公开(公告)号：US10180665B2

公开(公告)日：2019-01-15

申请号：US13234563

申请日：2011-09-16

申请人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson

发明人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson

IPC分类号： G05D23/19 ,  G05B13/02 ,  H05K7/20 ,  G06F1/20

摘要： A fluid-cooled computer system includes a plurality of heat-generating components and a cooling system configured for supplying a cooling fluid at a controlled cooling fluid flow rate to cool the heat-generating components. A temperature-based cooling control circuit includes a temperature sensor configured for sensing a temperature of the heat-generating components and control logic for increasing a cooling fluid flow rate in response to the temperature exceeding a temperature threshold. A power-based cooling control circuit is configured for identifying and quantifying an increasing power consumption trend over a target time interval and, during a period that the temperature of the electronic device does not exceed the temperature threshold, increasing a cooling fluid flow rate to the electronic device in response to the magnitude of the increasing power consumption trend exceeding a power threshold. In one option, the fluid-cooled computer system is a server and the heat-generating components include a processor.

公开(公告)号：US09110642B2

公开(公告)日：2015-08-18

申请号：US13274835

申请日：2011-10-17

申请人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson ,  Billy W. Medlin

发明人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson ,  Billy W. Medlin

IPC分类号： G06F1/20 ,  H05K7/20 ,  G06F1/32

CPC分类号： G06F1/206 ,  G06F1/3206 ,  H05K7/20209 ,  H05K7/20718 ,  Y02D10/16

摘要： A computer-implemented method comprises accessing historical operating data for a unit of information technology equipment, wherein the historical operating data includes power consumption, fan speed, inlet air temperature, workload, and any processor throttling events at various points in time. The method further comprises receiving user input selecting a fan speed, and using the historical operating data to determine a performance impact that is expected from operating the unit at the selected fan speed, where the power consumption is a proxy for performance. The estimated performance impact of the selected fan speed and one or more alternative fan speeds is then displayed.

摘要翻译： 计算机实现的方法包括访问信息技术设备单元的历史操作数据，其中历史操作数据包括功率消耗，风扇速度，入口空气温度，工作负载以及在不同时间点的任何处理器调节事件。 该方法还包括接收选择风扇速度的用户输入，以及使用历史操作数据来确定在所选择的风扇速度下操作单元所期望的性能影响，其中功耗是性能的代理。 然后显示所选风扇速度和一个或多个替代风扇速度的估计性能影响。

公开(公告)号：US20130192794A1

公开(公告)日：2013-08-01

申请号：US13361929

申请日：2012-01-30

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： F28F9/00

CPC分类号： H05K13/00 ,  H01L21/4882 ,  H01L23/40 ,  H01L23/42 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16225 ,  H05K7/20009 ,  H05K7/20254 ,  Y10T29/49117

摘要： Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.

摘要翻译： 提供冷却系统互换性的几种设备和方法。 一种装置包括热耦合到集成电路的导热板。 导热板被配置为可互换地耦合到液体冷却组件或空气冷却组件，并且液体冷却组件和空气冷却组件是分离的装置。

公开(公告)号：US20120281358A1

公开(公告)日：2012-11-08

申请号：US13102211

申请日：2011-05-06

申请人： Timothy J. CHAINER ,  Michael A. GAYNES ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark D. SCHULTZ ,  Daniel P. SIMCO ,  Mark E. STEINKE

发明人： Timothy J. CHAINER ,  Michael A. GAYNES ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark D. SCHULTZ ,  Daniel P. SIMCO ,  Mark E. STEINKE

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

摘要翻译： 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

公开(公告)号：US08255740B2

公开(公告)日：2012-08-28

申请号：US12891309

申请日：2010-09-27

申请人： Vinod Kamath ,  Jason A. Matteson ,  Gregory J. McKnight ,  Mark E. Steinke

发明人： Vinod Kamath ,  Jason A. Matteson ,  Gregory J. McKnight ,  Mark E. Steinke

IPC分类号： G06F11/00

CPC分类号： G06F11/0793 ,  G06F11/073

摘要： Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold.

