,  Ki Mun Kim ,  Min Seok Kim ,  Young Ho Joo

    IPC分类号： H04W4/00

    CPC分类号： H04M3/42017 ,  H04W4/16

    摘要： Disclosed herein is a system and method for providing a packet network-based MRBT service. In the method, when an originating MSC (110) requests call termination location information from an HLR (120), the HLR transmits an MRBT service request message, including a calling number and a called number, to an MRBT server (140). The MRBT server returns an MRBT service response message, including URL of MRBT content, to the HLR. The HLR transmits a call termination location information response message to the originating MSC, with MRBT service ID information and called party MRBT content URL information included in the call termination location information response message. The originating MSC (110) transmits called party MRBT content URL information to an originating MS (100) on a basis of the MRBT service ID information. The originating MS accesses the MRBT content URL, downloads relevant MRBT content, and plays and stores the MRBT content.

    摘要翻译： 本文公开了一种用于提供基于分组网络的MRBT服务的系统和方法。 在该方法中，当起始MSC（110）从HLR（120）请求呼叫终止位置信息时，HLR向MRBT服务器（140）发送包括呼叫号码和被叫号码的MRBT服务请求消息。 MRBT服务器向HLR返回包括MRBT内容的URL的MRBT服务响应消息。 HLR向起始MSC发送呼叫终止位置信息响应消息，其中包括在呼叫终止位置信息响应消息中的MRBT服务ID信息和被叫方MRBT内容URL信息。 始发MSC（110）基于MRBT服务ID信息向主叫MS（100）发送被叫方MRBT内容URL信息。 始发MS访问MRBT内容URL，下载相关MRBT内容，并播放和存储MRBT内容。

    Method of cutting a wafer
    8.
    发明授权
    Method of cutting a wafer 有权
    切割晶片的方法

    公开(公告)号：US07863161B2

    公开(公告)日：2011-01-04

    申请号：US12138646

    申请日：2008-06-13

    申请人： Dae-Sang Chan ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

    发明人： Dae-Sang Chan ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

    IPC分类号： H01L21/00

    CPC分类号： H01L21/78

    摘要： In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.

    摘要翻译： 在切割晶片的方法中，支撑构件附接到其上形成有半导体芯片的晶片的上表面。 在晶片的下表面沿着晶片的划线通道形成开口。 可以等离子体蚀刻晶片的下表面以减小晶片的厚度。 拉伸带可以附接到晶片的下表面。 这里，拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。 然后移除支撑构件。 拉伸带被冷却以增加拉伸膜之间的拉伸模块。 将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜，以将拉伸带与半导体芯片分离。 因此，可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。

    Organic electroluminescence display device and method of fabricating the same
    10.
    发明授权
    Organic electroluminescence display device and method of fabricating the same 有权
    有机电致发光显示装置及其制造方法

    公开(公告)号：US07671530B2

    公开(公告)日：2010-03-02

    申请号：US11641002

    申请日：2006-12-19

    申请人： Jae Yong Park ,  Kwang Jo Hwang ,  Jong Woo Park ,  Hee Dong Choi ,  Sang Ho Yu ,  Jin Hyoung Kim

    发明人： Jae Yong Park ,  Kwang Jo Hwang ,  Jong Woo Park ,  Hee Dong Choi ,  Sang Ho Yu ,  Jin Hyoung Kim

    IPC分类号： H01J1/62

    CPC分类号： H01L27/3276 ,  H01L27/3251

    摘要： Provided are an organic electroluminescence display device and method of fabricating the same. An organic electroluminescence display device according to the present invention includes a first substrate; a plurality of data lines arranged in a first direction on the first substrate; a plurality of gate lines arranged in a second direction on the first substrate; a plurality of pixel regions defined by the gate lines and the data lines, wherein a first pixel line is defined as a line of the pixel regions arranged in the first direction and a second pixel line is defined as a line of the pixel regions arranged in the second direction; a thin film transistor in each pixel region; a plurality of first connecting lines electrically connecting the thin film transistors of the first pixel lines with each other; and a second connecting line electrically connecting the thin film transistor of at least one of the second pixel lines.

    摘要翻译： 提供一种有机电致发光显示装置及其制造方法。 根据本发明的有机电致发光显示装置包括第一基板; 在第一基板上沿第一方向布置的多条数据线; 在所述第一基板上沿第二方向布置的多个栅极线; 由栅极线和数据线限定的多个像素区域，其中第一像素线被定义为沿第一方向布置的像素区域的线，而第二像素线被定义为布置在其中的像素区域的线 第二个方向 每个像素区域中的薄膜晶体管; 将第一像素线的薄膜晶体管彼此电连接的多个第一连接线; 以及第二连接线，电连接至少一个第二像素线的薄膜晶体管。