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公开(公告)号:US20120015517A1
公开(公告)日:2012-01-19
申请号:US13182944
申请日:2011-07-14
申请人: Daisuke OSHIDA , Ippei KUME , Makoto UEKI , Manabu IGUCHI , Naoya INOUE , Takuya MARUYAMA , Toshiji TAIJI , Hirokazu KATSUYAMA
发明人: Daisuke OSHIDA , Ippei KUME , Makoto UEKI , Manabu IGUCHI , Naoya INOUE , Takuya MARUYAMA , Toshiji TAIJI , Hirokazu KATSUYAMA
IPC分类号: H01L21/283
CPC分类号: H01L21/76883 , H01L21/02126 , H01L21/02216 , H01L21/3105 , H01L21/76805 , H01L21/76807 , H01L21/76814 , H01L21/76826 , H01L21/76831 , H01L21/76843 , H01L21/76865 , H01L21/76873 , H01L23/53238 , H01L23/5329 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要: The semiconductor device includes an insulating film that is formed using a cyclic siloxane having a six-membered ring structure as a raw material; a trench that is formed in the insulating film; and a interconnect that is configured by a metal film embedded in the trench. In the semiconductor device, a modified layer is formed on a bottom surface of the trench, in which the number of carbon atoms and/or the number of nitrogen atoms per unit volume is larger than that inside the insulating film.
摘要翻译: 半导体器件包括使用具有六元环结构的环状硅氧烷作为原料形成的绝缘膜; 在绝缘膜中形成的沟槽; 以及由嵌入在沟槽中的金属膜构成的互连。 在半导体装置中,在沟槽的底面上形成改性层,其中每单位体积的碳原子数和/或氮原子数大于绝缘膜内部。
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公开(公告)号:US09337093B2
公开(公告)日:2016-05-10
申请号:US13182944
申请日:2011-07-14
申请人: Daisuke Oshida , Ippei Kume , Makoto Ueki , Manabu Iguchi , Naoya Inoue , Takuya Maruyama , Toshiji Taiji , Hirokazu Katsuyama
发明人: Daisuke Oshida , Ippei Kume , Makoto Ueki , Manabu Iguchi , Naoya Inoue , Takuya Maruyama , Toshiji Taiji , Hirokazu Katsuyama
IPC分类号: H01L21/283 , H01L21/768 , H01L21/3105 , H01L23/532 , H01L21/02
CPC分类号: H01L21/76883 , H01L21/02126 , H01L21/02216 , H01L21/3105 , H01L21/76805 , H01L21/76807 , H01L21/76814 , H01L21/76826 , H01L21/76831 , H01L21/76843 , H01L21/76865 , H01L21/76873 , H01L23/53238 , H01L23/5329 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要: The semiconductor device includes an insulating film that is formed using a cyclic siloxane having a six-membered ring structure as a raw material; a trench that is formed in the insulating film; and a interconnect that is configured by a metal film embedded in the trench. In the semiconductor device, a modified layer is formed on a bottom surface of the trench, in which the number of carbon atoms and/or the number of nitrogen atoms per unit volume is larger than that inside the insulating film.
摘要翻译: 半导体器件包括使用具有六元环结构的环状硅氧烷作为原料形成的绝缘膜; 在绝缘膜中形成的沟槽; 以及由嵌入在沟槽中的金属膜构成的互连。 在半导体装置中,在沟槽的底面上形成改性层,其中每单位体积的碳原子数和/或氮原子数大于绝缘膜内部。
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3.
公开(公告)号:US5830954A
公开(公告)日:1998-11-03
申请号:US575612
申请日:1995-12-20
IPC分类号: B23Q41/08 , B01J4/02 , B01J19/00 , C08F2/00 , C08F10/00 , C08F110/02 , C08F110/06 , G05B19/02 , G05B19/418
CPC分类号: G06Q10/04 , B01J19/0006 , C08F10/00 , C08F110/02 , C08F110/06 , C08F2400/02
摘要: The names of a plurality of polyolefine resins are previously registered as index data in a name data base. An optimal operational pattern is stored in an operational pattern table for each combination of the name of a current resin under production and the name of a target resin to be produced. The optimal operation pattern is selected based on the name of the current resin under production and the name of the next target resin to be produced. Based on the selected optimal operational pattern, resin-type change control is executed.
摘要翻译: 多个聚烯烃树脂的名称预先登记在名称数据库中作为索引数据。 对于正在生产的当前树脂的名称和要生产的目标树脂的名称的每个组合,将最佳操作模式存储在操作模式表中。 基于正在生产的当前树脂的名称和要生产的下一个目标树脂的名称来选择最佳操作模式。 基于所选择的最佳操作模式,执行树脂型变更控制。
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