-
公开(公告)号：US09107327B2
公开(公告)日：2015-08-11
申请号：US13551929
申请日：2012-07-18
CPC分类号： H05K7/20836 , G06F1/206
摘要： A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.
摘要翻译： 从数据中心去除热量的方法方面可以使用液体冷却剂冷却而不进行蒸气压缩制冷在液冷信息技术设备机架上。 该方法还可以包括通过使用基于数据中心的信息技术设备温度阈值的控制器装置通过一定范围的液体冷却剂流量来调节流向数据中心的液体冷却剂流。
-
2.发明申请THERMAL TRANSFER STRUCTURES COUPLING ELECTRONICS CARD(S) TO COOLANT-COOLED STRUCTURE(S) 有权热转印结构将电子卡耦合到冷却冷却结构（S）公开(公告)号：US20130343005A1
公开(公告)日：2013-12-26
申请号：US13527947
申请日：2012-06-20
申请人： Milnes P. DAVID , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Bejoy J. KOCHUPARAMBIL , Pritish R. PARIDA , Roger R. SCHMIDT , Mark E. STEINKE
发明人： Milnes P. DAVID , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Bejoy J. KOCHUPARAMBIL , Pritish R. PARIDA , Roger R. SCHMIDT , Mark E. STEINKE
CPC分类号： H05K7/20745 , H05K7/2079 , H05K13/00
摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。
-
公开(公告)号：US20130306292A1
公开(公告)日：2013-11-21
申请号：US13475348
申请日：2012-05-18
IPC分类号： F28F7/00
CPC分类号： H01L23/3672 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H05K7/20154 , H05K7/20509 , H01L2924/00
摘要： An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.
摘要翻译： 用于模块紧凑冷却的装置。 所述装置包括夹子，联接到所述夹子的第一侧的第一盖板，与所述夹子的与所述夹子的第一侧相对的所述夹子的第二侧连接的第二盖板，与所述第一盖板热耦合的第一框架 以及与第二盖板热耦合的第二框架。 第一框架和第二框架中的每一个可以包括用于分别使冷却剂通过第一框架和第二框架的多个通道。 此外，该装置还可以包括用于引导冷却剂穿过多个通道并用于阻止冷却剂沿着夹子的第一侧和夹子的第二侧流动的填料。
-
公开(公告)号：US09521787B2
公开(公告)日：2016-12-13
申请号：US13439433
申请日：2012-04-04
CPC分类号： H05K7/20836 , G06F1/206 , G06F1/3287 , G06F2200/201 , H05K7/20263 , H05K7/20272 , H05K7/20763 , H05K7/20772 , H05K7/2079 , Y02D10/16 , Y02D10/171
摘要： Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
摘要翻译： 用于冷却的系统和方法包括一个或多个计算结构，包括构造成选择性地向一个或多个计算结构提供液体冷却剂的阀的结构间液体冷却系统; 散热系统，其包括被配置为冷却液体冷却剂的一个或多个散热单元; 以及一个或多个液体至液体的热交换器，其包括构造成选择性地将热量从结构间液体冷却系统中的液体冷却剂传递到散热系统中的液体冷却剂的阀。 每个计算结构还包括一个或多个液冷服务器; 以及内部结构的液体冷却系统，其具有构造成选择性地向一个或多个液冷的服务器提供液体冷却剂的阀。
-
公开(公告)号：US09326429B2
公开(公告)日：2016-04-26
申请号：US13604850
申请日：2012-09-06
CPC分类号： H05K7/20772 , H05K7/20836
摘要： Cooling apparatuses are provided to facilitate active control of thermal and fluid dynamic performance of a coolant-cooled cold plate. The cooling apparatus includes the cold plate and a controller. The cold plate couples to one or more electronic components to be cooled, and includes an adjustable physical configuration. The controller dynamically varies the adjustable physical configuration of the cold plate based on a monitored variable associated with the cold plate or the electronic component(s) being cooled by the cold plate. By dynamically varying the physical configuration, the thermal and fluid dynamic performance of the cold plate are adjusted to, for example, optimally cool the electronic component(s), and at the same time, reduce cooling power consumption used in cooling the electronic component(s). The physical configuration can be adjusted by providing one or more adjustable plates within the cold plate, the positioning of which may be adjusted based on the monitored variable.
摘要翻译： 提供冷却装置以便于主动控制冷却剂冷却的冷板的热和流体动态性能。 冷却装置包括冷板和控制器。 冷板耦合到要冷却的一个或多个电子部件，并且包括可调节的物理结构。 控制器基于与冷板或由冷板冷却的电子部件相关联的监控变量来动态地改变冷板的可调节物理结构。 通过动态地改变物理结构，冷板的热和流体动态性能被调整为例如最佳地冷却电子部件，并且同时降低冷却电子部件所使用的冷却功率消耗（ s）。 可以通过在冷板内提供一个或多个可调节板来调节物理结构，其可根据所监视的变量来调整其位置。
-
公开(公告)号：US20140020418A1
公开(公告)日：2014-01-23
申请号：US13588260
申请日：2012-08-17
CPC分类号： H05K7/20836 , G06F1/206
摘要： A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.
