公开(公告)号：US20080012116A1

公开(公告)日：2008-01-17

申请号：US11776497

申请日：2007-07-11

申请人： Jun-Young KO ,  Dae-Sang CHAN ,  Wha-Su SIN

发明人： Jun-Young KO ,  Dae-Sang CHAN ,  Wha-Su SIN

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/13022 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/2518 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00

摘要： A semiconductor device and a method of forming the same are provided. A semiconductor chip included in the semiconductor device includes a pillar-shaped terminal and a pad-shaped terminal in a terminal region. The pillar-shaped terminal is exposed at a first surface of a chip substrate in the terminal region and the pad-shaped terminal is exposed at a second surface of the chip substrate in the terminal region, where the first surface and the second surface of the chip substrate in the terminal region face oppositely from each other.

摘要翻译： 提供半导体器件及其形成方法。 包括在半导体器件中的半导体芯片包括在端子区域中的柱状端子和衬垫形端子。 柱状端子在端子区域中的芯片基板的第一表面处露出，并且在端子区域中的衬底基板的第二表面处露出垫状端子，其中第一表面和第二表面 端子区域中的芯片衬底彼此相对地面对。

公开(公告)号：US20110110062A1

公开(公告)日：2011-05-12

申请号：US12661012

申请日：2010-03-09

申请人： Jae-yong Park ,  Heui-Seog Kim ,  Jun-young Ko ,  Dae-sang Chan

发明人： Jae-yong Park ,  Heui-Seog Kim ,  Jun-young Ko ,  Dae-sang Chan

IPC分类号： H05K7/02 ,  H01L23/12

CPC分类号： H01L23/49575 ,  H01L23/26 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/732 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/01079 ,  H01L2924/10155 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stack-type semiconductor device including semiconductor chips having different backside structures and an electronic apparatus including the stack-type semiconductor device include: a base frame for a semiconductor device; a first semiconductor chip that is mounted on the base frame and has a bottom surface having a first surface roughness; and a second semiconductor chip that is mounted on the first semiconductor chip and has a bottom surface having a second surface roughness, wherein the second surface roughness is greater than the first surface roughness by 1.2 nm or more. The stack-type semiconductor device is manufactured to be thin while cracking of the first semiconductor chip is prevented. In addition, changes in data caused by charge loss resulting from diffusion of metal ions, which can occur when a stack-type semiconductor device is a memory device, is prevented.

摘要翻译： 包括具有不同背面结构的半导体芯片的堆叠型半导体器件和包括堆叠型半导体器件的电子设备包括：半导体器件的基底框架; 第一半导体芯片，其安装在所述基座框架上并且具有第一表面粗糙度的底面; 以及第二半导体芯片，其安装在所述第一半导体芯片上并且具有第二表面粗糙度的底表面，其中所述第二表面粗糙度大于所述第一表面粗糙度为1.2nm以上。 堆叠型半导体器件制造得很薄，同时防止了第一半导体芯片的破裂。 此外，防止了当堆叠型半导体器件是存储器件时可能发生的由金属离子扩散引起的电荷损失导致的数据变化。

公开(公告)号：US07863161B2

公开(公告)日：2011-01-04

申请号：US12138646

申请日：2008-06-13

申请人： Dae-Sang Chan ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

发明人： Dae-Sang Chan ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

IPC分类号： H01L21/00

CPC分类号： H01L21/78

摘要： In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.

摘要翻译： 在切割晶片的方法中，支撑构件附接到其上形成有半导体芯片的晶片的上表面。 在晶片的下表面沿着晶片的划线通道形成开口。 可以等离子体蚀刻晶片的下表面以减小晶片的厚度。 拉伸带可以附接到晶片的下表面。 这里，拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。 然后移除支撑构件。 拉伸带被冷却以增加拉伸膜之间的拉伸模块。 将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜，以将拉伸带与半导体芯片分离。 因此，可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。

公开(公告)号：US20080311727A1

公开(公告)日：2008-12-18

申请号：US12138646

申请日：2008-06-13

申请人： Dae-Sang CHAN ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

发明人： Dae-Sang CHAN ,  Jun-Young Ko ,  Wha-Su Sin ,  Jae-Yong Park

IPC分类号： H01L21/302

CPC分类号： H01L21/78

摘要： In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.