摘要翻译： 本发明的实施例包括用于根据预定义的顺序选择性地应用补救动作以减少计算机存储器系统中的错误率的计算机实现的方法。 在一个实施例中，响应于DIMM中的单位错误（SBE）达到连续的错误阈值，顺序地调用有序的一组补救动作。 例如，在风冷系统中，补救措施可以包括动态地增加DIMM刷新速率，动态地增加用于冷却DIMM的气流速率，以及动态地调节DIMM。 补救措施可以按照它们被依次调用来分层，以提供累积的补救效果。 响应于达到相关阈值的多位错误率，可以同时调用至少两个补救动作。

公开(公告)号：US20120123595A1

公开(公告)日：2012-05-17

申请号：US12945958

申请日：2010-11-15

申请人： Fred A. Bower, III ,  Vinod Kamath ,  Michael S. Miller

发明人： Fred A. Bower, III ,  Vinod Kamath ,  Michael S. Miller

IPC分类号： G05D23/00 ,  G05D7/06 ,  F28D15/00

CPC分类号： G05D23/1934 ,  H05K7/20772 ,  H05K7/20836

摘要： Methods and systems for controlling fluid coolant flow in cooling systems of computing devices are disclosed. According to an aspect, a method may include determining a temperature of a fluid coolant in a cooling system of a computing device. For example, a temperature of water exiting a cooling system of a server may be determined. The method may also include determining an operational condition of the computing device. For example, a temperature of a processor, memory, or input/output (I/O) component may be determined. Further, the method may include controlling a flow of the fluid coolant through the cooling system based on the temperature of the fluid coolant and/or the operational condition.

摘要翻译： 公开了用于控制计算设备的冷却系统中的流体冷却剂流的方法和系统。 根据一个方面，一种方法可以包括确定计算装置的冷却系统中的流体冷却剂的温度。 例如，可以确定离开服务器的冷却系统的水的温度。 该方法还可以包括确定计算设备的操作条件。 例如，可以确定处理器，存储器或输入/输出（I / O）组件的温度。 此外，该方法可以包括基于流体冷却剂的温度和/或操作条件来控制通过冷却系统的流体冷却剂的流动。

公开(公告)号：US20110286175A1

公开(公告)日：2011-11-24

申请号：US12785779

申请日：2010-05-24

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Mark E. Steinke ,  Aparna Vallury

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Mark E. Steinke ,  Aparna Vallury

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  G06F2200/201

摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

摘要翻译： 用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管 在第一个插槽之上。 热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。 该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。 在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。

公开(公告)号：US07969736B1

公开(公告)日：2011-06-28

申请号：US12701640

申请日：2010-02-08

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Jason A. Matteson ,  Mark E. Steinke

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Jason A. Matteson ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： H01L23/36 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.

摘要翻译： 通过在相邻DIMM之间定位导热底座来冷却DIMM。 诸如热管或金属杆的导热基座通过导热元件从DIMM接收热量，导热元件被选择性地偏压抵靠所安装的DIMM。 底座将热量传送到沿着DIMM端部延伸的液体导管，其中循环液体带走热量。 导热元件提供可调整的跨度以适应DIMM表面之间的距离的变化。 可以安装本发明的实施例而不延伸到DIMM的高度之上。

公开(公告)号：US07948196B2

公开(公告)日：2011-05-24

申请号：US12099841

申请日：2008-04-09

申请人： Ralph Murray Begun ,  Raymond Mathew Clemo ,  Karl Klaus Dittus ,  Vinod Kamath ,  Michael Sven Miller ,  Warren Everett Price ,  Whitcomb Randolph Scott, III

发明人： Ralph Murray Begun ,  Raymond Mathew Clemo ,  Karl Klaus Dittus ,  Vinod Kamath ,  Michael Sven Miller ,  Warren Everett Price ,  Whitcomb Randolph Scott, III

IPC分类号： G06F1/20 ,  H02P31/00

CPC分类号： G06F1/20 ,  H05K7/20209 ,  Y10S388/934

摘要： A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings.

摘要翻译： 一种包括底盘的系统，其包括多个模块和设置在所述底盘的远端中的风扇组件，用于通过所述多个模块的并行路径抽取空气。 至少一个模块是具有热传感器的计算模块，该热传感器设置成感测流过安装在母板上的处理器的空气的温度。 该系统还包括接收来自热传感器的输出的风扇控制器，其中风扇控制器操作风扇组件以冷却多个模块并将热传感器输出保持在工作温度范围内。 风扇控制器根据与在机箱中接收的计算模块之一相关联的预定热分布设置来控制风扇速度。 例如，预定的热分布设置可以包括最小风扇速度，最大风扇速度和控制回路反馈设置。

公开(公告)号：US20100101759A1

公开(公告)日：2010-04-29

申请号：US12256618

申请日：2008-10-23

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Robert E. SIMONS

IPC分类号： F28F7/00

CPC分类号： H05K7/20772 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.

摘要翻译： 提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。 该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。 电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。 该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。 当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。