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    DATA CENTER COOLING SYSTEM
    3.
    发明申请
    DATA CENTER COOLING SYSTEM 有权
    数据中心冷却系统

    公开(公告)号：US20140020418A1

    公开(公告)日：2014-01-23

    申请号：US13588260

    申请日：2012-08-17

    申请人： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

    发明人： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

    IPC分类号： F25B49/00 ,  F25D17/02 ,  F25D31/00

    CPC分类号： H05K7/20836 ,  G06F1/206

    摘要： A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.

    摘要翻译： 数据中心冷却系统可以包括用于冷却没有蒸气压缩制冷的液体冷却剂的传热设备，并且液体冷却剂被用在容纳在数据中心中的液冷信息技术设备机架上。 该系统还可以包括控制器装置，其通过基于信息技术设备温度阈值的一系列液体冷却剂流量值来调节流向液体冷却的信息技术设备机架的液体冷却剂流。

    Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures
    4.
    发明授权
    Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures 失效
    使用原位电容测量来监测复杂PCB组件和其他结构中界面材料的稳定性

    公开(公告)号：US08589102B2

    公开(公告)日：2013-11-19

    申请号：US13010854

    申请日：2011-01-21

    申请人： Timothy J. Chainer ,  Michael A. Gaynes ,  Edward J. Yarmchuk

    发明人： Timothy J. Chainer ,  Michael A. Gaynes ,  Edward J. Yarmchuk

    IPC分类号： G01N27/22

    CPC分类号： G01N27/228 ,  H01L23/34 ,  H01L23/3733 ,  H01L23/42 ,  H01L2924/0002 ,  H05K3/30 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2924/00

    摘要： An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes. The technique may be employed for monitoring physical changes in electronic devices and other structures having interfaces between components.

    摘要翻译： 在电子部件和散热器之间的间隙的相对侧上的第一和第二电极上施加电位。 间隙中的热界面材料，电子部件和散热器中的至少一个受到变化的物理条件的影响。 在变化的物理条件期间监测电极之间的电容。 可以使用共享共用散热器的部件阵列来实施这种方法。 用于测试热界面的组件包括印刷电路板，安装到印刷电路板并且与印刷电路板可操作地相关联的多个电子部件，定位成用于吸收由电子部件产生的热量的散热器，与散热器相关联的第一电极， 分别与电子部件相关联的多个第二电极和用于监测第一和第二电极之间的电容的装置。 该技术可以用于监测电子设备中的物理变化以及具有组件之间的接口的其他结构。

    ENERGY EFFICIENT DATA CENTER LIQUID COOLING WITH GEOTHERMAL ENHANCEMENT
    6.
    发明申请
    ENERGY EFFICIENT DATA CENTER LIQUID COOLING WITH GEOTHERMAL ENHANCEMENT 有权
    能源效率数据中心液体冷却与地热增强

    公开(公告)号：US20130081781A1

    公开(公告)日：2013-04-04

    申请号：US13252888

    申请日：2011-10-04

    申请人： Timothy J. Chainer ,  Pritish R. Parida

    发明人： Timothy J. Chainer ,  Pritish R. Parida

    IPC分类号： F24J3/08

    CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20654 ,  H05K7/2079

    摘要： A data center cooling system is operated in a first mode, and has an indoor portion wherein heat is absorbed from components in the data center by a heat transfer fluid, and an outdoor heat exchanger portion and a geothermal heat exchanger portion. The first mode includes ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and/or geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion. Based on an appropriate metric, a determination is made that a switch should be made from the first mode to a second mode; and, in response, the data center cooling system is switched to the second mode. The second mode is different than the first mode.

    摘要翻译： 数据中心冷却系统以第一模式运行，并且具有通过传热流体和室外热交换器部分和地热换热器部分从数据中心的部件吸收热量的室内部分。 第一模式包括室外热交换器部分中的传热流体的环境空气冷却和/或地热换热器部分中的传热流体的地热冷却。 基于适当的度量，确定应当从第一模式到第二模式的开关; 并且作为响应，数据中心冷却系统被切换到第二模式。 第二模式与第一模式不同。

    METHOD FOR ENVIRONMENTAL SENSING
    9.
    发明申请
    METHOD FOR ENVIRONMENTAL SENSING 有权
    环境感测方法

    公开(公告)号：US20100052891A1

    公开(公告)日：2010-03-04

    申请号：US12613758

    申请日：2009-11-06

    申请人： Timothy J. Chainer ,  Nitendra Rajput ,  Bernice E. Rogowitz

    发明人： Timothy J. Chainer ,  Nitendra Rajput ,  Bernice E. Rogowitz

    IPC分类号： G08B23/00

    CPC分类号： G01V3/00 ,  G01W1/00

    摘要： Data pertaining to environmental information is acquired using sensors on a multiplicity of networked pervasive devices, and analyzed to determine occurrence of at least one environmental event. Such data can be obtained, for example, from an inventive wireless communications device including an antenna, transmit circuitry coupled to the antenna for transmission of radio frequency radiation therefrom, at least one environmental sensor configured to obtain environmental data, and a communications module coupled to the at least one environmental sensor and configured to cause transmission of a representation of the data via the antenna and the transmit circuitry.

    摘要翻译： 关于环境信息的数据是使用多个网络普及设备上的传感器来获取的，并被分析以确定至少一个环境事件的发生。 这样的数据可以例如从包括天线的发明的无线通信设备获得，耦合到天线的发射电路用于从其发射射频辐射，至少一个被配置为获得环境数据的环境传感器，以及耦合到 所述至少一个环境传感器并且被配置为经由所述天线和所述发射电路来发送所述数据的表示。

    Integrated chip carrier with compliant interconnect
    10.
    发明授权
    Integrated chip carrier with compliant interconnect 有权
    具有兼容互连的集成芯片载体

    公开(公告)号：US07473577B2

    公开(公告)日：2009-01-06

    申请号：US11502969

    申请日：2006-08-11

    申请人： Timothy J. Chainer

    发明人： Timothy J. Chainer

    IPC分类号： H01L21/44

    CPC分类号： H01L21/486 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

    摘要： An electronic device includes: at least one electronic chip comprising a first coefficient of thermal expansion (CTE); and a carrier including a top side connected to the bottom side of the chip by solder bumps. The carrier further includes a second CTE that approximately matches the first CTE, and a plurality of through vias from the bottom side of the carrier to the top side of the carrier layer. Each through via comprising a collar exposed at the top surface of the carrier, a pad exposed at the bottom surface of the carrier, and a post disposed between the collar and the pad. The post extends thorough a volume of space.

    摘要翻译： 电子设备包括：包括第一热膨胀系数（CTE）的至少一个电子芯片; 以及载体，其包括通过焊料凸块连接到芯片的底侧的顶侧。 载体还包括与第一CTE近似匹配的第二CTE和从载体的底侧到载体层的顶侧的多个通孔。 每个通孔包括暴露在载体的顶表面处的套环，暴露在载体的底表面处的垫，以及设置在套环和垫之间的柱。 这篇文章扩展了一大堆空间。