摘要翻译： 在切割晶片的方法中，支撑构件附接到其上形成有半导体芯片的晶片的上表面。 在晶片的下表面沿着晶片的划线通道形成开口。 可以等离子体蚀刻晶片的下表面以减小晶片的厚度。 拉伸带可以附接到晶片的下表面。 这里，拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。 然后移除支撑构件。 拉伸带被冷却以增加拉伸膜之间的拉伸模块。 将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜，以将拉伸带与半导体芯片分离。 因此，可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。

公开(公告)号：US20070193920A1

公开(公告)日：2007-08-23

申请号：US11709853

申请日：2007-02-23

申请人： Jun-young Ko ,  Dae-sang Chan ,  Sang-jun Kim

发明人： Jun-young Ko ,  Dae-sang Chan ,  Sang-jun Kim

IPC分类号： B65D85/00

CPC分类号： H01L21/67132 ,  H01L21/67092

摘要： Example embodiments may provide an apparatus for and method of separating a semiconductor chip. In the example embodiments, a separating plate having an end insertable between a base tape and an adhesive film may move back and forth in a direction perpendicular to an edge of the semiconductor chip so as to separate the semiconductor chip. Example embodiments may allow fragile, thin semiconductor chips to be safely packaged without damage and thus may increase semiconductor chip yield.

摘要翻译： 示例性实施例可以提供用于分离半导体芯片的装置和方法。 在示例实施例中，具有可插入基带和粘合剂膜之间的端部的分离板可以在垂直于半导体芯片的边缘的方向上来回移动，以便分离半导体芯片。 示例性实施例可以允许脆弱的薄半导体芯片安全地封装而不损坏，因此可以提高半导体芯片的产量。

公开(公告)号：US20070099550A1

公开(公告)日：2007-05-03

申请号：US11397883

申请日：2006-04-05

申请人： Jun-Young Ko ,  Dae-Sang Chan ,  Sang-Jun Kim

发明人： Jun-Young Ko ,  Dae-Sang Chan ,  Sang-Jun Kim

IPC分类号： B24B7/30 ,  B24B1/00 ,  B24B29/00

CPC分类号： B24B7/228 ,  B24B37/345

摘要： A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.

摘要翻译： 一种晶片研磨和胶带附着装置及方法，该方法包括将晶片提供到卡盘台，研磨晶片的背面，提供具有切割带的晶片环，并将切割带附接到研磨晶片的背面。

公开(公告)号：US07745932B2

公开(公告)日：2010-06-29

申请号：US12153558

申请日：2008-05-21

申请人： Jun-young Ko ,  Dae-sang Chan ,  Jae-yong Park ,  Heui-seog Kim ,  Wha-su Sin

发明人： Jun-young Ko ,  Dae-sang Chan ,  Jae-yong Park ,  Heui-seog Kim ,  Wha-su Sin

IPC分类号： H01L23/48

CPC分类号： H01L23/49575 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups.

摘要翻译： 提供半导体封装和包括该半导体封装的半导体封装模块。 半导体封装可以包括多个半导体芯片，连接到半导体芯片的焊盘并从外部暴露的多个引线，其中多个引线可以分为多个引脚组，并且多个半导体芯片可以被分类 成为多个芯片组，并且类似芯片组的半导体芯片的焊盘可以连接到类似引脚组的引线。

公开(公告)号：US20080070382A1

公开(公告)日：2008-03-20

申请号：US11858821

申请日：2007-09-20

申请人： Dae-Sang CHAN ,  Jun-Young KO ,  Wha-Su SIN

发明人： Dae-Sang CHAN ,  Jun-Young KO ,  Wha-Su SIN

IPC分类号： H01L21/78 ,  B28D7/04

CPC分类号： B28D5/0082 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802

摘要： A wafer fixing apparatus is disclosed including a dicing stage structured to fix a semiconductor wafer. A die attach film is disposed on the dicing stage to attach the semiconductor wafer to the dicing stage. The die attach film attaches the semiconductor wafer to the dicing stage due to the tackiness of the die attach film. A wafer ring, which may be of a metallic material, is coupled to the dicing stage using a wafer ring attaching member.

