公开(公告)号：US07863161B2

公开(公告)日：2011-01-04

申请号：US12138646

申请日：2008-06-13

申请人： Dae-Sang Chan ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

发明人： Dae-Sang Chan ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

IPC分类号： H01L21/00

CPC分类号： H01L21/78

摘要： In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.

摘要翻译： 在切割晶片的方法中，支撑构件附接到其上形成有半导体芯片的晶片的上表面。 在晶片的下表面沿着晶片的划线通道形成开口。 可以等离子体蚀刻晶片的下表面以减小晶片的厚度。 拉伸带可以附接到晶片的下表面。 这里，拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。 然后移除支撑构件。 拉伸带被冷却以增加拉伸膜之间的拉伸模块。 将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜，以将拉伸带与半导体芯片分离。 因此，可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。

公开(公告)号：US20080311727A1

公开(公告)日：2008-12-18

申请号：US12138646

申请日：2008-06-13

申请人： Dae-Sang CHAN ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

发明人： Dae-Sang CHAN ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

IPC分类号： H01L21/302

CPC分类号： H01L21/78

摘要： In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.

摘要翻译： 在切割晶片的方法中，支撑构件附接到其上形成有半导体芯片的晶片的上表面。 在晶片的下表面沿着晶片的划线通道形成开口。 可以等离子体蚀刻晶片的下表面以减小晶片的厚度。 拉伸带可以附接到晶片的下表面。 这里，拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。 然后移除支撑构件。 拉伸带被冷却以增加拉伸膜之间的拉伸模块。 将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜，以将拉伸带与半导体芯片分离。 因此，可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。

公开(公告)号：US07713788B2

公开(公告)日：2010-05-11

申请号：US12197067

申请日：2008-08-22

申请人： Jun-Young Ko ,  Dae-Sang Chan ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jae-Yong Park

发明人： Jun-Young Ko ,  Dae-Sang Chan ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jae-Yong Park

IPC分类号： H01L21/44

CPC分类号： H01L23/3128 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/0657 ,  H01L2224/24226 ,  H01L2224/82039 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/15311

摘要： An inexpensive method of manufacturing a semiconductor package using a redistribution substrate that is relatively thin. The method includes: attaching a semiconductor chip to a redistribution substrate; attaching the redistribution substrate to which the semiconductor chip is attached to a printed circuit board; removing a support substrate of the redistribution substrate; forming via holes to expose a bond pad of the semiconductor chip and a bond finger of the printed circuit board; and filling the via holes with a conductive material. Meanwhile, a redistribution substrate to which at least one other semiconductor chip may be mounted on the redistribution substrate.

摘要翻译： 使用相对薄的再分布基板制造半导体封装的廉价方法。 该方法包括：将半导体芯片附接到再分布基板; 将安装有半导体芯片的再分布基板附着到印刷电路板上; 去除所述再分布基板的支撑基板; 形成通孔以暴露所述半导体芯片的接合焊盘和所述印刷电路板的接合指状物; 并用导电材料填充通孔。 同时，可以将至少一个其它半导体芯片安装在再分布基板上的再分布基板。

公开(公告)号：US20090200362A1

公开(公告)日：2009-08-13

申请号：US12369257

申请日：2009-02-11

申请人： Ky-Hyun JUNG ,  Jae-Yong Park ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jung-Hyeon Kim

发明人： Ky-Hyun JUNG ,  Jae-Yong Park ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jung-Hyeon Kim

IPC分类号： B23K31/02 ,  B23K1/20

CPC分类号： B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/206 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3651 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10734 ,  H01L2224/05599

摘要： In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package.

