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    AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS
    1.
    发明申请
    AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS 失效
    注射成型焊枪头的空气轴承挡板控制

    公开(公告)号：US20080302860A1

    公开(公告)日：2008-12-11

    申请号：US11760813

    申请日：2007-06-11

    申请人： Glen N. Biggs ,  Timothy J. Chainer ,  John P. Karidis ,  Dennis G. Manzer ,  Christopher L. Tessler

    发明人： Glen N. Biggs ,  Timothy J. Chainer ,  John P. Karidis ,  Dennis G. Manzer ,  Christopher L. Tessler

    IPC分类号： B23K31/02

    CPC分类号： B23K3/0623

    摘要： An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.

    摘要翻译： 用于注射成型焊料填充头的空气轴承间隙控制装置。 还提供了一种利用空气轴承装置为注射成型的焊料填充头提供间隙控制的方法。 提供了在焊料填充头结构的下部或分配区域处的C形环密封件，其中C形在其前缘处是敞开的。 因此，为了形成空气轴承，通过加压空气严格控制流行的前缘间隙。 该前沿的下游是熔融焊料，其被包含在焊料填充头和模具之间的非常窄的间隙高度内。 当焊料填充形成在模具表面中的凹坑或凹槽时，空气将从凹坑向空气轴承移出或移出，然后排出，同时沉积的焊料保持在适当的位置。

    Working electrode design for electrochemical processing of electronic components
    2.
    发明申请
    Working electrode design for electrochemical processing of electronic components 有权
    电子元件电化学处理工作电极设计

    公开(公告)号：US20120043216A1

    公开(公告)日：2012-02-23

    申请号：US12806719

    申请日：2010-08-19

    申请人： Charles L. Arvin ,  Raschid J. Bezama ,  Glen N. Biggs ,  Hariklia Deligianni ,  Tracy A. Tong

    发明人： Charles L. Arvin ,  Raschid J. Bezama ,  Glen N. Biggs ,  Hariklia Deligianni ,  Tracy A. Tong

    IPC分类号： C25D17/10 ,  C25D7/00 ,  C25D5/00

    CPC分类号： C25D17/001 ,  C25D5/04 ,  C25D7/123 ,  C25D17/004 ,  C25D17/02 ,  C25D17/12

    摘要： An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

    摘要翻译： 提供一种电镀设备，其包括用于容纳电镀液的镀槽。 对电极，例如阳极，存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。 在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

    WORKING ELECTRODE DESIGN FOR ELECTROCHEMICAL PROCESSING OF ELECTRONIC COMPONENTS
    5.
    发明申请
    WORKING ELECTRODE DESIGN FOR ELECTROCHEMICAL PROCESSING OF ELECTRONIC COMPONENTS 有权
    电子元器件电化学处理工作电极设计

    公开(公告)号：US20130062209A1

    公开(公告)日：2013-03-14

    申请号：US13612661

    申请日：2012-09-12

    申请人： Charles L. Arvin ,  Raschid J. Bezama ,  Glen N. Biggs ,  Hariklia Deligianni ,  Tracy A. Tong

    发明人： Charles L. Arvin ,  Raschid J. Bezama ,  Glen N. Biggs ,  Hariklia Deligianni ,  Tracy A. Tong

    IPC分类号： C25D17/02 ,  C25D21/12 ,  C25D17/12

    CPC分类号： C25D17/001 ,  C25D5/04 ,  C25D7/123 ,  C25D17/004 ,  C25D17/02 ,  C25D17/12

    摘要： An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

    摘要翻译： 一种电镀设备，包括用于容纳电镀电解质的电镀槽。 对电极，例如阳极，存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。 在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

    Air bearing gap control for injection molded solder heads
    6.
    发明授权
    Air bearing gap control for injection molded solder heads 失效
    注射成型焊头的气隙间隙控制

    公开(公告)号：US07513410B2

    公开(公告)日：2009-04-07

    申请号：US11760813

    申请日：2007-06-11

    申请人： Glen N. Biggs ,  Timothy J. Chainer ,  John P. Karidis ,  Dennis G. Manzer ,  Christopher L. Tessler

    发明人： Glen N. Biggs ,  Timothy J. Chainer ,  John P. Karidis ,  Dennis G. Manzer ,  Christopher L. Tessler

    IPC分类号： B23K31/02 ,  B22D35/00

    CPC分类号： B23K3/0623

    摘要： An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.

    摘要翻译： 用于注射成型焊料填充头的空气轴承间隙控制装置。 还提供了一种利用空气轴承装置为注射成型的焊料填充头提供间隙控制的方法。 提供了在焊料填充头结构的下部或分配区域处的C形环密封件，其中C形在其前缘处是敞开的。 因此，为了形成空气轴承，通过加压空气严格控制流行的前缘间隙。 该前沿的下游是熔融焊料，其被包含在焊料填充头和模具之间的非常窄的间隙高度内。 当焊料填充形成在模具表面中的凹坑或凹槽时，空气将从凹坑向空气轴承移出或移出，然后排出，同时沉积的焊料保持在适当的位置。

    Working electrode design for electrochemical processing of electronic components
    10.
    发明授权
    Working electrode design for electrochemical processing of electronic components 有权
    电子元器件电化学处理工作电极设计

    公开(公告)号：US08926820B2

    公开(公告)日：2015-01-06

    申请号：US13612661

    申请日：2012-09-12

    申请人： Charles L. Arvin ,  Raschid J. Bezama ,  Glen N. Biggs ,  Hariklia Deligianni ,  Tracy A. Tong

    发明人： Charles L. Arvin ,  Raschid J. Bezama ,  Glen N. Biggs ,  Hariklia Deligianni ,  Tracy A. Tong

    IPC分类号： C25D21/00 ,  C25D17/02 ,  C25D17/12 ,  C25D7/12 ,  C25D5/04 ,  C25D17/00

    CPC分类号： C25D17/001 ,  C25D5/04 ,  C25D7/123 ,  C25D17/004 ,  C25D17/02 ,  C25D17/12

    摘要： An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

    摘要翻译： 一种电镀设备，包括用于容纳电镀电解质的电镀槽。 对电极，例如阳极，存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。 在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。