摘要翻译： 数据中心冷却系统可以包括用于冷却没有蒸气压缩制冷的液体冷却剂的传热设备，并且液体冷却剂被用在容纳在数据中心中的液冷信息技术设备机架上。 该系统还可以包括控制器装置，其通过基于信息技术设备温度阈值的一系列液体冷却剂流量值来调节流向液体冷却的信息技术设备机架的液体冷却剂流。
-
7.发明申请公开(公告)号：US20130081781A1
公开(公告)日：2013-04-04
申请号：US13252888
申请日：2011-10-04
IPC分类号： F24J3/08
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20654 , H05K7/2079
摘要： A data center cooling system is operated in a first mode, and has an indoor portion wherein heat is absorbed from components in the data center by a heat transfer fluid, and an outdoor heat exchanger portion and a geothermal heat exchanger portion. The first mode includes ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and/or geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion. Based on an appropriate metric, a determination is made that a switch should be made from the first mode to a second mode; and, in response, the data center cooling system is switched to the second mode. The second mode is different than the first mode.
摘要翻译： 数据中心冷却系统以第一模式运行，并且具有通过传热流体和室外热交换器部分和地热换热器部分从数据中心的部件吸收热量的室内部分。 第一模式包括室外热交换器部分中的传热流体的环境空气冷却和/或地热换热器部分中的传热流体的地热冷却。 基于适当的度量，确定应当从第一模式到第二模式的开关; 并且作为响应，数据中心冷却系统被切换到第二模式。 第二模式与第一模式不同。
-
公开(公告)号：US20130014926A1
公开(公告)日：2013-01-17
申请号：US13184239
申请日：2011-07-15
IPC分类号： F28F27/00
CPC分类号： H05K7/20836 , F28D15/00 , H05K7/2079
摘要： A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid. It has a second heat transfer fluid freezing point lower than the first heat transfer fluid freezing point, and the second heat transfer fluid freezing point is sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.
摘要翻译： 数据中心冷却系统以第一模式运行; 其具有室内部分，其中热量从数据中心的部件吸收;以及室外热交换器部分，其中外部空气被用于冷却至少在室外热交换器部分中存在的第一传热流体（例如，水） 第一模式下的冷却系统。 第一传热流体是相对高性能的传热流体（与第二流体相比），并且具有第一传热流体凝固点。 确定已经达到适当的时间以从第一模式切换到第二模式。 基于该判定，与第一传热流体相比，数据冷却系统的室外热交换器部分切换为相对低性能的传热流体的第二传热流体。 其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度下降到与第一传热的第一预定关系时，第二传热流体凝固点足够低以在不冻结的情况下运行 流体凝固点。
-
公开(公告)号：US09445529B2
公开(公告)日：2016-09-13
申请号：US13479265
申请日：2012-05-23
CPC分类号： H05K7/2079 , H05K7/20836
摘要： Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.
摘要翻译： 获得了指定液冷数据中心的热设计方面的输入数据。 输入数据包括指示数据中心位置的环境室外温度的数据; 和/或表示数据中心的工作负载功耗的数据。 评估输入数据以获得数据中心热设计的性能。 性能包括冷却能量的使用; 和/或与数据中心相关联的一个相关温度。 输出数据中心散热设计的性能。
-
10.发明授权Coolant and ambient temperature control for chillerless liquid cooled data centers 有权冷却液和环境温度控制无冷却液体冷却数据中心公开(公告)号：US09250636B2
公开(公告)日：2016-02-02
申请号：US13439471
申请日：2012-04-04
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Robert E. Simons
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Robert E. Simons
CPC分类号： H05K7/20836 , F28F27/02 , G05D23/1932 , G06F1/206 , G06F2200/201 , Y02D10/16
摘要： Cooling control methods include measuring a temperature of air provided to a plurality of nodes by an air-to-liquid heat exchanger, measuring a temperature of at least one component of the plurality of nodes and finding a maximum component temperature across all such nodes, comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold, and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the plurality of nodes based on the comparisons.
摘要翻译： 冷却控制方法包括通过空气 - 液体热交换器测量提供给多个节点的空气的温度，测量多个节点中的至少一个部件的温度并且在所有这些节点之间找到最大分量温度，比较 将最大部件温度提高到第一和第二部件阈值，并将空气温度与第一和第二空气阈值进行比较，并且控制冷却剂流量和冷却剂流量的比例到空气到液体热交换器和多个节点 基于比较。
-
-
-
-
-
-
-
-
-
搜索结果
27 条记录 (耗时 0.013 秒)