摘要翻译： 在无铅焊料，半导体封装和半导体封装的制造方法中，无铅焊料包括约3.5重量％至约6重量％的银，约0.05重量％至约0.5重量％ 的铜和余下的锡。 在半导体封装中采用无铅焊料。 无铅焊料具有高抗冲击性和高耐热性，以减少半导体封装的故障。

公开(公告)号：US07928971B2

公开(公告)日：2011-04-19

申请号：US11979598

申请日：2007-11-06

申请人： Jae-Yong Park ,  So-Haeng Cho

发明人： Jae-Yong Park ,  So-Haeng Cho

IPC分类号： G09G3/30 ,  G09G5/00

CPC分类号： H01L27/3253 ,  G09G3/3233 ,  G09G2300/0443 ,  G09G2300/0842 ,  H01L27/12 ,  H01L27/1248 ,  H01L27/3244 ,  H01L27/3251 ,  H01L27/3262 ,  H01L27/3276 ,  H01L51/5212 ,  H01L51/5246 ,  H01L2251/5315

摘要： An organic electroluminescent display device includes a substrate, a gate line on the substrate, a data line crossing the gate line over the substrate, a switching thin film transistor near the crossing of the gate line and data line, a driving thin film transistor system including a plurality of sub-TFTs connected in parallel to the switching thin film transistor via a gate base, a power line crossing the gate line over the substrate and electrically connected with the plurality of sub-TFTs, a first electrode over the driving thin film transistor system in contact with the plurality of sub-TFTs, an organic electroluminescent layer on the first electrode, and a second electrode of transparent material on the organic electroluminescent layer.

公开(公告)号：US07567028B2

公开(公告)日：2009-07-28

申请号：US11022769

申请日：2004-12-28

申请人： Jae-Yong Park ,  Nam-Yang Lee

发明人： Jae-Yong Park ,  Nam-Yang Lee

IPC分类号： H05B33/14 ,  H01J1/62 ,  G09G5/00

CPC分类号： H01L51/529 ,  H01L27/3244 ,  H01L27/3251 ,  H01L27/3276 ,  H01L2251/5315

摘要： An organic electroluminescent device includes: an array element layer having a pad on a first substrate having first and second sides; an organic electroluminescent diode connected to the array element, the organic electroluminescent diode emitting light in an opposite direction away from the first substrate; a printed circuit board adjacent to a backside of the first substrate, the printed circuit board supplying the array element with external signals through the pad; and a supporting plate between the first substrate and the printed circuit board, the supporting plate having better thermal conductivity than the first substrate.

摘要翻译： 有机电致发光器件包括：阵列元件层，其具有在第一和第二侧面上的第一衬底上的焊盘; 连接到所述阵列元件的有机电致发光二极管，所述有机电致发光二极管沿与所述第一基板相反的方向发射光; 与所述第一基板的背面相邻的印刷电路板，所述印刷电路板通过所述焊盘向所述阵列元件提供外部信号; 以及在第一基板和印刷电路板之间的支撑板，支撑板具有比第一基板更好的导热性。

公开(公告)号：US20080213930A1

公开(公告)日：2008-09-04

申请号：US12010612

申请日：2008-01-28

申请人： Jae-Yong Park

发明人： Jae-Yong Park

IPC分类号： H01L21/02

CPC分类号： H01L27/3251 ,  H01L27/322 ,  H01L51/524 ,  H01L51/5259 ,  H01L51/5284

摘要： A dual panel-type organic electroluminescent display device includes first and second substrates facing and spaced apart from each other, an array element layer disposed along an inner surface of the first substrate, the array element including a thin film transistor, a connection pattern disposed on the array element layer and electrically connected to the thin film transistor, a color filter layer disposed along an inner surface of the second substrate, the color filter layer including red, green, and blue color filters, an overcoat layer disposed on the color filter layer, the overcoat layer including a hygroscopic material, an organic electroluminescent diode disposed on the overcoat layer and connected to the connection pattern, the organic electroluminescent diode including a first electrode, an organic light-emitting layer, and a second electrode sequentially formed on the overcoat layer, and the organic light-emitting layer emits substantially monochromatic light, and a seal pattern along peripheral portions between the first and second substrates.

公开(公告)号：US07348605B2

公开(公告)日：2008-03-25

申请号：US11023605

申请日：2004-12-29

申请人： Jae-Yong Park

发明人： Jae-Yong Park

IPC分类号： H01L33/00

CPC分类号： H01L27/12 ,  H01L27/124 ,  H01L27/3223 ,  H01L27/3251 ,  H01L27/3276 ,  H01L51/5212

摘要： An organic electroluminescent display device comprises a substrate including a display region, and a pad region in a periphery of the display region, the display region including a pixel region; a gate pad, a data pad and a power pad in the pad region, the gate pad, the data pad and the power pad electrically connected to a gate line, a data line and a power line, respectively; a first electrode in the pixel region, the first electrode connected to the driving thin film transistor; an organic electroluminescent layer on the first electrode; a second electrode over an entire surface of the substrate including the organic electroluminescent layer; a dummy pad in the pad region, the dummy pad electrically connected to at least one of the power line and the second electrode; and a ground pad in the pad region, the ground pad electrically connected to the second electrode.