摘要翻译： 公开了一种晶片定影装置，其包括结构化以固定半导体晶片的切割台。 在切割台上设置管芯附着膜，以将半导体晶片连接到切割台。 芯片附着膜由于芯片附着膜的粘性而将半导体晶片附着在切割台上。 可以是金属材料的晶片环使用晶片环连接构件联接到切割台。

公开(公告)号：US20070057410A1

公开(公告)日：2007-03-15

申请号：US11500345

申请日：2006-08-08

申请人： Dae-sang Chan ,  Jun-young Ko ,  Sang-jun Kim ,  Wha-su Sin

发明人： Dae-sang Chan ,  Jun-young Ko ,  Sang-jun Kim ,  Wha-su Sin

IPC分类号： H05B6/00

CPC分类号： H01L21/67132

摘要： Example embodiments of the present invention relate to a method of packaging a semiconductor device. Other example embodiments of the present invention relate to a method of fabricating wafer chips for packaging a semiconductor device. Provided is a method of fabricating a wafer chips, which can perform a reliable pick-up process by removing the adhesive component adhering onto the cutting surfaces of the wafer chips, the diced DAF and the first base film. The method includes preparing at least one wafer, attaching at least one film onto a back surface of the wafer to support the wafer, forming wafer chips by dicing the wafer, detaching the at least one film from the wafer chips and attaching at least one base film onto the wafer chips to support the wafer chips.

摘要翻译： 本发明的示例性实施例涉及一种封装半导体器件的方法。 本发明的其它示例性实施例涉及制造用于封装半导体器件的晶片芯片的方法。 提供一种制造晶片芯片的方法，其可以通过去除附着在晶片芯片，切割的DAF和第一基底膜的切割表面上的粘合剂成分来执行可靠的拾取过程。 该方法包括制备至少一个晶片，将至少一个膜附着到晶片的背面上以支撑晶片，通过切割晶片形成晶片芯片，将晶片芯片中的至少一个薄膜分开并将至少一个基底 胶片到晶片芯片上以支撑晶片芯片。

公开(公告)号：US07713788B2

公开(公告)日：2010-05-11

申请号：US12197067

申请日：2008-08-22

申请人： Jun-Young Ko ,  Dae-Sang Chan ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jae-Yong Park

发明人： Jun-Young Ko ,  Dae-Sang Chan ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jae-Yong Park

IPC分类号： H01L21/44

CPC分类号： H01L23/3128 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/0657 ,  H01L2224/24226 ,  H01L2224/82039 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/15311

摘要： An inexpensive method of manufacturing a semiconductor package using a redistribution substrate that is relatively thin. The method includes: attaching a semiconductor chip to a redistribution substrate; attaching the redistribution substrate to which the semiconductor chip is attached to a printed circuit board; removing a support substrate of the redistribution substrate; forming via holes to expose a bond pad of the semiconductor chip and a bond finger of the printed circuit board; and filling the via holes with a conductive material. Meanwhile, a redistribution substrate to which at least one other semiconductor chip may be mounted on the redistribution substrate.

摘要翻译： 使用相对薄的再分布基板制造半导体封装的廉价方法。 该方法包括：将半导体芯片附接到再分布基板; 将安装有半导体芯片的再分布基板附着到印刷电路板上; 去除所述再分布基板的支撑基板; 形成通孔以暴露所述半导体芯片的接合焊盘和所述印刷电路板的接合指状物; 并用导电材料填充通孔。 同时，可以将至少一个其它半导体芯片安装在再分布基板上的再分布基板。