公开(公告)号：US07339193B2

公开(公告)日：2008-03-04

申请号：US11017777

申请日：2004-12-22

申请人： Jae-Yong Park

发明人： Jae-Yong Park

IPC分类号： H01L29/04

CPC分类号： H01L27/3251 ,  H01L27/322 ,  H01L51/524 ,  H01L51/5259 ,  H01L51/5284

摘要： A dual panel-type organic electroluminescent display device includes first and second substrates facing and spaced apart from each other, an array element layer disposed along an inner surface of the first substrate, the array element including a thin film transistor, a connection pattern disposed on the array element layer and electrically connected to the thin film transistor, a color filter layer disposed along an inner surface of the second substrate, the color filter layer including red, green, and blue color filters, an overcoat layer disposed on the color filter layer, the overcoat layer including a hygroscopic material, an organic electroluminescent diode disposed on the overcoat layer and connected to the connection pattern, the organic electroluminescent diode including a first electrode, an organic light-emitting layer, and a second electrode sequentially formed on the overcoat layer, and the organic light-emitting layer emits substantially monochromatic light, and a seal pattern along peripheral portions between the first and second substrates.

摘要翻译： 双面板型有机电致发光显示装置包括面对并彼此间隔开的第一和第二基板，沿着第一基板的内表面设置的阵列元件层，阵列元件包括薄膜晶体管，连接图案设置在 所述阵列元件层与所述薄膜晶体管电连接，沿着所述第二基板的内表面设置的滤色器层，所述滤色器层包括红色，绿色和蓝色滤色器，设置在所述滤色器层上的外涂层 所述外涂层包括吸湿材料，设置在外涂层上并连接到连接图案的有机电致发光二极管，所述有机电致发光二极管包括第一电极，有机发光层和顺序地形成在外涂层上的第二电极 并且有机发光层发射基本上单色的光和密封件 沿着第一和第二基板之间的周边部分。

公开(公告)号：US07304639B2

公开(公告)日：2007-12-04

申请号：US10744107

申请日：2003-12-24

申请人： Jae-Yong Park ,  So-Haeng Cho

发明人： Jae-Yong Park ,  So-Haeng Cho

IPC分类号： G09G3/30 ,  G09G3/38

CPC分类号： H01L27/3253 ,  G09G3/3233 ,  G09G2300/0443 ,  G09G2300/0842 ,  H01L27/12 ,  H01L27/1248 ,  H01L27/3244 ,  H01L27/3251 ,  H01L27/3262 ,  H01L27/3276 ,  H01L51/5212 ,  H01L51/5246 ,  H01L2251/5315

摘要： An organic electroluminescent display device includes a substrate, a gate line on the substrate, a data line crossing the gate line over the substrate, a switching thin film transistor near the crossing of the gate line and data line, a driving thin film transistor system including a plurality of sub-TFTs connected in parallel to the switching thin film transistor via a gate base, a power line crossing the gate line over the substrate and electrically connected with the plurality of sub-TFTs, a first electrode over the driving thin film transistor system in contact with the plurality of sub-TFTs, an organic electroluminescent layer on the first electrode, and a second electrode of transparent material on the organic electroluminescent layer.

摘要翻译： 一种有机电致发光显示装置，包括基板，基板上的栅极线，与基板上的栅极线交叉的数据线，栅极线与数据线的交叉点附近的开关薄膜晶体管，驱动薄膜晶体管系统， 多个子TFT，其经由栅极基极与开关薄膜晶体管并联连接;电源线，与所述基板上的栅极线交叉并与所述多个子TFT电连接，所述驱动薄膜晶体管上的第一电极 与多个子TFT接触的系统，第一电极上的有机电致发光层和有机电致发光层上的透明材料的第二电极。